• Science of Emotion and Sensibility
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• v.21 no.2
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• pp.137-144
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• 2018

The study figured out the operational conditions of a two-way movement actuator made of one-way shape memory alloy (OWSMA) for versatile ventilation intelligent garments. To develop a low-power actuator that consumes energy only when a garment changes its form such as opening and closing, multiple channels of OWSMA were used, and optimum diameter of the wires was examined. For the switch device, optimum voltage application unit time was determined. Optimum diameter of OWSMA wire was determined by applying 3.7V to the pre-determined candidate diameters, which demonstrated two-way operation in previous studies. In order to evaluate the optimum voltage application time, the internal diameter of the actuator was measured while increasing and decreasing by 50 ms from the unit time of voltage application. Delay time under two-way operation of the actuator was measured to minimize interference caused by heat between channels. Power of 3.7V was applied to OWSMA for assessment of optimal time, and the whole process from heating to cooling was video-recorded with a thermal image camera to determine the point of time at which the temperature of OWSMA wire dropped below the phase transformation temperature. The results showed that $0.4{\Phi}$ was the most suitable diameter, and the optimum unit time of voltage applied to open and close the actuator was 4100ms. It was also shown that the delay time should be more than 1.8 seconds between two-way operations of the actuator.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.27-36
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• 2006

We fabricated thermally evaporated 10 nm-Ni/(poly)Si, 10 nm-Ni/l nm-Ir/(poly)Si and 10 nm-Ni/l nm-Pt/(poly)Si films to investigate the thermal stability of nickel monosilicides at the elevated temperatures by rapid annealing them at the temperatures of $300{\sim}1200^{\circ}C$ for 40 seconds. Silicides of 50 nm-thick were formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to examine sheet resistance. A scanning electron microscope and field ion beam were employed for thickness and microstructure evolution characterization. An X-ray diffractometer and an Auger depth profiler were used for phase and composition analysis, respectively. Nickel silicides with platinum have no effect on widening the NiSi stabilization temperature region. Nickel silicides with iridium farmed on single crystal silicon showed a low resistance up to $1200^{\circ}C$ while the ones formed on polycrystalline silicon substrate showed low resistance up to $850^{\circ}C$. The grain boundary diffusion and agglomeration of silicides lowered the NiSi stable temperature with polycrystalline silicon substrates. Our result implies that our newly proposed Ir added NiSi process may widen the thermal process window for nano CMOS process.

• Korean Journal of Materials Research
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• v.8 no.6
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• pp.538-544
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• 1998

The spallation of a thermal barrier coating layer depends on the formation of brittle spinels. thermal expansion mismatch between ceramic and metal. the phase transformation of a ceramic layer and residual stress of coating layer. In this work. the formation mechanism of oxide scale formed by oxidation treatment at 90$0^{\circ}C$ was investigated in order to verify oxidation behavior at the interface between E-beam coated $Zr0_2$-7wt.% $Y_20_3$ and plasma sprayed CoNiCrAIY. Some elements distributed in the bond coating layer were selectively oxidized after oxidation. At the initial time of oxidation. AI-depletion zone and $\alpha$-$Al_O_3$,O, were formed at the bond coating layer by the AI-outward diffusion. After layer grew until critical thickness. spinels. $Cr_20$, and $C0_2CrO_4$ by outward diffusion of Co. Cr, Ni were formed. It was found that the formation of spinels may be related to the spallation of $Zr0_2$-7wt.% $Y_20_3$ during isothermal oxidation.

• Korean Journal of Materials Research
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• v.8 no.12
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• pp.1115-1120
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• 1998

The sliding wear behavior of Ni-base hardfacing alloy, Deloro 50, was investigated at the contact stresses of 15ksi and 30ksi under the various wear environments. In air at room temperature, Deloro 50 showed lower wear resistance than Stellite 6 even at 15ksi due to the occurrence of severe adhesive wear. This seems to be caused by the lower hardness and work- hardening rate of Deloro 50 than those of Stellite 6. In water at room temperature, Deloro 50 showed as good wear resistance as Stellite 6 at 15ksi. It was considered to be due to that water could effectively prevent metal to metal contact through contacting asperities. However, Deloro 50 showed severe adhesive wear at 30ksi in water at room temperature. It seems to be that the water could not suppress adhesion wear at 30ksi. At $300^{\circ}C$ in air, Deloro 50 exhibited higher wear resistance than Stellite 6 even at 30ksi. It was considered that the oxide glaze layers formed on wear surface during sliding, effectively prevented direct metal-to-metal contacts.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1056-1063
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• 2006

