• Composites Research
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• v.24 no.1
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• pp.31-36
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• 2011

Adhesive shear strengths of the established adhesives and the alternative adhesives were evaluated and their chemical structures were analyzed in order to investigate the possibility of replacing the established adhesives with the alternative adhesives applicable to the seeker for the guided missiles. Two types of the adhesives such as the structural adhesives and the sealant adhesives were considered. Those adhesives were exposed to the combined environmental factors consisting of temperature, moisture and ultraviolet over 1000 hours. Adhesive shear test was conducted to evaluate adhesive shear strengths and ATR FT-IR was utilized to investigate chemical structures. According to the results, the adhesive shear strengths of the alternative adhesives revealed higher than those of the established adhesives. Also the alternative adhesives were more stable to the combined environmental condition than the established adhesives. Therefore, it is found that the established adhesives were able to be replaced by the alternative adhesives.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4736-4741
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• 2014

This study examined PCB component cleaning on a PCB component surface, which has defects of precipitation type washing (existing rinse method), sealant and foreign material formed in the adhesive process that could not be removed easily. The spin jig was developed for PCB component cleaning, in which the PCB component settled down, to solve the conventional problem of the removal of foreign material with the centrifugal force by high speed rotation. The results are as follows. With decreasing fraction defect in PCB component washing, the development and substrate damage decreased by more than 80% according to the abstergent in the rotary type using the centrifugal force in the existing precipitation type. When the base plate showed a large difference with the time to include the process after washing the design using the existing method, easy attachment and separation of the PCB component could be possible. The washing time was enhanced 90% compared to the existing time. The reliability of the security and washing collaboration of the design and stability of the cleaning process could be secured so that there was no phenomenon of secession, the PCB component fixed for a cleansing rotation jig could maintain a fixed force by the centrifugal force. The stability and reliability of the washing process and the defective rate could be improved to less than 1%.