• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2014.11a
• /
• pp.135-135
• /
• 2014

폴리이미드 필름 위에 습식도금으로 형성된 구리피막에서 시효처리 시간에 따른 박리강도의 변화를 실험적으로 확인하였다. 그 결과, 시효처리 4시간까지 큰 변화가 없다가 4시간부터 10시간 사이에서 급격히 증가하는 경향을 나타내었다. 시효처리 시간에 따른 박리강도 증가의 원인을 구리-폴리이미드 사이 계면 및 구리도금 피막 자체의 특성 변화의 관점에서 해석하였다.

• Korean Journal of Materials Research
• /
• v.7 no.9
• /
• pp.789-794
• /
• 1997

7050AI합금의 미세조직 및 기계적성질에 미치는 2단시효처리의 영향을 투과전자현미경, 열분석, 경도시험 및 인장 시험을 통하여 조사하였다. 12$0^{\circ}C$에서 6시간 1차 시효처리한 후 1$65^{\circ}C$와 175$^{\circ}C$에서 2차 시효처리하였을때 1$65^{\circ}C$에서는 6시간 시효시 최대경도값 201.3Hv를 나타내었고, 175$^{\circ}C$에서는 3시간 시효처리하였을때 최대경도값 197Hv를 나타내었다.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.4
• /
• pp.15-20
• /
• 2007

Growth kinetics of intermetallic compound (IMC) at various interface in Cu pillar bump during aging have been studied by thermal aging at 120, 150 and $165^{\circ}C$ for 300h. In result, $Cu_6Sn_5\;and\;Cu_3Sn$ were observed in the Cu pillar/SnPb interface and IMC growth followed parabolic law with increasing aging temperatures and time. Also, growth kinetics of IMC layer was faster for higher aging temperature with time. Kirkendall void formed at interface between Cu pillar and $Cu_3Sn$ as well as within the $Cu_3Sn$ layer and propagated with increasing time. $(Cu,Ni)_6Sn_5$ formed at interface between SnPb and Ni(P) after reflow and thickness change of $(Cu,Ni)_6Sn_5$ didn't observe with aging time. The apparent activation energies for growth of total $(Cu_6Sn_5+Cu_3Sn),\;Cu_6Sn_5\;and\;Cu_3Sn$ intermetallics from measurement of the IMC thickness with thermal aging temperature and time were 1.53, 1.84 and 0.81 eV, respectively.

• Proceedings of the KAIS Fall Conference
• /
• 2000.10a
• /
• pp.34-35
• /
• 2000

용접기의 전극에 사용되는 크롬동합금은 일반적으로 높은 전기전도도와 고온강도가 요구되어진다. 크롬동합금은 대표적인 시효경화합금으로 용체화처리와 시효처리를 통하여 최적의 성질들이 얻어진다. 본 연구에서는 Cu-0.6wt%Cr, Cu-1.2wt%Cr 합금을 이용하여 용체화처리온도, 시효처리온도 및 시간 등을 변화시켜 실험하였다. 각 열처리에 따른 전기전도도와 경도를 측정하고 미세구조를 조사하여 최적의 공정조건을 구하였다. Cr이 적은 Cu-0.6wt%Cr 합금이 경도의 큰 감소없이 더 높은 전기전도도를 나타내었다.

• The Journal of the Acoustical Society of Korea
• /
• v.5 no.2
• /
• pp.29-38
• /
• 1986

본 논문은 분극처리된 PZT 압전 세라믹 소자의 물리, 음향학적 제 특성이 시간의 함수로 나타 나는 시효현상을 다루고 있다. SrCO\sub 3\, NiO 및 Fe\sub 2\O\sub 3\를 소량 첨가하여 직접 제조한 PZT 세라믹은 분극처리 후, f\sub r\ 은 증가하는 시효현상을 보여주었다. 시효현상 기구의 이해를 위하 여 이중 포텐샬우물 모델을 이용하였으며, 외부에서 가한 응력, 역방향 전장 및 온도상승에 따라 분극현 상을 나타내었다. 시효현상의 주 원인은 분극처리시 전장 방향으로 분역들이 정렬되면서 내부에 저장되 었던 잔유응력의 이완에 의한 분역계면의 운동에 있음을 간접적으로 확인하였다. 이러한 분역계면의 운 동은 열적 활성화 에너지를 갖는 시간에 의존하는 운동으로써 분극의 감소를 유발하며, 이것이 시효현 상으로 나타나는 것으로 사료된다.

