• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.1
• /
• pp.45-50
• /
• 2009

By Laser Through-Silicon-Via process, debris and particles occur when you are forming. Therefore the research of TSV cleaning become important to remove those particles and debris. Both chemical cleaning method that uses a surfactant and physical cleaning method that uses a brush were studied with the via of $30{\mu}m$ diameter and $100{\mu}m$ depth on the 8 inch CMOS Image Sensor wafer. On the DI water and a surfactant in mixture ratio of 2:1, debris show $73{\mu}m^2$ per $0.054mm^2$. Cleaning is superior by lower mixture ratio of DI water and surfactant. In addition, It is less than 5% of debris distribution in the laser condition changed by Laser's frequency and its speed and cleaning had no effect. In the physical cleaning, there are no crack and damage when the system condition is set by $1000{\sim}3000rpm$ strip, $50{\sim}3000rpm$ rinsing, and $200{\sim}300rpm$ brushing Therefore, debris and particles can be removed by enforced chemical method and physical method.

• Korean Journal of Materials Research
• /
• v.6 no.11
• /
• pp.1127-1135
• /
• 1996

반도체 소자가 고집적화 됨에 따라 단위공정의 수가 증가하게 되었고 동시에 실리콘 기판의 오염에 대한 문제가 증가하였다. 실리콘 기판의 주 오염물로는 유기물, 파티클, 금속분순물 등이 있으며 특히, Cu와 Fe과 같은 금속불순물은 이온주입 공정, reactive ion etching, photoresist ashing과 같은 실 공정 중에 1011-1013atoms/㎤정도로 오염이 되고 있다. 그러나 금속불순물 중 Cu와 같은 전기음성도가 실리콘 보다 큰 오염물질은 일반적인 습석세정방법으로는 제거하기 힘들다. 따라서 본 연구에서는 Cu와 Fe과 같은 금속불순물을 제거할 목적을 건식과 습식 세정방법을 혼합한 UV/ozone과 HF세정을 제안하여 실시하였다. CuCI2와 FeCI2 표준용액으로 실리콘 기판을 인위적 오염한 후 split 1(HF-only), split 2 (UV/ozone+HF), split 3 (UV/ozone + HF 2번 반복), split 4(UV/ozone-HF 3번 반복)를 실시하였고 TXRF(Total Reflection X-Ray Fluorescence)와 AFM(Atomic Force Microscope)으로 금속불순물 제거량과 표면거칠기를 각각 측정하였다. 또한 contact angle 측정으로 세정에 따른 표면상태도 측정하였다. TXRF 측정결과 split 4가 가장 적은 양의 금속불순물 잔류량을 보였으며 AFM 분석을 통한 표면거칠기도 가장 작은 RMS 값을 나타내었다. Contact angle 측정 결과 UV/ozone 처리는 친수성 표면을 형성하였고 HF처리는 소수성 표면을 형성하였다.

• Clean Technology
• /
• v.18 no.1
• /
• pp.43-50
• /
• 2012

Cleaning procedure of solar silicon wafer, following ingot sawing process in solar cell production is studied. Types of solar silicon wafer can be divided into monocrystalline or multicrystalline, and slurry sawn wafer or diamond sawn wafer according to the ingot growing methods and the sawing methods, respectively. Wafer surface and contaminants can vary with these methods. The characterisitics of contaminants and wafer surface are investigated for each cleaning substrate, and appropriate cleaning agents are developed. Physical properties and cleaning ability of the cleaning agents are evaluated in order to verify the application in the industry. The wafers cleaned with the cleaning agents do not show any residual contaminants when analyzed by XPS and regular patterns are formed after texturization. Furthermore, the cleaning agents are applied in the production industry, which shows superior cleaning results compared to the existing cleaning agents.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2012.05a
• /
• pp.586-591
• /
• 2012

