• Resources Recycling
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• v.21 no.4
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• pp.60-68
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• 2012

Silicon wafer for making semiconductor devices and solar cell is used in the semiconductor and solar industry, respectively. Silicon wafer is produced by cutting with silicon ingot and sludge contains silicon occurs from cutting process. Generation of silicon sludge is increasing on developing all industry sectors which have need of semiconductor device. These days it has been widely studied for the recycling technologies of the silicon sludge from view points of economy and efficiency. In this paper, patents and paper on the recycling technologies of the silicon sludge were analyzed. The range of search was limited in the open patents of USA (US), European Union (EU), Japan (JP), Korea (KR) and SCI journals from 1982 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

• Resources Recycling
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• v.17 no.4
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• pp.66-76
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• 2008

Silicon wafer is used in making semiconductor device of various forms in the semiconductor industry. Silicon wafer is produced by cutting silicon ingot and sludge containing silicon results from cutting process. The amount of silicon sludge is increasing owing to the usage of semiconductor device in many industry sectors. These days the recycling technologies of the waste silicon sludge has been widely studied from view point of economy and efficiency. In this study, patents on the recycling technologies of the waste silicon sludge were analyzed. The range of search was limited in the open patents of USA, European Union, Japan, and Korea up to september, 2007. Patents were collected using key-words and filtered by filtering criteria. The trend of the patents was analyzed by the years, countries, companies, and technologies.

• Ceramist
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• v.14 no.2
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• pp.20-28
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• 2011

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.67-71
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• 2003

Sawing silicon ingot with abrasive slurry generates sludge that includes abrasive powders, cutting oil, and silicon powders. The abrasive powders and cutting oil are being separated and reused. Mixing the remained stodged silicon powders with carbon powders and subsequent heat-treatment are conducted to produce silicon carbide. The size of SiC whiskers and powders was smaller than the conventionally grown silicon carbide whiskers that were synthesized by adding micron-size metal impurities. Impurity related mechanism is attributed to the formation of the silicon carbide whiskers, as metal impurities are contained in the stodged silicon powders.

• Journal of the Korea Organic Resources Recycling Association
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• v.32 no.1
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• pp.39-47
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• 2024

In this study, LiDAR-detective black material is synthesized by recycling silicon sludge (SS) that is generated from semiconductor manufacturing process, and its recognition is confirmed using two types of LiDAR sensors (MEMS and Rotating LiDAR). In detail, metal impurities on the surface of SS is removed, followed by coating of titanium dioxide (TiO₂) and subsequent chemical reduction to obtain SS-derived black TiO₂ (SS/bTiO₂) material. As-prepared SS/bTiO₂ is mixed with transparent paint to prepare hydrophilic black paints and applied to a glass substrate using a spray gun. SS/bTiO₂-based paint shows similar blackness (L^*=15.7) compared to commercial carbon black-based paint, and remarkable NIR reflectance (26.5R%, 905nm). Furthermore, MEMS and Rotating LiDAR have successfully detected the SS/bTiO₂-based paint. This is attributed to the occurrence of high reflection of light at the interface between the black TiO₂ and the silicon sludge according to the Fresnel's reflection principle. Hence, the new application field to effectively recycle silicon sludge generated in the semiconductor manufacturing process has been presented.

• Resources Recycling
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• v.26 no.6
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• pp.45-49
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• 2017

Most Waste slurry is produced in the process of silicon manufacturing for semiconductor industry, containing silicon (Si) and silicon carbide (SiC). Waste slurry is simply stored with solidifying by cement or buried. On the other hand, it was suggested in this study that the waste slurry should be used for heating source as supplementary material in steel making process. The waste slurry was refined and pulverized, which was recycled into SiC-based sludge briquette. Chemical composition for SiC-based sludge briquette was analyzed and the feature of heating source was observed in accordance with the injection time and input amount. As a result, SiC-based sludge briquette in terms of low cost and high efficiency had an effect on increasing liquid steel temperature in steel making plants.

• Journal of the Korean Recycled Construction Resources Institute
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• v.6 no.4
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• pp.275-282
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• 2018

This study examines the ways to address environmental issues by utilizing activated loess to reduce the amount of cements that emit a large amount of carbon dioxide during the process of manufacturing, and by reusing the polysilicon sludge produced as a result of manufacturing polysilicon, one of the components for solar power generation panels. The findings of the experiment showed that the optimal replacement ratio of the polysilicon sludge is 20%, 35% for W/B, and 20% for the ratio of the fine aggregate addition. As it is deemed that utilizing the polysilicon sludge for reinforced concrete may lead to rebar corrosion due to the $CI^-$ contained in the sludge, it can be considered to use for unreinforced concrete or bricks.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.187.2-187.2
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• 2011