Thermal evaporated 10 nm-Ni/l nm-Ir/(or polycrystalline)p-Si(100) and 10 nm-$Ni_{50}Co_{50}$/(or polycrystalline)p-Si(100) films were thermally annealed using rapid thermal annealing fur 40 sec at $300{\sim}1200^{\circ}C$. The annealed bilayer structure developed into Ni(Ir or Co)Si and resulting changes in sheet resistance, microstructure, phase and composition were investigated using a four-point probe, a scanning electron microscopy, a field ion beam, an X-ray diffractometer and an Auger electron spectroscope. The final thickness of Ir- and Co-inserted nickel silicides on single crystal silicon was approximately 20$\sim$40 nm and maintained its sheet resistance below 20 $\Omega$/sq. after the silicidation annealing at $1000^{\circ}C$. The ones on polysilicon had thickness of 20$\sim$55 nm and remained low resistance up to $850^{\circ}C$. A possible reason fur the improved thermal stability of the silicides formed on single crystal silicon substrate is the role of Ir and Co in preventing $NiSi_2$ transformation. Ir and Co also improved thermal stability of silicides formed on polysilicon substrate, but this enhancement was lessened due to the formation of high resistant phases and also a result of silicon mixing during high temperature diffusion. Ir-inserted nickel silicides showed surface roughness below 3 nm, which is appropriate for nano process. In conclusion, the proposed Ir- and Co- inserted nickel silicides may be superior over the conventional nickel monosilicides due to improved thermal stability.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.5
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• pp.212-223
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• 2019

This study is to investigate the relationship between microstructural factors and tensile properties after aging heat treatment of the 15-5PH stainless steel at the temperature range of $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$ for various time. For the aging time of 2 hours, hardness showed maximum at $450^{\circ}C$ and then decreased with increasing aging temperature. While, hardness decreased gradually during aging $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$ from 1 hour to 5 hours but the hardness nearly unchanged until the 100 hours after 5 hours aging. When aging at $450^{\circ}C$, Cu atoms preferentially aggregated at the prior austenite grain boundaries and martensite lath boundaries, and Cu concentration at those boundaries was nearly unchanged even after aging for 100 hours. Therefore it was suggested that the coherency is still maintained after 100 hours aging at $450^{\circ}C$. Aging at $500^{\circ}C$ and $550^{\circ}C$ results in an increase in the concentration of Ni at the martensite lath boundaries and prior austenite grain boundaries, resulting in the formation of reversed austenite. Especially, when aged at $550^{\circ}C$ for 100 hours, the concentration of Ni remarkably increased at those boundaries, and thus the microstructure of herring bone shape was appeared. Considering the migration of Ni atom to the lath boundaries and prior austenite grain boundaries, Ni atoms contributed greatly to the formation of reversed austenite. On the other hand, it was found that Cu atoms hardly moving to those boundaries may not be contributed to the formation of reversed austenite. When aging at $450^{\circ}C$, the coarsening of the precipitated Cu atoms proceeded very slowly with increasing aging time, therefore the decrease in strengths were small but the reduction area was considerably increased due to the softening of the matrix. At the aging temperature of $500^{\circ}C$ and $550^{\circ}C$, the strengths decreased and the elongation and reduction area increased due to the appearance of the reversed austenite. Especially, the increase of reduction area was remarkable.

• Resources Recycling
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• v.31 no.1
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• pp.29-36
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• 2022

The hydrogen reduction behavior of molybdenum oxides was studied using a horizontal-tube reactor. Reduction was carried out in two stages: MoO₃ → MoO₂ and MoO₂ → Mo. In the first stage, a mixed gas composed of 30 vol% H₂ and 70 vol% Ar was selected for the MoO₃ reduction because of its highly exothermic reaction. The temperature ranged from 550 to 600 ℃, and the residence time ranged from 30 to 150 min. In the second step, pure H₂ gas was used for the MoO₂ reduction, and the temperature and residence time ranges were 700-750 ℃ and 30-150 min, respectively. The hydrogen reduction behavior of molybdenum oxides was found to be somewhat different between the two stages. For the first stage, a temperature dependence of the reaction rate was observed, and the best curve fittings were obtained with a surface reaction control mechanism, despite the presence of intermediate oxides under the conditions of this study. Based on this mechanism, the activation energy and pre-exponential were calculated as 85.0 kJ/mol and 9.18 × 10⁷, respectively. In addition, the pore size within a particle increases with the temperature and residence time. In the second stage, a temperature dependence of the reaction rate was also observed; however, the surface reaction control mechanism fit only the early part, which can be ascribed to the degradation of the oxide crystals by a volume change as the MoO₂ → Mo phase transformation proceeded in the later part.

