• Title/Summary/Keyword: 수동 연결 블록

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Implementation of Functional Blocks of Modular Toy for Creative Education (창의적 교육을 위한 모듈형 완구의 기능 블록 구현)

  • Kim, Jong-Tae;Park, Ji-Youp;Lee, Bo-Hee
    • Journal of Convergence for Information Technology
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    • v.7 no.5
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    • pp.95-102
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    • 2017
  • Modular toys for creative education require functional blocks to create various types of movements. An active drive module and a lot of passive connection blocks are needed to express motion with combination. In this paper, we propose the design of modular toys to produce various creative movements and controller structure working with them. In order to facilitate the connection between the designed modules, a connection method and a suitable mechanism are suggested. We also dealt with the design of various types of sensor modules that can work in conjunction with modular toys. Using these toys, typical standard application form that can be imitated educationally is suggested and showed the usefulness of the modular toy by actually applying it with designed modules and components. The proposed method is applied to actual educational toys, and the operation is effectively performed by recording operation and playing repetitive operation.

Improving Stability and Characteristic of Circuit and Structure with the Ceramic Process Variable of Dualband Antenna Switch Module (Dual band Antenna Switch Module의 LTCC 공정변수에 따른 안정성 및 특성 개선에 관한 연구)

  • Lee Joong-Keun;Yoo Joshua;Yoo Myung-Jae;Lee Woo-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.2 s.35
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    • pp.105-109
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    • 2005
  • A compact antenna switch module for GSM/DCS dual band applications based on multilayer low temperature co-fired ceramic (LTCC) substrate is presented. Its size is $4.5{\times}3.2{\times}0.8 mm^3$ and insertion loss is lower than 1.0 dB at Rx mode and 1.2 dB at Tx mode. To verify the stability of the developed module to the process window, each block that is diplexer, LPF's and bias circuit is measured by probing method in the variation with the thickness of ceramic layer and the correlation between each block is quantified by calculating the VSWR In the mean while, two types of bias circuits -lumped and distributed - are compared. The measurement of each block and the calculation of VSWR give good information on the behavior of full module. The reaction of diplexer to the thickness is similar to those of LPF's and bias circuit, which means good relative matching and low value of VSWR, so total insertion loss is maintained in quite wide range of the thickness of ceramic layer at both band. And lumped type bias circuit has smaller insertion itself and better correspondence with other circuit than distributed stripline structure. Evaluated ceramic module adopting lumped type bias circuit has low insertion loss and wider stability region of thickness over than 6um and this can be suitable for the mass production. Stability characterization by probing method can be applied widely to the development of ceramic modules with embedded passives in them.

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