• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.107-107
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• 2017

전자제품의 성능이 향상됨에 따라서 전자제품에 사용되는 부품의 고집적화가 필연적으로 요구되고 있으며, 고집적화 된 전자제품의 방열(heat dissipation)에 관한 문제점이 대두되고 있다. 방열은 전자기기의 성능과 수명을 유지하는데 있어서 중요한 문제 중 하나로서 방열 효과를 높이기 위해 다양한 연구 개발이 진행 중이다. 방열에 사용되는 소재로는 Cu가 있으며, 저렴한 가격과 상대적으로 높은 방열 효율을 가지는 장점이 있다. Cu는 전기 도금 증착 방법을 사용하여왔으나, 전기도금 방식으로 증착된 Cu 방열판은 제품에 열이 축적될 경우 Cu와 substrate 사이의 residual stress로 인해 박리나 뒤틀림 현상 등이 발생하여 high power를 사용하는 device의 방열 소재로 사용하기에는 개선해야 할 문제점이 있다. 이러한 문제점을 극복하기 위한 방법으로 magnetron sputter 증착 방법이 있으며, magnetron sputter은 대면적화가 용이하고, 다양한 물질의 증착이 가능한 장점으로 인해 hard coating 또는 thin film 증착과 같은 공정에 사용되고 있다. 특히 증착된 film의 특성을 조절하기 위해서 magnetron sputter에 pulse 또는 ICP (inductively coupled plasma) assisted 등을 적용하여 plasma 특성을 조절하는 방법 등에 관한 연구가 보고되고 있다. 본 연구에서는 pulsed magnetron sputtering 방식을 이용하여 증착된 Cu film 특성 변화를 확인하였다. 다양한 pulsing frequency와 pulsing duty ratio 조건에서, Si substrate 위에 증착된 Cu film과의 residual stress 변화를 측정하였다. Pulse duty ratio가 90% 에서 60%로 감소함에 따라서 Cu film의 residual stress가 감소하였고, pulsing frequency가 증가함에 따라 Cu film의 residual stress가 감소하는 것을 확인하였다. 증착 조건에 따른 plasma의 특성 분석을 위하여 oscilloscope를 이용하여 voltage와 current를 측정하였고, Plasma Sampling Mass spectrometer 를 이용하여 ion energy의 변화를 측정하였다. 이를 통해 plasma 특성 변화가 증착된 Cu film에 미치는 영향과 residual stress의 변화에 대한 연관성에 대하여 확인할 수 있었다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.2
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• pp.178-183
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• 2012

To simulate space thermal environment in thermal vacuum test, direct or in-direct heater has been applied on the radiator. Both of them, direct heater attached on the radiator and indirect heater with a distance from the radiator, simulate the heat fluxes from the Sun radiation, the Earth IR and Albedo. They also supply the heat fluxes to the radiator of spacecraft to achieve the target temperature according to thermal test conditions. In general, indirect heater is used when the heater is not allowed to attach on the radiator directly due to constraints of coating property or contamination. For in-direct heater design, it is needed to estimate the heat power to make the extreme test conditions and minimize the interference with heat exchange of radiator and shroud. In this study, optimized thermal design of in-direct heater is proposed and investigated by commercial S/W SINDA. The effective values of design factors are also derived.

• Aerospace Engineering and Technology
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• v.10 no.2
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• pp.20-28
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• 2011

The electro-optical payload of a low-earth orbit satellite is thermally decoupled with the bus, which supports a payload for a mission operation. The payload has a cooling unit of FPA(Focal Plane Assembly) which has a thermal behavior increasing its temperature instantly during an operation in order to dissipate a waste heat into the space. The FPA cooling unit should include a radiator and heatpipes with a sufficient performance in worst hot condition, and a heater design to maintain its temperature above a minimum allowable temperature in the worst cold condition. In this paper, we analyzed the thermal requirements and the heater design constraints from the thermal analysis results for the current thermal design of the FPA cooling unit and the design elements of the better heater design were found.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.47 no.4
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• pp.309-318
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• 2019

