• Korean Journal of Culture and Social Issue
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• v.23 no.1
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• pp.75-96
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• 2017

The present research investigated the psychological nature of low levels of trust in Korean society and the role of family expansionism, a cultural psychological factor, in this phenomenon. Specifically, we examined the possibility that Koreans' distrust toward social system is, at least partially, due to high standards for trust, which might be closely related to Koreans' cultural characteristic of family expansionism. In Study 1, the relations between levels of family expansionism, trust standards, and actual levels of trust for parents, judiciary, and politicians were examined among 540 Korean adults. In Study 2, we manipulated levels of family expansionism to examine its effect on trust standards. Results showed that trust standards were higher for politicians than parents. Participants' trust standards for politics were unrealistically high, especially on the responsibility factor. Actual levels of trust for judiciary and politicians were low when the trust standards for these targets relative to trust standards for parents were high. Moreover, the trust standards and levels of trust for judiciary and politicians (relative to those for parents) were positively correlated to levels of family expansionism. In other words, higher levels of family expansionism were linked to higher trust standards and levels of distrust for judiciary and politicians. In addition, Study 2 results showed that trust standards became high when family expansionism was induced. Unlike previous studies which focused on causes of low levels of trust while assuming that Korean society itself is a low trust society, the present research investigated the underlying mechanism behind the seemingly low trust in Korean society.

• Journal of the Korea Society of Computer and Information
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• v.17 no.12
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• pp.187-198
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• 2012

International standard for software quality evaluation, ISO/IEC 9126 defines the quality characteristics and sub-characteristics consisting of quality of the software. Also, in this standard, the quality assessment items are presented in metrics based on maturity, fault tolerance, recoverability and compliance which are sub-characteristics of reliability. However, this reliability assessment items which are presented are not applied now due to the mathematical difficulties and the problems caused by collection of data. In order to resolve these problems, this study introduces measures to develop a specific test technique by quality attributes and to measure the quality. In other words, the detailed guidelines are presented to be utilized as a standard by summarizing test activities and techniques by each development life the most commonly used. The SW quality results are derived by assigning weights to software in order of the most important quality characteristics of respective software using checklist that can be easily utilized and applying test technique that can be utilized for detailed evaluation items and checklist. This improves problems that include reliability assessment item of ISO/IEC 9126 as the measures to measure new reliability quality of software.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.71-72
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• 1998

반도체 집적 공정의 발달로 차세대 소자용으로 30 A 이하의 극 박막 Si02 절연막이 요구되고 있으며, 현재 제품으로 50-70 A 두께의 절연막을 사용한 것이 발표되고 있다. 절연막의 두께가 앓아질수록 많은 문제가 발생할 수 있는데 그 예로 절연막의 breakdo때둥에 의한 신뢰성 특성의 악화, 절연막올 통한 direct tunneling leakage current, boron풍의 dopant 침투로 인한 소자 특성 ( (Threshold Voltage)의 불안, 전기적 stress하에서의 leakage current증가와 c charge-trap 및 피terface s쩌.te의 생성으로 인한 소자 특성의 변화 둥으로 요약 된다. 절연막의 특성올 개선하기 위해 여러 가지 새로운 공정들이 제안되었다. 그 예로, Nitrogen올 Si/Si02 계면에 doping하여 절연막의 특성을 개선하는 방법 으로 고온 열처 리 를 NH3, N20, NO 분위 기 에서 실시 하거 나, polysilicon 또는 s silicon 기판에 nitrogen올 이온 주입하여 열처리 하는 방법, 그리고 Plasma분 위기에서 Nitrogen 함유 Gas를 이용하여 nitrogen을 doping시키는 방법 둥이 연구되고 있다. 또한 Oxide cleaning 후 상온에서 성장되는 oxide를 최소화 하여 절연막의 특성올 개선하기 위하여 LOAD-LOCK을 이용하는 방법, C뼈피ng 공정의 개선올 통한 contamination 감소와 silicon surface roughness 감소 로 oxide 신뢰성올 개선하는 방법 둥이 있다. 구조적 인 측면 에 서 는 Polysilicon 의 g없n size 를 최 적 화하여 OxideIPolysilicon 의 계면 특성올 개선하는 연구와 Isolation및 Gate ETCH공정이 절연막의 특성에 미 치 는 영 향도 많이 연구되 고 있다 .. Plasma damage 가 Oxide 에 미 치 는 효과 를 제어하는 방법과 Deuterium열처리 퉁올 이용하여 Hot electron Stress하에서 의 MOS 소자의 Si/Si02 계면의 신뢰성을 개선하고 있다. 또한 극 박막 전연막의 신뢰성 특성올 통계적 분석올 통하여 사용 가능한 수명 올 예 측 하는 방법 과 Direct Tunneling Leakage current 를 고려 한 허 용 가농 한 동작 전 압 예측 및 Stress Induced Leakage Current 둥에 관해서 도 최 근 활발 한 연구가 진행되고 있다.

• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.239-246
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• 2004

Accelerated degradation test (ADT) can be a useful tool for assessing the reliability when few or even no failure are expected in an accelerated life test. In this paper, MLCC (Multilayer Ceramic Capacitors), a sort of passive components which have large capacitance(X7R -55$^{\circ}C$~1$25^{\circ}C$) have been tested, and least-square analyses are used to illustrate our approach in which amount of degradation of a DUT following log-normal distribution. We assumed a simple and useful linear model to describe the amount of degradation over time subjected to different voltage levels applied. Tests for linearity of the performance-time relationship, and provide tests for how well the assumptions hold. Also, by using Eyring Model, MLCC's mean life time is assessed.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2009.04a
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• pp.97-100
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• 2009

신뢰성 분석은 불확실성으로 인한 제품의 성능 변동을 안전확률이나 파괴확률로 정량화 하여 설계에 이용하기 위해 연구되어 왔다. 불확실성은, 데이터의 양에 따라-물질의 본질적인 특성으로서의 많은 데이터가 주어진 경우의 물리적 불확실성과 부족한 데이터에서의 인식론적 불확실성으로 구분되고, 불확실성을 갖는 대상에 따라-입력변수 및 근사모델 불확실성으로 구분된다. 물리적 불확실성에 대한 연구는 많이 진행되어 왔지만, 실제 산업현장에는 부족한 데이터로 인한 인식론적 불확실성이 지배적이며 이에 대한 연구는 최근에서야 진행되고 있다. 불확실성을 고려하는 신뢰성 기반 설계에는 효율성을 위해 실제모델을 대체하는 근사모델이 이용되는데, 근사모델법 자체에 대한 연구는 많이 진행되어 왔으나, 근사모델 이기 때문에 존재하는 불확실성을 고려한 연구는 최근에서야 연구되기 시작하였다. 본 연구에서는 베이지안 접근법에 기반하여 입력변수 및 근사모델 불확실성을 통합 고려하는 새로운 신뢰성 분석 기법을 제시하고 수치예제를 통해 타당성을 증명한 후, 이를 공학문제에 적용한다.

• Journal of the Society of Naval Architects of Korea
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• v.33 no.2
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• pp.96-110
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• 1996

Aging ships can suffer structural damage due to corrosion, fatigue crack etc., and possibility of catastrophic failure of seriously damaged ships is very high. To reduce the risk of loss of ships due to hull collapse, it is essential to evaluate ultimate hull strength of aging ships taking into account various uncertainties associated with structural damages. In this paper, ultimate strength-based reliability analysis of ship structures considering wear of structural members due to corrosion is described. A corrosion rate estimate model for structural members is introduced. An ultimate limit state function of a ship hull is formulated taking into account corrosion effects. The model is applied to an existing oil tanker, and reliability index associated with hull collapse is calculated by using the second-order reliability method (SORM). Discussions on structure safety of corroded ships are made.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.51-63
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• 1999

The effects of high filler loading technique on the reliability of epoxy molding compound (EMC) as a microelectronic encapsulant was investigated. The method of high filler loading was established by the improvement of maximum packing fraction using the simplified packing model proposed by Ouchiyama, et al. With the maximum packing fraction of filler, the viscosity of EMC wart lowered and the flowability was improved. As the amount of filler in EMC increased, several properties such as internal stress and moisture absorption were improved. However, the adhesive strength with the alloy 42 leadframe decreased when the filler content was beyond the critical value. It was found that the appropriate content of filler was important to improve the reilability of EMC, and the optimum filler combination should be selected to obtain high reliable EMC filled with high volume fraction of filler.

• Journal of the Society of Naval Architects of Korea
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• v.29 no.2
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• pp.103-114
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• 1992

A study result of buckling reliability is presented for the axially compressed imperfect elastic cylinder. Multi-mode analysis program is developed from Karman-Donnell Equation for the calculation of the buckling load of the cylindrical she1l. Geometric intial imperfection is approximated by double Fourier series of which coefficients are assumed random variables with jointly normal distribution characteristics. Crude Monte Carlo simulation technique is used to calculate the probabilistic failure properties of several cases with various imperfection Conditions.

• Proceedings of the Safety Management and Science Conference
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• 2005.05a
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• pp.267-271
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• 2005

도시철도시스템은 차량, 전력, 신호, 선로구축물 등이 유기적으로 결합된 복합시스템으로 고장 또는 사고가 발생하면 원인규명이 어렵고 사고에 따른 영향이 매우 크기 때문에 시스템의 신뢰성과 안전성은 매우 중요하다. 본 논문에서는 철도에서 적용되고 있는 신뢰성관련 국제 규격을 분석하여 국내에서 개발하고 있는 무인운전 도시철도시스템에 이러한 규격들의 내용들을 충족하는 관리체계를 제시하고자 한다. 즉 기존에 적용하고 있는 신뢰성 관리체계인 IEC 60300, IEC 62278, MIL-STD-785B 등의 특성과 장점을 비교분석하여 도시철도시스템에 구체적으로 적용할 수 있는 신뢰성관리체계를 제시하고자 한다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.12
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• pp.27-34
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• 2005

We have investigated the correlation between the active-layer uniformity and reliability of InGaN/GaN blue LEDs. According to initial characteristics, the devices are classified into two groups: group I devices of uniform light-emission and group II devices of non-uniform light-emission. The group II devices are more dependent on temperature and we have found two degradation mechanisms through reliability test. One is bulk degradation in which the degradation occurred over the entire chip and another one is edge degradation in which the degradation occurred from the edge of the chip. Bulk degradation caused by the nonradiative defects is found to be faster in group II devices while there is no difference in the rate of the much faster edge degradation, where darkening starts from the n-Ohmic contact edge. Therefore, more uniform active layer, more uniform current spreading, and the passivation of the dry-etched side-wall are essential for the high reliability of InGaN/GaN LEDs.