• Korean Journal of Materials Research
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• v.10 no.8
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• pp.569-574
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• 2000

To improve the ductility of $Al_3Hf$ and $Al_3Ta$ intermetallic compounds, which are the potential temperature structural materials, the mechanical alloying behaviour and the effect of ternary additions on the $Ll_2$ phase formation were investigated. During the mechanical alloying by the SPEX mill, the $Ll_2$ $Al_3Hf$ intermetallic compound was formed after 6 hours of milling in AL-25%Hf system. In AL-25%Ta system, however, only the $D0_{22}$ $Al_3Ta$ intermetallic compound was formed until 30 hours of milling and the $Ll_2$ phase was not observed. In AL-12.5%M-25%Ta(M=Cu, Zn, Mn, Fe, Ni) systems, the additions of Cu and Zn had no effect on the $D0_{22}$ structure of the binary $Al_3Hf$ and the additions of Mn, Fe and Ni produced the amorphous phase. Therefore it was considered that these ternary additions could not overcome the energy difference between $Ll_2$ and $D0_{22}$ structures in the $Al_3Hf$ intermetallic compound. In AL-12.5%M-25%Hf(M=Cu, Zn, Mn, Fe, Ni)systems, the additions of Cu and Zn did not affect the $Ll_2$ structure of the binary $Al_3Hf$ but the additions of oMn, Fe and Ni produced the amorphous phase as they did in AL-12.5%M-25%Ta systems. Therefore, it was considered that the Ni, Mn and Fe additions promote the formation of amorphous phase in $Al_3X$ intermetallic compounds.

• Journal of the Korean Ceramic Society
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• v.22 no.1
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• pp.11-18
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• 1985

The effect of stress induced phase transformation on $Al_2 O_3$ matrix dispersed with $ZrO_2-Y_2O_3$ has been studied. In order to determinate the mechanical properties three $Al_2O_3-ZrO_2$ composite series containing 1, 3 and 5 mole% $Y_2O_3$ were prepared. The starting materials were $Al_2O_3$ and $ZrO_2-Y_2O_3$ which was prepared from the aqueous solution of high purity $YCl_3$.$6H_2O$ and $ZrOCl_2$.$8H_2O$. Powder mixtures of $Al_2O_3-ZrO_2$ containing $Y_2O_3$ have been prepared by ball-milling with methanol and the samples were formed by isostatic press and sintered at 150$0^{\circ}C$ for 2hrs. After sintering. the specimens were polished for mechanical determination. The relative density of sintered specimens were also measured. It was found that the addition of 1, 3mole% to {{{{ { ZrO}_{2 } }} allowed full retention of the tetragonal phase in $Al_2O_3-ZrO_2$ but partially stabilized zirconia (PSZ) was produced by additions of 5 mole% $Y_2O_3$.The critical stress-intensity factor KIc of $A_2O_3-ZrO_2$ (containing 1 mole% $Y_2O_3$) composite materials increased with increasing $ZrO_2$ content, The maximum value of KIC=7Mn/$m^3$/2 at 20 mole% $ZrO_2$ exhibited about twice that of the $Al_2 O_3$ The modulus of rupture exhibited a trend similiar to KIC The maximum value of MOR was 580MN/m2. As the amount of Y2O3 increase it was observed that the maximum of KIC and MOR decreased : Additions of 3 mole% $Al_2O_3$ $Y_2O_3$ allowed the maximum of KIC 6MN/$m^3$/2 MOR 540MN/$m^2$ at 15 mole% $ZrO_2$ additions of 5 mole% $Y_2O_3$ allowed the maximum of KIC 5MN/$m^3$/2 MOR 410MN/$m^2$ at 10 mole% $ZrO_2$.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.601-606
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• 2000

Nickel mono-silicide(NiSi) shows no increase of resistivity as the line width decreases below 0.15$\mu\textrm{m}$. Furthermore, thin silicide can be made easily and restrain the redistribution of dopants, because NiSi in created through the reaction of one nickel atom and one silicon atom. Therefore, we investigated the deposition condition of Ni films, heat treatment condition and basic properties of NiSi films which are expected to be employed for sub-0.15$\mu\textrm{m}$ class devices. The nickel silicide film was deposited on the Si wafer by using a dc-magnetron sputter, then annealed at the temperature range of $150~1000^{\circ}C$. Surface roughness of each specimen was measured by using a SPM (scanning probe microscope). Microstructure and qualitative composition analysis were executed by a TEM-EDS(transmission electron microscope-energy dispersive x-ray spectroscope). Electrical properties of the materials at each annealing temperature were measured by a four-point probe. As the results of our study, we may conclude that; 1. SPM can be employed as a non-destructive process to monitor NiSi/NiSi$_2$ transformation. 2. For annealing temperature over $800^{\circ}C$, oxygen pressure $Po_2$ should be kept below $1.5{\times}10^{-11}torr$ to avoid oxidation of residual Ni. 3. NiSi to $NiSi_2$ transformation temperature in our study was $700^{\circ}C$ from the four-point probe measurement.