• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.117-119
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• 2002

A semiconductor cleaning technology has been based upon RCA cleaning which consumes vast amounts of chemicals and ultra pure water. This technology hence gives rise to many environmental issues, and some alternatives such as electrolyzed water are being studied. In this work, intentionally contaminated Si wafers were cleaned using the electrolyzed water. The electrolyzed waters were obtained in anode and cathode with oxidation reduction potentials and pH of -1050mV and 4.8, and -750mV and 10.0, respectively. The electrolyzed water deterioration was correlated with $CO_2$ concentration changes dissolved from air. Overflowing of electrolyzed water during cleaning particles resulted in the same cleanness as could be obtained with RCA clean. The roughness of patterned wafer surfaces after EW clean maintained that of as-received wafers. RCA clean consumed about $9\ell$ chemicals, while electrolyzed water clean did only $400m\ell$ HCl or $600m\ell$ $NH_4$Cl to clean 8" wafers in this study. It was hence concluded that electrolyzed water cleaning technology would be very effective for releasing environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.ring.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.127-129
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• 2002

In order to predict the moldability of an injection molded part, a simulation of filling is needed. Short shot is one of the most frequent troubles encountered during injection molding process. The adjustment of process conditions is the most economic way to troubleshoot the problematic short shot in cost and time since the mold doesn't need to be modified at all. But it is difficult to adjust the process conditions appropriately in no times since it requires an empirical knowledge of injection molding. In this paper, the intelligent CAE system synergistically combines fuzzy-neural network(FNN) for heuristic knowledge with CAE programs for analytical knowledge. To evaluate the intelligent algorithms, a cellular phone flip has been chosen as a finite element model and filling analyses have been performed with a commercial CAE software. As the results, the intelligent CAE system drastically reduces the troubleshooting time of short shot in comparison with the expert's conventional way which is similar to the golden section search algorithm.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.14-19
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• 2002

In this study, as Cu diffusion barrier, tantalum nitrides were successfully deposited on Si(100) substrate and SiO2 by plasma assisted atomic layer deposition(PAALD) and thermal ALD, using pentakis (ethylmethlyamino) tantalum (PEMAT) and $NH_3$ as precursors. The TaN films were deposited on $250^{\circ}$C by both method. The growth rates of TaN films were $0.8{\AA}$/cycle for PAALD and $0.75{\AA}$/cycle for thermal ALD. TaN films by PAALD showed good surface morphology and excellent step coverage for the trench with an aspect ratio of h/w - $1.8 : 0.12 \mu\textrm{m}$ but TaN films by thermal ALD showed bad step coverage for the same trench. The density for PAALD TaN was $11g/\textrm{cm}^3$ and one for thermal ALD TaN was $8.3g/\textrm{cm}^3$. TaN films had 3 atomic % carbon impurity and 4 atomic % oxygen impurity for PAALD and 12 atomic % carbon impurity and 9 atomic % oxygen impurity for thermal ALD. The barrier failure for Cu(200nm)/TaN(l0nm)/$SiO_2(85nm)$/Si structure was shown at temperature above $700^{\circ}$C by XRD, Cu etch pit analysis.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.54-58
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• 2002

The present paper is to investigate the phase stability and soft magnetic properties of amorphous CoNbZr films when Pd is added as a substitution for CoNbZr alloys. The films were prepared by a RF magnetron sputtering method. The CoNbZrPd films deposited on Si wafers exhibited amorphous structures being independent upon the amount of Pd added in the films. On the addition of 4.34% Pd, the excellent soft magnetic characteristics of the films were observed with a coercive force of 0.54 Oe and an anisotropy field of 11 Oe, whereas a coercive force of 1 Oe and an anisotropy field of 3.5 Oe were shown in the film without the addition of Pd. The increased anisotropy field and low coercive force of the films may be attributed to the occupancy of Pd in the preferred sites parallel to the external magnetic field applied on the deposition process. A permeability of about 1100 was kept constant in the operation frequency ranging up to 100 MHz, which can be explained by the Landau-Lifshitz formula.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.69-71
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• 2002

$(Bi, La)Ti_{3}O_{12}(BLT)$ ferroelectric thin films were prepared on $Al_{2}O_{3}/Si$ substrates by the sol-gel method. The as-coated films were post-annealed at the temperature of $650^{\circ}C$ and $700^{\circ}C$ for 30 min. The crystallinty, surface morphologies and electrical properties were affected by the annealing temperatures. The BLT films annealed at above $650^{\circ}C$ exhibited typical bismuth layered perovskite structures with (00$\ell$) preferred orientation. The granular shaped grains with a size of approximately 90nm was formed in the film sample annealed at $700^{\circ}C$. The memory window volatge of the BLT film was 2.5V. The leakage current of BLT films annealed at $650^{\circ}C$ was about $1\times10^{-7}A/\textrm{cm}^2$ at 3V.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.81-84
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• 2002

