• Title/Summary/Keyword: 솔더링

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A Study on deformation and electrical efficiency of PV cell according to hot-air temperature at soldering process (솔더링 공정에서 열풍온도에 따른 PV셀의 변형량 및 전기효율에 관한 연구)

  • Lee, Jong-Hwan;Lho, Tae-Jung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.7
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    • pp.4065-4071
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    • 2014
  • The analysis results of the temperature distribution and deformation at the PV cell with a thickness of $200{\mu}m$ according to hot-air temperature at the soldering process of a PV cell and ribbon tend to agree somewhat with the experimental measured values. The best result of the electrical efficiency appears in the module soldered at a hot-air temperature of $390^{\circ}C$. An analysis of the soldering PV cell with a thickness of $150{\mu}m$ at a hot-air temperature of $350^{\circ}C$ confirmed that the maximum deformation was approximately 5.9mm. As the temperature of hot air is set to decrease, the deformation is reduced and it is predicted that the electrical efficiency can be improved.

Effect of Reflow Variables on the Characteristic of BGA Soldering (리플로 공정변수가 BGA 솔더링 특성에 미치는 영향)

  • 한현주;박재용;정재필;강춘식
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.3
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    • pp.9-18
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    • 1999
  • In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

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A Study on The Solderability of Micro-BGA of Sn-3.5Ag-0.7Cu (Sn-3.5Ag-0.7Cu Micro-BCA의 Soldering성 연구)

  • ;;;;Kozo Jujimoto
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.3
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    • pp.55-61
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    • 2000
  • Sn-37Pb and Sn-3.5Ag-0.7Cu solder balls of 0.3 mm diameter were reflow soldered with the variation of soldering peak temperature and conveyer speed of reflow machine. The peak temperatures far soldering were changed in the range of 220~$240^{\circ}C$ for Sn-37Pb and 230~$260^{\circ}C$ for Sn-3.5Ag-0.7Cu. As the results of experiments, optimum soldering condition for Sn-37Pb was $230^{\circ}C$ of soldering temp., 0.7~0.8 m/min of conveyer speed. The optimum condition for the Sn-3.5Ag-0.7Cu was $250^{\circ}C$ and 0.6 m/min. The maximum shear strength for the soldered joints of Sn-37Pb was 555 gf and of Sn-3.5Ag-0.7Cu was 617 gf. Thickness of the intermetallic compound Cu6Sn5 on the soldered interface was 1.13~1.45 $\mu\textrm{m}$ for Sn-37Pb and 2.5~4.3 $\mu\textrm{m}$ for Sn-3.5Ag-0.7Cu.

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Pseudo-Power Cycling을 이용한 솔더 조인트의 가속시험

  • Kim, Il-Ho;Lee, Sun-Bok
    • Proceedings of the Korean Reliability Society Conference
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    • 2006.05a
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    • pp.32-39
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    • 2006
  • 전자 부품의 신뢰성 평가를 위해서 다양한 방법의 시험법이 사용된다. 전자 부품은 반복적인 작동과 휴식에 의한 열피로를 받게 된다. 이에 대한 신뢰성 평가를 위해 오래전부터 다양한 시험 규격이 만들어지고, 그에 따라 열챔버를 이용한 챔버 사이클링 시험이 수행되고 있다. 하지만, 최근에는 이러한 시험 규격들에 대한 문제가 지적되고 있으며, 또한 챔버 사이클링을 이용한 가속 실험의 경우 실제 작동환경을 완벽히 묘사하지 못하며, 가속할 수 있는 정도가 제한되고 있다. 본 연구에서는 파워 사이클링 시험을 묘사하는 시험 방법을 제안하고, 그를 이용하여 BGA 패키지의 솔더 조인트에 대한 열피로 시험을 수행하였다. 본 연구에서 제안된 파워 사이클링 시험기는 실제 작동 환경과 유사한 온도 구배를 패키지에 만들어 준다. 그리고 패키지에 열전도를 이용하여 열을 공급함으로써, 대류를 통해 열을 공급하는 챔버 사이클링 시험에 비해 빠르게 가열 및 냉각이 가능하다. 파워사이클링 테스트 방법을 이용하여 다양한 온도 조건에 대해 열피로 수행하여 솔더 조인트의 열피로 특성을 평가하였다.

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Interfacial Microstructure Evolution between Liquid Au-Sn Solder and Ni Substrate (액상 Au-Sn 솔더와 Ni 기판의 계면현상에 대한 고찰)

  • Kim Sung Soo;Kim Jong Hoon;Jeong Sang Won;Lee Hyuck Mo
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.3 s.32
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    • pp.47-53
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    • 2004
  • Eutectic Au-20Sn(compositions are all in weight percent unless specified otherwise) solder alloys were soldered on the Ni substrate with various time and temperature. The composition, phase identification and morphology of intermetallic compounds(IMC) at the interface were examined using Scanning Electron Microscopy(SEM). There were two types of IMCs, $(Au,Ni)_3Sn_2$ and $(Au,Ni)_3Sn$ at the interface. The transition in morphology of $(Au,Ni)_3Sn_2$ has been observed at $300{\~}400^{\circ}C$. The morphology transition of $(Au,Ni)_3Sn_2$ is due to the decrease of enthalpy of formation of $(Au,Ni)_3Sn_2$ phase and has been explained well by Jackson's parameter with temperature. Because the number of diffusion channel is different at each soldering temperature, IMC thickness is nearly same at all temperature.

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Implementation of Digital Desoldering System for Removing Lead-free Solder (무연 솔더 제거를 위한 디지털 디솔더링 시스템 구현)

  • Oh, Kab-Suk
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.1
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    • pp.322-328
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    • 2012
  • This paper deals with a digital Desoldering system for removing lead-free solder. We proposed a Desoldering system that is to cope with the changed work environment of the solder materials changing from lead solder to lead-free solder, we can be quickly stable to the set temperature, and continuous operation is possible. Proposed system consists of a Desoldering station and a Desoldering gun. For the PID temperature control, we designed the 8bit MCU peripheral circuit. We had a few experiments to confirm the performance of the proposed system, and compared with the specification of same kind of imports. As a result, proposed system than the imported products showed good performance as follows: the time to reach operating temperature is 11 seconds faster, ripple temperature variation is $1.5^{\circ}C$ lower, temperature recovery rate is about $0.14^{\circ}C$/sec faster.

Assesment of wetting characteristics of pure Sn (고순도 Sn의 wetting특성 평가)

  • Park, Jun-Gyu;Park, Sang-Yun;Jeong, Jae-Pil
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2011.05a
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    • pp.186-186
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    • 2011
  • 최근 전자제품의 소형화로 인해 패키징 방법 또한 고밀도 실장법이 연구되고 있다. 고밀도실장을 위해 칩과 솔더간의 간격이 줄어들고, 칩의 두께 또한 얇아지고 있다. 칩과 회로간 연결 소재로는 주석 계열 솔더가 사용 중인데, 고밀도 실장을 위해 산업계에서는 미세 피치에 적합한 솔더를 이용하고 있다. 이에 대한 기초 연구로 순도가 높은 Sn의 wetting 및 기초 솔더링 특성을 평가하였다. 솔더의 spreading, wetting 시험을 실시하였으며, EDS 및 EPMA의 성분분석 평가도 실시하였다.

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Bonding Property and Reliability for Press-fit Interconnection (Press-fit 단자 접합특성 및 신뢰성)

  • Oh, Sangjoo;Kim, Dajung;Hong, Won Sik;Oh, Chulmin
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.3
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    • pp.63-69
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    • 2019
  • Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.