• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.161-164
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• 2001

• Proceedings of the KWS Conference
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• 1998.10a
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• pp.141-142
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• 1998

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.239-242
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.34-34
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.11a
• /
• pp.51-51
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• 2004

• Proceedings of the KWS Conference
• /
• 2001.05a
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• pp.273-276
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• 2001

• Proceedings of the KWS Conference
• /
• 2001.05a
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• pp.268-270
• /
• 2001

• Proceedings of the KWS Conference
• /
• 2001.10a
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• pp.156-158
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.105-105
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• 2002

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.31-36
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• 2012

In this study, the complex vibration reliability of Sn-3.5Ag and Sn-0.7Cu having a high melting temperature was investigated. For manufacturing of BGA test samples, Sn-3.5Ag and Sn-0.7Cu balls were joined on BGA chips finished by ENIG and the chips were mounted on PCB finished OSP by using reflow process. For measuring of resistance change during complex vibration test, daisy chain was formed in the test board. From the results of resistance change and shear strength change, the reliability of two solder balls was compared and evaluated. During complex vibration for 120 hours, Sn-0.7Cu solder was more stable than Sn-3.5Ag solder in complex vibration test.