The solution of maintenance decision support system for the gas turbine engine, which is currently operating in GUNSAN combined cycle power plant, was developed and is consist of online monitoring module, periodic performance trending module, optimal compressor washing interval analysis module and hot component management module. Also, GUI platform was applied to this solution for the user to monitoring the analyzed result of engine performance condition and then to make a decision of the consequent maintenance action. In online condition monitoring module, the performance degradation of engine is provided by the analysis of difference between the real time measurement data compared to exist engine performance. The optimal compressor washing interval module produced the washing interval of maximum net profit value by researching the maintenance expense and the loss profit value corresponds to the performance degradation with economic assessment algorithm. Thus, this solution support the user to enable the optimal maintenance and operation of gas turbine engine with overall analysis of engine condition and main information.

• Proceedings of the Korean Nuclear Society Conference
• /
• 2001.05a
• /
• pp.139.2-139
• /
• 2001

• Korean Journal of Materials Research
• /
• v.4 no.8
• /
• pp.921-926
• /
• 1994

The characteristics of gate oxide significantly depend on the last chemical solution used in cleaning process. The standard RCA, HF-last, SC1-last, and HF-only processes are the pre-gate oxide cleaning processes utilized in this experiment. Cleaning process was followed by thermal oxidation in oxidation furnace at $900^{\circ}C$. A 100$\AA$ gate oxide was grown and characterized with using lifetime detector, VPD AAS, SIMS, TEM, and AFM. The results of HF-last and HF-only were shown to be very effective to remove the metallic impurities. And these two splits also showed long minority carrier lifetimes. The surface and interface morphologies of the oxide were examined with AFM and TEM. The rough surface morphologies were observed with the cleaning splits containing the SC1 solution. The smooth surface and interface was observed with the HF-only cleaning process.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.6
• /
• pp.21-26
• /
• 2015

This study presents a development of the cleaning system in a nuclear power plant condenser. The tube cleaning system is very important equipment in a power plant condenser. Specially, removal of the fouling is a key process in the condenser tube. The objective of this study is development of a ball collector system for cleaning a condenser by using a sponge ball. This study uses CFD in order to optimize design of the ball strainer screen. Through the CFD, the implication of the ball strainer screen for static pressure distribution is examined. Results of research, this study have developed a 1/5 scale model for application to the power plant and developed a performance test equipment.

• The Safety technology
• /
• no.189
• /
• pp.22-23
• /
• 2013

종합부품기업 아이원스(주)는 1993년 3월 자동차 미디어 관련 부품제작 업체인 동아엔지니어링으로 출발했다. 1994년에는 반도체 LCD부분 그리고 2003년에는 삼성전기(주)광디바이스 사업으로 진출했으며, ISO9001 ISO14001 인증을 획득한 후 2005년 벤처기업으로 등록하면서 전도유망한 기업으로 성장해왔다. 이후 2005년 아이원스 주식회사로 법인전환을 하면서 2006년 기흥 세정공장 준공, 2007년 삼성전자 메모리 사업부 세정 협력업체 등록, 병역 특례업체 선정, 2011년 삼성전자 생산기술연구원 업체 등록, 2013년 2월 코스닥 상장 등으로 지속적인 발전을 이어오게 된다. 이곳의 이러한 성장에는 이문기 대표이사의 안전에 대한 각별한 신념이 밑거름이 됐다. 직원들의 안전을 회사의 가장 큰 가치로, 그리고 직원들을 회사의 가장 큰 자산으로 여기고 안전에 집중 투자하면서 무재해를 이어온 것이 기업 성장의 원동력이 된 것이다. 안전경영의 좋은 본보기가 되고 있는 이문기 대표이사를 찾아가 그만의 안전철학을 들어봤다.

• Journal of Korea Far Infrared Association
• /
• s.30
• /
• pp.52-60
• /
• 2006

• Nuclear industry
• /
• v.14 no.6 s.136
• /
• pp.64-71
• /
• 1994