• Journal of the Korean Institute of Telematics and Electronics
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• v.22 no.4
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• pp.44-50
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• 1985

This paper describes the design and fabrication of an integrated circuit which controls the phase of VTR servo systems. The integrated circuit was designed using 6#m design rule and its chip size is 3.6$\times$3.55mm$^2$. On the other hand it was fabricated using SBC, analog-compatible 12 L and double layer metal fabrication process technology. As a result, we succeeded in fabrication of If which satisfied D. C. characteristics and phase control function.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.7
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• pp.63-70
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• 2004

This paper describes the link layer and physical layer of the Serial ATA which is the next generation for parallel ATA specification that defines data transfer between PC and peripheral storage devices. The link layer consists of CRC generation/error detection, 8b/10b decoding/encoding, primitive generation/detection block. For the physical layer, it includes CDR(Cock Data Recovery), transmission PLL, serializer/de-serializer. It also includes generation and receipt of OOB(Out-Of-Band) signal, impedance calibration, squelch circuit and comma detection/generation. Additionally, this chip includes TCB(Test Control Block) and BIST(Built-In Selt Test) block to ease debugging and verification. It is fabricated with 0.18${\mu}{\textrm}{m}$ standard CMOS cell library. All the function of the link layer operate properly. For the physical layer, all the blocks operate properly but the data transfer is limited to the 1.28Gbps. This is doe to the affection or parasitic elements and is verified with SPICE simulation.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.7
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• pp.1653-1659
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• 2013

In this paper, we propose a new ECAD software for efficiently analyzing and debugging of digital architecture implemented in Verilog HDL or VHDL codes. This software firstly elaborates HDL codes so as to extract internal architecture structure, then generates several graphical aids such as hierarchical schematics by applying placement and routing algorithm, object tree to show configuration of each module, instance tree to show hierarchical structure of instances, and SPD (Signal Propagation Diagram) to show internal interconnections. It is more important function that same objects in different views(HDL codes, object tree, instance tree, SPD, waveform etc.) can be highlighted at the starting any object. These functions are sure to improve efficiency of manual job to fix bugs or to analyze HDL codes.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.11C
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• pp.871-876
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• 2010

Currently the development of powerline communication technology has become possible due to the high-speed communications. But the communication lines used for power line communication, not wires carrying power wiring is because when sending high-frequency wireless communication system unintentionally be influenced. To compensate for these shortcomings by using notch filters to reduce interference has been studied. Wavelet-based OFDM on the other hand by the method has been used to reduce interference. Wavelet-based OFDM has been used in the existing powerline OFDM scheme using FFT instead of the general structure of the CMFB filters to generate a signal. By doing so, subtly signals per frequency band, cut it, is to realize how efficient highways. It brought a deep filter characteristics, a flexible notch filter can be achieved without an external circuit has an advantage. In this paper, Using Wavelet OFDM powerline communication system is designed and presented the results of simulations.

• Journal of the Institute of Convergence Signal Processing
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• v.7 no.2
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• pp.81-86
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• 2006

In this paper, a new process detection circuit is proposed. The proposed process detection circuit compares a long channel MOS transistor (L > 0.4um) to a short channel MOS transistor which uses lowest feature size of the process. The circuit generates the differential current proportional to the deviation of carrier mobilities according to the process variation. This method keep the two transistor's drain voltage same by implementing the feedback using a high gain OPAMP. This paper also shows the new design of the simple high gam self-biased rail-to-rail OPAMP using a proposed self-biased super MOS composite circuit. The gain of designed OPAMP is measured over 100dB with $0.2{\sim}1.6V$ wide range CMR in single stage. Finally, the proposed process detection circuit is applied to a differential VCO and the VCO showed that the proposed process detection circuit compensates the process corners successfully and ensures the wide rage operation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.5
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• pp.43-50
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• 2004

The clock skew is one of the major constraints for high-speed operation of synchronous integrated circuits. In this paper, we propose a hierarchical partitioning based clock network design algorithm called Advanced Clock Tree Generation (ACTG). Especially new effective partitioning and refinement techniques have been developed in which the capacitance and edge length to each sink are considered from the early stage of clock design. Hierarchical structures obtained by parhtioning and refinement are utilized for balanced clock routing. We use zero skew routing in which Elmore delay model is used to estimate the delay. An overlap avoidance routing algorithm for clock tree generation is proposed. Experimental results show significant improvement over conventional methods.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.10 s.352
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• pp.80-89
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• 2006

The rapid development of process technology and the introduction of new materials not only make it difficult for process control but also as a result increase process variations. These process variations are barriers to successful implementation of design circuits because there are disparities between data on layout and that on wafer. This paper proposes a new design environment to determine the interconnect worstcase with accuracy and speed so that the interconnect effects due to process-induced variations can be applied to designs of $0.13{\mu}m$ and below. Common Geometry and Maximum Probability methods have been developed and integrated into the new worstcase optimization algorithm. The delay time of the 31-stage Ring Oscillator, manufactured in UMC $0.13{\mu}m$ Logic, was measured, and the results proved the accuracy of the algorithm. When the algorithm was used to optimize worstcase determination, the relative error was less than 1.00%, two times more accurate than the conventional methods. Furthermore, the new worstcase design environment improved optimization speed by 32.01% compared to that of conventional worstcase optimizers. Moreover, the new worstcitse design environment accurately predicted the worstcase of non-normal distribution which conventional methods cannot do well.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.11
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• pp.23-32
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• 2005

The automatic generation of circuit diagrams has been practically used in the HDL based design for decades. Nevertheless, the diagrams became too complicated for the designers to identify the signal flows in the RTL and system level designs. In this paper, we propose four techniques to enhance the roadability of the complicated diagrams. They include i) the transformation of repetitive instances and terminals into vector forms, ii) an improved loop breaking algorithm, iii) a flat tap which simplifies the two level bus ripping structure that is required for the connection of a bundle net to multiple buses, and iv) the identification of block strings, and alignment of the corresponding blocks. Towards validating the proposed techniques, the diagrams of an industrial strength design m generated. The complexity of the diagrams has been reduced by up to $90\%$ in terms of the number of wires, the aggregate wire length, and the area.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.4 s.346
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• pp.56-65
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• 2006

The Quantum-dot Cellular Automata (QCA) can be considered as a candidate for the next generation digital logic implementation technology due to their small feature sizes and ultra low power consumption. Up to now, several designs using Uh technology have been proposed. However, we found not all of the designs function properly. Furthermore, no general design guidelines have been proposed so far. A straightforward extension of a simple functional design pattern may fail. This makes designing a large scale circuits using QCA technology an extremely time-consuming process. In this paper, we show several critical vulnerabilities related to unbalanced input paths to QCA gates and sneak noise paths in QCA interconnect structures. In order to make up the vulnerabilities, a disciplinary guideline will be proposed. Also, we present a fast adder which has been designed by the discipline, and verified to be functional by the simulation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.76-81
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• 2011

A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.