• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.4
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• pp.571-583
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• 1996

The electrochemical behavior on electrographite and graphite foil electrode with porous surface in 0.5 M $K_{2}SO_{4}$ solution with 1 mM $[Fe(CN)_{6}]^{3-}/[Fe(CN)_{6}]^{4-}$ have been characterized by impedance spectroscopy. In cyclic voltammograms, relative high current according to structure of porous surface for graphite materials was represented, and indicated hgih double layer capacitance on graphite foil. The faraday-impedance and the change of impedance spectrum on both graphite materials were not remarkable during polarization by reaction of field transport. Chemical adsorption was represented on electrographite and was depended highly at anodic polarization.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.1
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• pp.42-49
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• 2002

Differences in electrode properties and in fluorine electrolysis behaviors of various carbon anodes, which were the YBD-like grade carbon, the YBD grade carbon and the P2X grade carbon, containing different pore sizes and distributions were investigated. The evaluations were performed by measuring their mechanical properties, cyclic voltammograms and chronoamperometries in 0.5 M $K_2SO_4$ solution with 1 mM $[[Fe(CN)_6]^\;{3-}/Fe(CN)_6$] $^{4-}$ redox couple and electrochemical behaviours of fluorine electrolysis in molten KF . 2HF electrolyte at $85^{\circ}C$. It was found that the P2X grade carbon anode showed better electrode properties in the cyclic voltammogram and chronoamperometry than the other carbon anodes while the YBD-like grade carbon anode which contained the pore size of 200~300$\mu$m showed superior electrode properties for fluorine electrolysis to the others. These differences in the electrode properties of various carbon anodes seemed to be owing to different sizes and distributions of pores on their surfaces.

• Tribology and Lubricants
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• v.31 no.3
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• pp.79-85
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• 2015

RC delay is a critical issue for achieving high performance of ULSI devices. In order to minimize the RC delay time, we uses the CMP process to introduce high-conductivity Cu and low-k materials on the damascene. The low-k materials are generally soft and fragile, resulting in structure collapse during the conventional high-pressure CMP process. One troubleshooting method is electrochemical mechanical polishing (ECMP) which has the advantages of high removal rate, and low polishing pressure, resulting in a well-polished surface because of high removal rate, low polishing pressure, and well-polished surface, due to the electrochemical acceleration of the copper dissolution. This study analyzes an electrochemical state (active, passive, transpassive state) on a potentiodynamic curve using a three-electrode cell consisting of a working electrode (WE), counter electrode (CE), and reference electrode (RE) in a potentiostat to verify an electrochemical removal mechanism. This study also tries to find optimum conditions for ECMP through experimentation. Furthermore, during the low-pressure ECMP process, we investigate the effect of current density on surface roughness and removal rate through anodic oxidation, dissolution, and reaction with a chelating agent. In addition, according to the Faraday’s law, as the current density increases, the amount of oxidized and dissolved copper increases. Finally, we confirm that the surface roughness improves with polishing time, and the current decreases in this process.