• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.5
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• pp.337-343
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• 2017

As a shop practice, a strength estimation method for die cast parts is suggested, in which various defects such as pores can be allowed. The equivalent porosity is evaluated by combining the stiffness data from a simple elastic test at the part level during the shop practice and the theoretical stiffness data, which are defect free. A porosity equation is derived from Eshelby's inclusion theory. Then, using the Mori-Tanaka method, the porosity value is used to draw a stress-strain curve for the porous material. In this paper, the Hollomon equation is used to capture the strain hardening effect. This stress-strain curve can be used to estimate the strength of a die cast part with porous defects. An elastoplastic theoretical solution is derived for the three-point bending of a die cast beam by using the plastic hinge method as a reference solution for a part with porous defects.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.