• Journal of Korea Foundry Society
• /
• v.38 no.5
• /
• pp.103-110
• /
• 2018

The effects of a heat treatment on the carbide formation behavior and mechanical properties of the cobalt-based superalloy X-45 were investigated here. Coarse primary carbides formed in the interdendritic region in the as-cast specimen, along with the precipitation of fine secondary carbides in the vicinity of the primary carbides. Most of the carbides formed in the interdendritic region were dissolved into the matrix by a solution treatment at $1274^{\circ}C$. Solutionizing at $1150^{\circ}C$ led to the dissolution of some carbides at the grain boundaries, though this also caused the precipitation of fine carbides in the vicinity of coarse primary carbides. A solution treatment followed by an aging treatment at $927^{\circ}C$ led to the precipitation of fine secondary carbides in the interdendritic region. Very fine carbides were precipitated in the dendritic region by an aging heat treatment at $927^{\circ}C$ and $982^{\circ}C$ without a solution treatment. The hardness value of the alloy solutionized at $1150^{\circ}C$ was somewhat higher than that in the as-cast condition; however, various aging treatments did not strongly influence the hardness value. The specimens as-cast and aged at $927^{\circ}C$ showed the highest hardness values, though they were not significantly affected by the aging time. The specimens aged only at $982^{\circ}C$ showed outstanding tensile and creep properties. Thermal exposure at high temperatures for 8000 hours led to the precipitation of carbide at the center of the dendrite region and an improvement of the creep rupture lifetimes.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.37-42
• /
• 2001

The concerns of the toxicity and health hazard of lead in solders have demanded the research to find suitable lead-free solder alloys. It was discussed that effect of the intermetallic formation and structure on the reliability of solder joints. In this study, lead-free solder alloys with compositions of Sn/3.5Ag/0.75Cu, Sn/2.0Ag/0.5Cu/2.0Bi were applied to the 48 $\mu$BGA packages. Also, the lead-free solder alloys compared with eutectic Sn/37Pb solder using shear test under various aging temperature. Common $\mu$BGA with solder components was aged at $130^{\circ}C$, $150^{\circ}C$ and $170^{\circ}C$. And the each temperature applied to 300, 600 and 900 hours. The thickness of the intermetallics was measured for each condition and the activation energy for their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS (Energy Dispersive Spectroscopy). These results for reliability of lead-free interconnections are discussed.

• Journal of Korean Society of Steel Construction
• /
• v.9 no.4 s.33
• /
• pp.515-521
• /
• 1997

The effects of heat treatment and fiber orientation on tensile strength and fatigue behavior were studied in a continuously reinforced. magnesium-based composite Following an earlier TEM investigation, specimens were thermally aged to modified the interfacial zone between the alumina fibers and the magnesium alloy matrix. From the tensile experimental results, the ultimate tensile strength of the aged specimens were lower than that of the as-fabricated due to weak fiber-matrix interfacial strength with chemical reaction during the thermal processing. The fatigue crack growth experiments were conducted with specimens having the fiber orientation normal to the crack growth direction (longitudinal) and also specimens with the fibers oriented parallel to the crack growth direction(transverse). A comparison of the fatigue crack growth behavior indicates that aged longitudinal specimens are more resistant to fatigue crack growth the as-fabricated longitudinal specimens. Conversely, as-fabricated transverse specimens are more resistant to fatigue crack growth than aged transverse specimens.

• Korean Journal of Materials Research
• /
• v.7 no.1
• /
• pp.50-56
• /
• 1997

급냉응고법을 이용하여 고용한도 이상으로 Mn량을 첨가할 때 Mn량에 따른 인장특성의 변화와 시효특성을 조사하였다. 원심분무법으로 AI-4.7%Zn-2.5%Mg-0.2%Zr합금에 Mn량을 각기 달리 첨가한 급냉응고 분말을 제조 하였다. 이 분말을 냉간압축, 진공 탈가스처리를 한 후 15:1로 압출하여 봉상 시편을 만들었다. 분말의 미세조직은 $\alpha$-AI수지상과 수지상간 편석부로 이루어져 있으며 Mn첨가에 따라 조직의 변화는 관찰되지 않았다. 빠른 냉각속도로 인하여 2.0%Mn을 첨가한 경우에도 초정 Mn상을 발견할 수 없었다. 압출재의 미세조직은 아결정립으로 이루어져 있으며 약간의 제2상들이 관찰되었다. 대부분의 Mn 분산상은 압출후 용체화처리 과정에서 형성되었으며 시효경화량은 Mn양에 관계없이 일정하였다. 46$0^{\circ}C$에서 1시간 용체화처리하고 12$0^{\circ}C$에서 24시간 시효처리한 경우 최대의 시효경도값을 나타내었다. 인장강도는 Mn첨가량에 따라 증가 하였는데 이것은 Mn분산상의 밀도증가에 의한 것으로 확인되었다. 2.0%Mn을 첨가한 합금의 시효후 인장강도는 590MPa, 연산율은 4%를 보였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.1
• /
• pp.35-41
• /
• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.