Development of hyperspectral image-based detection module for internal defect inspection of 3D-IC semiconductor module (3D-IC 반도체 모듈의 내부결함 검사를 위한 초분광 영상기반 검출모듈 개발)
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- Proceedings of the Korean Society for Agricultural Machinery Conference
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- 2017.04a
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- pp.146-146
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- 2017