태양광산업의 value chain중 up-stream쪽인 고순도 실리콘산업은 셀, 모듈, 시스템 쪽에 비하여 영업 이익률이나 부가가치 측면에서 매우 높은 성장성을 현재 보여주고 있으며 최근 원자력산업의 안전성 문제가 대두됨으로 인하여 태양광수요가 전 세계적으로 증대되는 경향을 나타내어 태양광용 실리콘의 수요가 확대됨과 아울러 spot시장에서의 가격 또한 상승하고 있다. 이런 관점에서 잉곳 및 웨이퍼 가공 중에 발생하는 고순도 실리콘 폐기물의 재활용 이 다시 주목받고 있다. 태양전지 웨이퍼(wafer)용 소재는 6N급 이상의 결정질 실리콘 잉곳(ingot)이 주를 이루며, 고효율의 셀을 제조하기 위해서 단결정 실리콘 잉곳이 많이 사용된다. 실리콘 단결정을 육성하는 방법에는 Floating zone 법, Czochralski 법, Bridgeman 법, CVD 등 매우 다양하다. 이 중 Czochralski 법은 전체 생산량의 대부분을 차지하고 있는 방법으로, 용융액에서 결정을 인상하여 ingot을 제작하는 방법이다. 그러나 대량의 전기에너지를 소비하여 제작되는 고순도의 실리콘 단결정 잉곳은 후 가공공정에서 그 절반 이상이 분말(powder) 및 슬러지(sludge)로 폐기되므로, 자원의 재활용 및 환경오염 측면에서 주요과제가 되고 있다. Czochralski 법으로 제작된 ingot의 경우 그 표면이 매끄럽지 못하여, 웨이퍼 단위의 가공 시 형태가 진원이 될 수 있도록 표면을 미리 연마(grinding)하는데, 이때에도 미세 분말이 다량 발생하게 된다. 본 연구에서는 이러한 고순도 단결정 실리콘 ingot의 연마 가공공정에서 발생한 미세 분말을 용해하여 보았다. 진공 챔버(chamber) 내부에 유도가열 코일과 냉도가니로 구성된 장비를 통해 전자기유도가열을 이용하여 실리콘 분말 폐기물을 용해하고, 그 시편을 ICP-MS 및 비저항 측정을 통해 분말 의 특성을 조사하여 재활용 가능성을 검토해 보았다.

• Journal of the Korea Organic Resources Recycling Association
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• v.31 no.3
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• pp.15-25
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• 2023

In this study, silicon sludge from semiconductor dicing process is recycled to fabricate silica nanoparticles, which are applied as dispersing materials for electro-responsive (ER) smart fluid. In specific, metal impurities are removed from silicon sludge by acid washing to obtain the high-purity silicon powder. And then, silica nanoparticles are synthesized by facile hydrothermal method employing the silicon powder as reactant material. To control the size of silica nanoparticles, the reaction time of hydrothermal method is varied as 8, 15, 20, and 30 hours are applied to control the size of silica nanoparticles. Sizes of silica nanoparticles are increased proportionally to the reaction time owing to the increased numbers of hydrolysis and condensation reactions. As-synthesized silica nanoparticles are prepared as electro-responsive smart fluids by dispersing into silicon oil. Silica nanoparticles synthesized by 30 hours of hydrothermal reaction (SiO₂-H30) exhibit the highest shear stress of 21.4 Pa under an applied electric field strength of 3.0kV mm^-1. Such enhancement in ER performance of SiO₂-H30 among various silica nanoparticles are attribute to the reinforcing effect originated from the mixed particle size, which allowing the formation of rigid chain-like structures. Accordingly, this study successfully propose a recycling method of silicon sludge to synthesize silica nanoparticles and their derived ER fluids, which may suggest new possibility to ESG management emphasizing the eco-friendliness.

• Resources Recycling
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• v.31 no.6
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• pp.60-65
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• 2022

This study presents the carburization process for recycling sludge, which was formed during silicon wafer machining. The sludge used in the carburization process is a mixture of silicon and silicon carbide (SiC) with iron as an impurity, which originates from the machine. Additionally, the sludge contains cutting oil, a fluid with high viscosity. Therefore, the sludge was dried before carburization to remove organic matter. The dried sludge was washed by acid cleaning to remove the iron impurity and subsequently carburized by heat treatment under vacuum to form the SiC powder. The ratio of silicon to SiC in the sludge was varied depending on the sources and thus carbon content was adjusted by the ratio. With increasing SiC content, the carbon content required for SiC formation increased. It was demonstrated that substoichiometric SiC_x (x<1) was easily formed when the carbon content was insufficient. Therefore, excess carbon is required to obtain a pure SiC phase. Moreover, size reduction by high-energy milling had a beneficial effect on the suppression of SiC_x, forming the pure SiC phase.