The effects of the isoelectronic AI-doping of GaN grown by metal organic chemical vapor deposition were investigated for the first time using scanning electron microscopy (SEM), Hall measurements, photoluminescence (PL), and time-resolved PL. When a certain amount of Al was incorporated into the GaN films, the room temperature photoluminescence intensity of the films was approximately two orders larger than that of the undoped GaN. More importantly, the electron mobility significantly increased from 130 for the undoped sample to $500\textrm{cm}^2/Vs$ for the sample grown at a TMAl flow rate of $10{\mu}mol/min$, while the unintentional background concentration only increased slightly relative to the TMAl flow. The incorporation of Al as an isoelectronic dopant into GaN was easy during MOCVD growth and significantly improved the optical and electrical properties of the film. This was believed to result from a reduction in the dislocation-related non-radiative recombination centers or certain other defects due to the isoelectronic Al-doping.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.117-121
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• 2003

In this paper, a micromachined low-loss and ultra wide band reflection-type phase shifter (RTPS) is proposed. The phase shifter shows a constant phase shift from 5 to 17 GHz and consists of two cascaded reflection-type phase shifter. Low-loss reflection termination consists of digital capacitive switches, and air-gap overlay CPW couplers are used in order to employ the low-loss 3 dB coupling. The fabricated phase shifter showed the 5 discrete states, $0^{\circ},{\;}22.5^{\circ},{\;}45^{\circ},{\;}67.5^{\circ},{\;}90^{\circ}$ respectively, the average insertion loss of 3.48 dB, and maximum rms phase error of ${\pm}1.80^{\circ}$ for the relative phase shift from $0^{\circ}{\;}to{\;}90^{\circ}$ over 5-17 GHz.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.163-168
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• 2003

In the present study, the piezoelectricity and polarization of multilayer ceramic actuator, being designed to stack PMN-PZ-PT ceramic layers and Ag-Pd electrode layers alternatively, were investigated under a consideration of geometric factor, the volume ratio of the ceramic to the electrode layers. The actuators were fabricated by tape casting of $0.2Pb(Mg_{1/3}Nb_{2/3)O_3-0.38PbZrO_3-0,42PbTiO_3$ followed by lamination and burnout & co-firing processes. The actuators of $10\times10\times0.6~2\textrm{mm}^3$ in size were formed in a way that $60 ~ 200\mu\textrm{m}$ thick were stacked alternatively with $5\mu\textrm{m}$ thick electrode layer. Increases in polarization and electric field-induced displacement with thickness of the ceramic layer were attributed to change of $90^{\circ}$/$180^{\circ}$ domain ratio, which was affected by interlayer internal stress. The piezoelectricity and actuation behaviors were found to depend upon the volume ratio (or thickness ratio) of ceramic to electrode layers.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.1-6
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• 2011

In this paper, the air flow induced by the rotating flat disk is numerically investigated in a hope to better understand the air flow structures inside the wax spin coater for a silicon wafer polishing station. Due to the complex inner geometry of actual spin coater such as the casing around the rotating ceramic block and servo motor, recirculation of air flow is inevitably found on the coating target if the internal space of spin coater is closed at the bottom and it could be the possible source of contamination on the wax coating. By numerical flow simulation, we found that it is necessary to install the air vent at the bottom and to apply the sufficient air suction in order to control the path of air flow and to eliminate the air recirculation zone above the spinning surface of coating target.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.133-139
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• 2019

The utilizations of ceramics in the modern industries are increasing due to the desirable combinations of electrical, mechanical and physical properties found in ceramics. Ceramic materials are brittle, hard, strong in compression, weak in shearing and tension which is prone to affect the defects such as scratch, crack and breakage during the machining. Generally, the defects of the ceramic machining are generated from the structural vibrations of the machine. In this study, the dynamic characteristics of a machining center for ceramic machining were investigated to analyze the structural vibrations for the improved stability. Frequency response test and computer simulation have been conducted for the analysis and the design improvement. The improved design is suggested to suppress vibrations for the higher stability of the machine and further to reduce vibrations. And the result shows that simple design alterations without any change of major parts of the machine can reduce the vibration of the machine effectively.