• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.799-805
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• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.2005-2006
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• 2011

Due to the advantages of small sizes, more I/O ports, etc., Ball Grid Array (BGA) has been used in the production of printed circuit board (PCB). However, BGA voids can degrade the performance of the board and cause failure. To automatically detect the voids in X-ray image, a novel blob filter that makes use of the local image gradient magnitude is proposed in this paper. The utilization of the local image gradient magnitude makes the proposed filter invariant to the image brightness, void shape, void position, and component interference. Furthermore, different sizes of box filters are employed to analyze the image in multi-scale, and as a result, the proposed blob filter is robust to void size. Experimental results show that the proposed method can obtain void detection accuracy up to 96.104% while keep low false ratio.