• Proceedings of the KAIS Fall Conference
• /
• 2009.05a
• /
• pp.372-375
• /
• 2009

반도체 봉지재란 실리콘 칩, 골드와이어, 리드프레임 등의 반도체 소지를 열, 수분, 충격으로부터 보호하기 위해 밀봉하는 재료로서 EMC(Epoxy Moding Compound)가 가장 많이 쓰인다. EMC는 기계적, 전기적 성능향상을 위한 무기재료로 실리카(Silica), 열에 의해 경화되어 3차원 경화구조를 형성하는 에폭시수지, 빠른 경화특성을 부여하기 위한 경화제로서의 페놀수지, 유기재료와 무기재료 사이의 결합력을 높이기 위해 커플링제, 카본블랙, 이형성 확보를 위한 왁스(Wax), 착색제(Colorant), 난연제(Flame Retardant)등의 첨가제로 구성되는 복합소재로써 본 연구에서는 에폭시의 유형에 따른 용융 실리카를 주충진재로 하여 각각의 봉지재의 첨가제를 기준으로 할 때 다양한 형태의 친환경 비할로겐계 반응형 난연제를 합성하는 기술을 개발하고 비 할로겐계 및 Sb 계 첨가형 난연제의 혼용 배합을 통해 친환경 EMC용 난연제의 제조기술을 개발하였다. 이들 EMC의 요구특성은 요구특성은 외부환경으로부터 칩 보호, 칩을 전기적으로 절연특성 유지, 칩의 작동시 발생되는 열의 효과적인 방출 특성 유지, 실장(Board Mounting)의 간편성 특성을 확보해야 하는 특성을 지니고 있어 이들 요구특성에 적합한 특성조사가 함께 이루어졌다.

• Journal of Adhesion and Interface
• /
• v.12 no.4
• /
• pp.138-143
• /
• 2011

Recently epoxy resin compositions having backbone of novolac derivatives with biphenylene compounds have been used as materials of eco-freindly EMC (Epoxy Molding Compound), because the cured epoxy resin compositions show the self-extinguishing without flame retardant additives. In this study, epoxy resin compositions were prepared and cured using novolac derivateves with biphenylene. Their propeties - structures of phenol derivatives and reactivity, thermal expansion, modulus, and thermal degradation - were obtained by DSC, DMA, TMA, TGA method. When both epoxy resin and hardenr had the biphenyl novolac structure, epoxy resin compositions showed low thermal expansion, good mechanical property, and combustion retardation.

• Applied Chemistry for Engineering
• /
• v.1 no.2
• /
• pp.124-132
• /
• 1990

In order to improve the mechanical properties and fracture toughness of HPT 1071/DDS system, poly(aryl etherimide) (PEI) was incorporated in the resin system. In HPT 1071/DDS system, mechanical properties of cured epoxy resins were not strongly dependent on the concentration of DDS curing agent strongly. In the case of HPT 1071/DDS/PEI system, the fracture toughness and flexural properties of epoxy resins increased with increasing the concentration of PEI. SEM micrographs of cured epoxy resin indicated that the phase separation occured at the low concentration of PEI in this system. In addition, investigation of the relationship between mechanical properties and the morphology of modified epoxy resin was undertaken in HPT 1071/DDS/PEI system.

• Korean Journal of Materials Research
• /
• v.3 no.5
• /
• pp.514-520
• /
• 1993

In this paper the cure cycle of carbon fiber/phenolic resin was investigated by the Taguchi Method in an experimental design. Experiments were systematically performed using $L_{18}(2^1 \times 3_7)$ orthorgonal array table of the experimental design. In the experimental design, eight compression molding parameters (heating rate, pressing temperature, pressing rate, molding pressure, curing temperature, dwell time at curing temperature, cooling rate and degassing) were considered and the effects of the parameters on the flexural strength and the apparent porosity of carbon fiber/phenolic composites were investigated. The analysis of variance for the experimental results indicated that molding pressure and curing temperature are the most significant parmeters in the flexural strength and the apparent porosity of carbon fiber/phenolic resin composites, respectively.

• Journal of the Korean Applied Science and Technology
• /
• v.29 no.2
• /
• pp.317-322
• /
• 2012

The microstructures were examined by SEM, FT-IR spectra, tensible properties mole % of [NCO/OH], and particle size analyzer. Growing concerns in the environment-friendly industries have led to the development of solvent-free formulations that can be cured. We had synthesized the polyurethane resin having the ability to protect stainless steel against corrosion. Compared with general packing materials and coatings, this resin is highly stronger in intensity and longer durability. Polyurethane resins were composed of polyols, IPDI, silicone surfactant, catalyst and crosslink agent. Moreover, thermal fillers such as $Al_2O_3$, fume silica and $ZrO_2$ not only accelerated the curing rate but also improved the physical property as thermal barriers. The rigid segments of polyurethane in mechanical properties were due to crosslink agent and the increase of [NCO/OH]. In conclusion, the polyurethane microstructure with crosslink agent can be good material for themoset coating of metal substrates such as stainless steel.