The thermal design of the Lunar Terrain Imager (LUTI) on the Korean Pathfinder Lunar Orbiter (KPLO) was performed and the soundness of the thermal design was verified by thermal analysis. The thermal environment of the lunar mission orbit should be reflected in the thermal design because the IR radiation of the lunar surface is important, unlike the earth orbit. The components or modules exposed to the outside of the satellite are insulated with MLI as much as possible, but the camera tube and the radiator are functionally exposed, so the thermal shield using the concept of radiation shape factor is mounted on the front to mitigate IR radiation. The IR emissivity is important in the front side of the radiator that receives little solar radiation, and components that are susceptible to thermal deformation such as the tube use a radiation heater to minimize the temperature gradient. Through the investigation of computational results, it was confirmed that the thermal design of LUTI is stable in various situations.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.729-737
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• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.1
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• pp.89-94
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• 2016

This study investigates the durability of the radiator and cooler of a laptop through a thermal analysis. In the result of this study, the maximum deformation happened at the part holding up the support stand at the radiator and cooler. The maximum thermal stress of the cooler was 60.939 Mpa, as low as that of the radiator. In addition, the safety factor of the cooler was 1.64 times as high as that of the radiator. The radiator of the laptop was less durable than the cooler. The result of this study could help with designing a laptop model with a durable radiator and cooler.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4398-4404
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• 2012

This thesis was conducted a numerical analysis on the radiant heat performance according to factors of design of heat sink for cooling of the automotive LED head lamp. The heat sinks were designed with 5 different types to fit the limited internal space by formula based on an existing product (Type 1). Designed heat sinks of five types were analyzed by ANSYS CFD V12.1, and the analysis results were compared with the existing type. The results of simulation were analyzed temperature distribution and average temperature, air flow characteristic, heat flux etc. This thesis was researched on the correlation of the cooling performance according to the heat sink structure and the fin shape. Through numerical analysis, could be confirmed heat sink Type 2 as the best results.

• Korean Journal of Optics and Photonics
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• v.25 no.6
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• pp.311-314
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• 2014

In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.129-135
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• 2015

This paper shows significant methods that improve the lifespan of LED modules as well as efficiently using an aluminum heat-sink for LED module in high power. It proposes a method that raises stability and lifespan to protect LED modules and the power unit when the LED module has been used for a long hours at high temperatures. During the research, we applied a method of pulse-width modulation (PWM) in order to prevent the phenomenon that the entire power of a system is turned off and the lifespan is reduced when the LED nodule reacts to the high temperatures. To protect the LED module and SMPS based on high efficiency, a temperature sensor is attached underneath the circuit board and the sensor measures the temperature of circuit board when the LED module is powered on. The electrical power connected to SMPS is controlled by PWM when the temperature of the LED module reaches a particular temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.247-247
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• 2012

기존형광등보다 에너지소비가 적고, 수명이 길다는 장점을 가진 LED소자는 조명분야뿐만 아니라 선박 및 해양플랜트시장에까지 적용분야가 확대되고 있다. 그러나 LED소자의 수명연장 및 제품신뢰성을 위해서 방열에 관한 연구가 필수적이며 특히, 해양환경적용을 위해서는 내부식성을 요구하는 방열 재료개발에 대한 연구가 필요하다. 일반적으로 방열판소재로 사용되는 알루미늄의 경우 열전도도가 우수하며, 대기 중에서 쉽게 생기는 자연산화막보다 내부식특성을 향상시키기 위해 현재 국내 외의 표면처리 방법으로 전기화학적 방법을 이용한 Anodizing기술을 적용하고 있다. 하지만, Anodizing에 사용되는 질산과 황산액을 처리하는 과정에서 유독물질을 발생시킴으로 유해물질사용제한 등 국제적으로 환경규제가 강화되고 있어 Anodizing기술의 적용이 제한적인 단점이 있다. 본 연구에서는 친환경적 기술인 Plasma Immersion Ion Implantation (PIII)방식을 사용하여 알루미늄표면에 $Al_2O_3$을 형성하였다. 최적의 산화막증착 조건을 찾기 위해 Gas Flow양, Pulse Voltage, 공정온도, 시간 등을 변수로 실험을 진행하였다. SIMS (Secondary ion mass spectroscopy)를 통해 $Al_2O_3$ 박막두께 및 Oxygen의 정량분석을 하였으며, Anodizing처리된 알루미늄시편과 열전도특성과 내부식특성을 비교하기 위해 각각 Hot Disk 열전도율측정기와 Salt water tester chamber를 사용하였다.