• Fiber Technology and Industry
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• v.8 no.1
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• pp.11-18
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• 2004

급속한 반도체 기술의 발전은 획기적인 컴퓨터 및 통신기술의 발전을 가져왔고 초고속 정보화를 가속화시켜 통신의 패러다임과 인류의 생활패턴을 바꾸어 놓았다. 또한 컴퓨터의 초소형 출력장치와 저장장치 및 센서나 음성 인식을 기반으로 한 컴퓨터 입력 방식의 변화, 이동통신 발전 등을 통합한 새로운 컴퓨팅 시대를 요구하고 있다. 1990년대까지의 컴퓨터 기술은 대형컴퓨터에서 고정형태의 개인용 컴퓨터로 발전하였고, 최근에는 노트북을 비롯한 여러 가지 형태의 휴대용 컴퓨터의 등장으로 컴퓨터를 가지고 다니는 포터블(portable) 시대를 지나 반도체와 통신 기술 등의 발전에 힘입어 몸에 지니는, 입고 다니는(wearable)웨어러블 시대에 접어들었다. 따라서 사용자의 몸에 부착시키고 다니면서 언제 어디서든지 컴퓨터와 네트워킹을 하여 사용할 수 있는 디지털 의류를 필요하게 되었다.(중략)

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.21-24
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• 2009

We investigated a nanoscale inertia sensor based on telescoping carbon nanotubes, using classical molecular dynamics simulations. The position of the telescoping nanotubes is controlled by the centrifugal force exerted by the rotation platform, thus, position shifts are determined by the capacitance between carbon nanotubes and the electrode, and the operating frequency of the carbon nanotube oscillator. This measurement system, tracking oscillations of the carbon nanotube oscillator, can be used as the sensor for numerous types of devices, such as motion detectors, accelerometers and acoustic sensors.

• IT SoC Magazine
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• s.6
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• pp.32-36
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• 2005

이번 전시회에서는 특히 핸드폰, PDA등 휴대기기관련 제품이 대세를 이뤄 전시되었으며, IT-SoC협회도 국내 10개 업체를 이끌고 한국관을 구성하여 참가하였다. 삼성전자는 200만 및 130만 화소 CMOS이미지센서, 휴대폰용QVGA급 TFT LCD드라이버 IC 선보였으며, 인텔은 PDA, PMP 등에 사용할 수 있는 프로세서를, TI와 르네사스는 각각 모바일 멀티미디어 프로세서인 오랩, SH모바일 등으로 관심을 끌었다. 이외에도 시그마텔 등 중소 반도체 업체들 대부분도 MP3P 등 휴대용 애플리케이션 반도체로 제조업체의 이목을 집중시켰다.

• Journal of the Semiconductor & Display Technology
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• v.6 no.2 s.19
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• pp.49-52
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• 2007

Characteristics of an active pixel switch readout circuit were studied by SPICE simulation. A simple readout circuit consists of an operation amplifier, a diode, and a down-counter was suggested, and its successful operation was verified by showing that the differences in the detected signal intensity are accordingly converted to modulation of the voltage pulses generated by the comparator. A scheme to use these pulses to generate the original image was also put forward.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.89-89
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• 1994

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2004.05a
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• pp.179-180
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• 2004

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1939-1941
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• 2005

• Proceedings of the Optical Society of Korea Conference
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• 2002.11a
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• pp.10-11
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• 2002

• Electrical & Electronic Materials
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• v.32 no.5
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• pp.31-41
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• 2019

• Journal of IKEEE
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• v.25 no.3
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• pp.578-583
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• 2021

This paper describes acceleration tests for reliability of semiconductors. It also describes AEC-Q100, international test standard for reliability of automotive semiconductors. Semiconductors can be used for dozens of years. So acceleration tests are essential to test potential problems over whole period of product where test time is minimized by applying intensive stresses. AEC-Q100 is a typical acceleration test in automotive semiconductors, and it is designed to find various failures in semiconductors and to analyze their causes of occurance. So it finds many problems in design and fabrication as well as it predicts lifetime and reliability of semiconductors. AEC-Q100 consists of 7 test groups such as accelerated environmental stress tests, accelerated lifetime simulation tests, package assembly integrity tests, die fabrication reliability tests, electrical verification tests, defect screening tests, and cavity package integrity tests. It has 4 grades from grade 0 to grade 3 based on operational temperature. AEC-Q101, Q102, Q103, Q104, and Q200 are applied to discrete semiconductors, optoelectronic semiconductors, sensors, multichip modules, and passive components, respectively.