• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.169-172
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• 2000

In this paper, an OMM (On-the-Machine Measuring) system has been developed, which can perform measuring and inspection of sculptured surfaces of die and mold, by use of a scanning-type touch probe mounted into the spindle of a NC machine. The calibration procedures of a scanning prove (SP2-1, Renishaw) and an algorithm for measuring surface points by a ball-nosed stylus have been studied. The system has been developed based on commercial CAM software (Z-Master 2000), and tested through measuring a plastic injection molding-die. Also some experimental results of the calibration and measuring for given surface positions are analyzed to verify its accuracy and reliability.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.10
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• pp.71-77
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• 1996

This paper describes the development of on the machine measuring(OMM) system which can directlry measure the three dimensional machined dimensilnal accuracy using scanning probe in milling machine. Two algolithms, continuous path(CP) measurement using UC program and CAD data assisted point to point(PTP) measurement, were developed regarding specification of scanning probe. The OMM system was contructed to verify the developed system suing the proposed algorithm, and actually measured three kinds of machined TV shadow mask molds. The developed system was evaluated it's repeatability and compared with the current measurement system of CMM(Coording Measuring Machine) in terms of relative accuracy and time reduction and productivity increase.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1631-1636
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• 2010

In this study, we demonstrate a nano-scale lithograph obtained on localized (100) silicon (p-type) surface using by modified AFM (Atomic force microscope) apparatuses and by adopting controlling methods. AFM-based experimental apparatuses are connected to a customized pulse generator that supplies electricity between the conductive tip and the silicon surface, while maintaining a constant humidity throughout the lithography process. The pulse durations are controlled according to various experimental conditions. The electrochemical reaction induced by the pulses occurs in the gap between the conductive tip and silicon surface and result in the formation of nanoscale oxide particles. Oxide particles with various heights and widths can be created by AFM surface modification; the size of the oxide particle depends on the pulse durations and the applied electrical conditions under a humid environment.