• Journal of the Semiconductor & Display Technology
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• v.2 no.1
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• pp.15-19
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• 2003

Spin etcher can process frontside and backside on the wafer, which is used for etching, stripping, cleaning and wafer reclamation. A new generation of spin etchers has been designed to meet 300mm wafer processing. The larger header and higher spin speed make vibration problem a severe problem in developing equipments. This study shows schematic process of solving practical vibration problems, where it is required to analyze the principal ca uses of vibration problem and find out the method of vibration reduction in spin etcher. The vibration under normal operation is measured in time domain and is analyzed in frequency domain. And modal parameters are obtained through modal test. Using the modal parameters from experiments, the model of finite element method is formulated. From diagnosis using many measurements and analyses, it can be shown that main cause of vibration is unbalance of head.