• Title/Summary/Keyword: 비부착 방식

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Behavior of amber fish, Seriola aureovittata released in the setnet (정치망내에 방류한 부시리, Seriola aureovittata 의 행동)

  • 신현옥;이주희
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.35 no.2
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    • pp.161-169
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    • 1999
  • This paper describes the swimming and escaping behavior of amber fish, Seriola aureovittata released in the first bag net of the setnet and observed with telemetry techniques. The setnet used in experiment is composed of a leader, a fish court with a flying net and two bag nets having ramp net. The behavior of the fish attached an ultrasonic depth pinger of 50 KHz is observed using a prototype LBL fish tracking system. The 3-D underwater position ofthe fish is calculated by hyperbolic method with three channels of receiver and the depth of pinger. The results obtained are as follows: 1. The fish released on the sea surface was escaped down to 15 m depth and rised up to near the sea surface during 5 minutes after release. The average swimming speed of the fish during this time was 0.87 m/sec. 2. The swimming speed of the fish is decreased slowly in relation to the time elapsed and the fish showed some escaping behavior forward to the fish court staying 1 to 7 m depth layer near the ramp net. The average speed of the fish during this time was 0.52 m/sec. 3. During 25 minutes after beginning of hauling net, the fish showed a faster swimming speed than before hauling and an escaping behavior repeatedly from the first ramp net to the second one in horizontal. In vertical, the fish moved up and down between the sea surface and 20 m depth. After this time, the fish showed the escaping behavior forward to fish court after come back to the first ramp net in spite of the hauling was continued. It is found that the fish was escaped from the first ramp net to the fish court while the hauling was carried out. The average speed of the fish after beginning of hauling was 0.72 m/sec which increased 38.5 % than right before the hauling and showed 0.44 to 0.82 m/see of speed till escaping the first bag net. The average swimming speed during observation was 0.67 m/sec (2.2 times of body length).

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The Study on the Embedded Active Device for Ka-Band using the Component Embedding Process (부품 내장 공정을 이용한 5G용 내장형 능동소자에 관한 연구)

  • Jung, Jae-Woong;Park, Se-Hoon;Ryu, Jong-In
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.3
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    • pp.1-7
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    • 2021
  • In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (Pin) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.