• 대한기계학회:학술대회논문집
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• 대한기계학회 2002년도 학술대회지
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• pp.725-728
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• 2002

A separate type thermosyphon can be utilized as a cooling device of electronic equipments (such as CPU of a personal computer or notebook). This study was carried out to investigate the cooling effect of separate type thermosyphon and to find the adequate parameters affecting the separate type thermosyphon. The heat transfer characteristics of separate type thermosyphon were obtained from experimental results. A $50{\times}50{\times}2 mm$ heat source was copied after CPU for the experiments. The results indicate that the device is capable of dissipating 60W of thermal energy and keeping the heat plate surface temperature under 50'E and the device can transfer heat from the evaporator to the condenser through natural circulation (without any external driving forces). Some transport phenomena of the working fluid and the heat transfer characteristics of the loop were observed in the experiments and are discussed in detail below.

• 설비공학논문집
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• 제12권10호
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• pp.894-900
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• 2000

The experimental study for performance improvement of aluminum/freon22 grooved heat pipe was carried out. Arterial wick was used for performance improvement of heat pipe. The experimental result was compared with screen covered grooved wick heat pipe. And also, performance test of grooved wick thermosyphon inserted straight wire in the center of grooved pipe was carried out. This result was compared with the performance test result of grooved wick thermosyphon. The operation limit of artery inserted grooved heat pipe was slightly extended, but thermal resistance of this heat pipe was twice as large as that of screen covered grooved heat pipe. In case of thermosyphon, the operation limit of grooved thermosyphon inserted straight wire in the center of grooved pipe was slightly extended, but thermal resistance was increased, comparing with that of the grooved thermosyphon.