• Journal of the Korean Society for Precision Engineering
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• v.18 no.7
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• pp.134-142
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• 2001

The integrals $J_k$(k=1,2) in the rectilinear anisotropis body in 2-D were determined using Lekhnitskii formalism. The relationship between $J_k$ and stress intensity factors are implified by the important equation between elastic compliance. The numerical evaluation of stress intensity factor for the single edge crack in mixed mode is determined by superposing known exact solutions.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.236-241
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• 2000

In this paper, transparent dynamic photoelastic experimental hybrid method for propagating cracks in orthotropic material is developed. Using transparent dynamic photoelastic experimental hybrid method, we can obtain stress intensity factor and separate the stress components from only isochromatic fringe patterns without using isoclinics. It is certified that the dynamic photoelastic experimental hybrid method is very useful for the problems of the dynamic tincture mechanics.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1273-1280
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• 2003

In this paper, transparent dynamic photoelastic experimental hybrid method for propagating cracks in orthotropic material was developed. Using transparent dynamic photoelastic experimental hybrid method, we can obtain stress intensity factor and separate the stress components from only isochromatic fringe patterns without using isoclinics. When crack is propagated with constant velocity, the contours of stress components in the vicinity of crack tip in orthotropic material are similar to those of isotropic material or orthotropic material with stationary crack under the static load. Dynamic stress intensity factors are decreased as crack growths. It was certified that the dynamic photoelastic experimental hybrid method was very useful for the analysis of the dynamic fracture mechanics.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.17-23
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• 2001

The 3-D Hall sensor has two horizontal magnetic field sensing parts ($\chi$, y components) and one vertical magnetic field sensing part (z component). For conventional, 3-D Hall sensor it is general that the sensitivity for $B_{z}$ is about 1/10 compared with those for $B_\chi$ or $B_y$. Therefore, in this work, we proposed 3-D Hall sensor with new structure. We have increased the sensitivity about 6 times to form the trench using anisotropic etching. And we have increased the sensitivity for the $B_z$ by 80% compared with those of $B_\chi$ and$B_y$ using deposition of the ferromagnetic thin films on the bottom surface of the wafer to concentrate the magnetic fluxes. When the input current was 3 mA, sensitivities of the fabricated sensor with Ni/Fe film for $B_\chi, B_y$ and $B_{z}$ were measured as 120.1 mV/T, 111.7 mV/T, 95.3 mV/T, respectively. The measured linearity of the sensor was within $\pm$3% of error.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.45 no.4
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• pp.29-34
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• 2008

Generally, for conventional 3-D Hall sensor it is general that the sensitivity for $B_z$ is about 1/10 compared with those for $B_x$ or $B_y$. Therefore, in this work, we proposed 3-D Hall sensor with new structures. We have increased the sensitivity about 6 times to form the trench using anisotropic etching. And we have increased the sensitivity for the $B_z$ by 80 % compared with those of $B_x$ and $B_y$ using deposition of the ferromagnetic thin films on the bottom surface of the wafer to concentrate the magnetic fluxes. Sensitivities of the fabricated sensor with Ni/Fe film for $B_x,\;B_y$, and $B_z$ were measured as 361mV/T, 335mV/T, and 286mV/T, respectively. It has also showed sine wave of Hall voltages over a $360^{\circ}$ rotation. A packaged sensing part was $1.2{\times}1.2mm^2$. The measured linearity of the sensor was within ${\pm}3%$ of error. Resolution of the fabricated sensor was measured by $1{\times}10^{-5}T$.