• 베이커리
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• no.2 s.379
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• pp.145-148
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• 2000

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.

• Cartoon and Animation Studies
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• s.41
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• pp.57-73
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• 2015

A pose is an important component in the animation with timing and spacing. Pose is the key to describe the story-telling or how the animation behavior. Key animation method is Straight Ahead and pose to pose method. Many animaters have been using these two methods, or by a mix of two ways. It is possible that computer animation make a pose using interpolation between keyframes. The many animators of computer animation are using pose to pose in their work. It is depend on good and strong pose that make audience understand a story or a situation. This makes animators to be efficient of inefficient operation. In this study, according to the effective good pose to catch proposes four ways. There are four methods of making pose that are stretch and squash, the height of the character, the center of weight, step. The law of 12 kinds of Disney Animation is a good reference for the study.