• Title/Summary/Keyword: 블레이드 서버

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유니버설 웨어하우스로 총체적 솔루션 제공

  • Korea Database Promotion Center
    • Digital Contents
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    • no.10 s.53
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    • pp.71-73
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    • 1997
  • 인포믹스는 유니버설 서버 엔진에 기존의 솔루션을 데이터블레이드의 형태로 엔진에 스냅인시켜 무제한의 데이터 확장성을 제공함으로써 데이터 웨어하우스와 연계시키는 유니버설 웨어하우스 전략을 제시하고 있다.

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Power and Heat Load of IT Equipment Projections for New Data Center's HVAC System Design (데이터센터의 공조시스템 계획을 위한 IT장비의 전력 및 발열량 예측에 대한 연구)

  • Cho, Jin-Kyun;Shin, Seung-Ho
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.24 no.3
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    • pp.212-217
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    • 2012
  • The cooling of data centers has emerged as a significant challenge as the density of IT equipment increased. With the rapid increasing of heat load and cooling system, predictions for electronics power trends have been closely watched. A data center power density projection is needed so that IT organizations can develop data centers with adequate cooling for reasonable lifetimes. This paper will discuss the need for something more than processor and equipment power trend projections which have overestimated the required infrastructure for customers. This projection will use data from a survey of actual enterprise data centers and the ASHRAE projections to formulate a data center server heat load trend projection.

A Point of Production System for Semiconductor Wafer Dicing Process (반도체 웨이퍼 다이싱 공정을 위한 생산시점 정보관리시스템)

  • Kim, In-Ho
    • Journal of the Korea Society of Computer and Information
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    • v.14 no.10
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    • pp.55-61
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    • 2009
  • This paper describes a point of production(POP) system which collects and manages real-time shop floor machining information in a wafer dicing process. The system are composed of POP terminal, line controller and network. In the configuration of the system, LAN and RS485 network are used for connection with the upper management system and down stratum respectively. As a bridge between POP terminal and server, a line controller is used. The real-time information which is the base of production management are collected from information resources such as machine, product and worker. The collected information are used for the calculation of optimal cutting condition. The collection of the information includes cutting speed, spout of pure water, accumulated count of cut in process for blade and wafer defect. In order to manage machining information in wafer dicing process, production planning information is delivered to the shop floor, and production result information is collected from the shop floor, delivered to the server and used for managing production plan. From the result of the system application, production progress status, work and non-working hour analysis for each machine, and wafer defect analysis are available, and they are used for quality and productivity improvements in wafer dicing process. A case study is implemented to evaluate the performance of the system.