• Journal of the Korean Ceramic Society
• /
• v.38 no.7
• /
• pp.643-647
• /
• 2001

퓨란수지로부터 유리질 탄소를 제조하였다. 유리질 탄소의 제조시, 사용된 수지가 경화 및 탄화 단계에서 많은 양의 가스를 방출하면서 큰 수축이 발생하여 크랙을 형성하고 휨 현상을 일으킨다. 이런 현상을 감소시키기 위하여 본 실험에서는 경화단계에서 압력을 가하고, 가열속도를 매우 느리게 하였다. 또한, 경화단계에서 무게감소와 수축율을 억제하고, 발생하는 가스의 배출을 용이하게 하여 궁극적으로는 시편의 크랙 및 휨 현상을 방지하고자 필러와 알콜을 첨가하였다. 그 결과, 무게감소와 수축을 억제하고 밀도의 증가를 가져왔고 유리질 탄소를 용이하게 제조할 수 있었으나 알코올을 첨가한 경우 필러의 양이 증가할수록 높은 비저항 값과 낮은 강도값을 나타내었다. 이런 현상은 알코올이 경화단계에서 분해 증발하면서 미세한 기포를 형성하고 이것들이 기공으로 전이하여 최종 제품에까지 영향을 주었기 때문이다.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1220-1223
• /
• 2003

The UV nanoimprint technology uses the UV light as the energy source. Because the imprint process is carried out in room temperature and low pressure, this technology has its own merits compared to the thermal nanoimprint. However, in UV nanoimprint technology, a resin which has low viscosity is essential for the improvement of accuracy. In this research, a resin (named as IMS01) which has relatively low viscosity was developed. And a measurement system was developed in order to measure the degree of cure of the resin. The measurement system which is composed of FT-IR, UV light source and optical guide can measure the degree of cure in real time. From the experimental results, it was found that the IMS01 is cured more rapidly than existing resin (PAK01).

• Journal of the Korean Chemical Society
• /
• v.47 no.3
• /
• pp.250-256
• /
• 2003

In this work, the effect of cationic initiator content on the electron-beam (EB) curing process of diglycidylether of bisphenol-A (DGEBA) resin was studied using near-infrared spectroscopy (NIRS), thermogravimetric analysis (TGA), and critical stress intensity factor $(K_{IC})$. Benzylquinoxalinium hexafluoroantimonate (BQH) were used as an initiator and its content was varied from 0.5 to 3 phr. NIRS measurements showed that the hydroxyl group of EB-cured epoxy resin was increased with increasing the BQH content. Thermal stability and $K_{IC}$ value of EB-cured epoxy resin were increased with increasing the BQH content but were decreased above 2 phr content. These results could be attributed to the decrease of the conversion and degree of crosslinking. In another word, the conversion and degree of crosslinking were restricted by the incomplete network structure from high reactivity at the BQH content above 2 phr, resulting in decreasings of thermal stability and $K_{IC}$.

• 프린팅코리아
• /
• s.45
• /
• pp.82-85
• /
• 2006

남보다 앞서기 위해서 노력하는 한 기업이 있다. 누구보다 앞서 설비투자를 해나가고, 끊임없는 개발로 뛰어난 기술력을 보유하고 있는 곳, 그러나 진정한 힘은 파트너쉽에서 나온다고 말하는 기업, (주)경화가 바로 그곳이다.

• Clean Technology
• /
• v.23 no.4
• /
• pp.378-387
• /
• 2017

To obtain epoxy resin with permanently attached flame-retardant groups, phosphorus compound containing di-hydroxyl group [10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phospha phenanthrene-10-oxide, DOPO-HQ] and silicone compound containing di-hydroxyl group (polydimethylsiloxane, hydroxyl terminated, PDMS) were reacted with uncured epoxy prepolymer (diglycidyl ether of bisphenol A, DGEBA) and then cured using 4,4-diaminodiphenylmethane (DDM) as a crosslinking agent. The properties of the resulting epoxy materials were characterized using Fourier transform infrared (FTIR) spectrometer, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), limiting oxygen index (LOI) test/vertical burning test (UL 94-V test), tensile properties test and impact test. This study examined the effect of phosphorus/silicone compound contents on the thermal/mechanical properties and flame retardancy of cured epoxy resins containing phosphorus and silicone compounds. It was found that the thermal/mechanical properties of epoxy resins containing phosphorus and silicone components were higher than those of simple epoxy resin. The flame-retardancy (LOI: 29.9 ~ 31.8% and UL 94-V: V-0) of all samples containing phosphorus compound and phosphrous compound/silicone compound was found to be passed the flame-retardant requirements (LOI: > 30%, UL 94-V: V-0) of LOI and vertical burning tests. However, the flame-retardancy (LOI: 21.4% and UL 94-V: no rating) of simple epoxy resin was found to be failed the flame-retardant requirements.