• Title/Summary/Keyword: 설포늄

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Low-temperature Fast-curing Cationic Latent Curing Agent for One-component Epoxy Adhesives for Electronic Materials (전자 재료용 일액형 에폭시 접착제를 위한 저온 속경화 잠재성 양이온 경화제)

  • So Hyun An;Han Gyeol Jang;Young Hoon Joung;Seung Jun Kim;Myung Woong Kim;Felix Sunjoo Kim;Jaewoo Kim
    • Composites Research
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    • v.37 no.5
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    • pp.393-401
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    • 2024
  • Epoxy is a thermosetting polymer with excellent properties such as heat and chemical resistance, making them essential in various industrial fields including electronics. The performance of epoxy is highly dependent on the type of curing agent used. Among them, sulfonium-based latent curing agents are notable for their fast curing speed, high curing hardness, and specificity to certain temperatures, making them attractive for manufacturing anisotropic conductive films in electronic materials where single-component epoxy is required. However, sulfonium-based latent curing agents face challenges in industrial application due to issues with low yield and purity. This study optimized the synthesis conditions for benzyl and naphthyl-type sulfonium curing agents (B-Sul+SbF6-, N-Sul+NCyF-, N-Sul+NFSI-). By adjusting reaction time, reaction temperature, and reactant ratios, yield was maximized, significantly reducing both reaction time and temperature. The three optimized curing agents were evaluated for their thermal and mechanical properties to assess curing behavior and storage stability. The results confirmed that stable curing performance was maintained even after mixing. This study aims to expand the industrial applicability of sulfonium curing agents.