• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2008.05a
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• pp.209-211
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• 2008

본 연구에서는 실리케이트 적색 형광체의 신뢰성을 향상시키기 위하여 $SiO_2$ 박막을 졸-겔(sol-gel) 방법으로 코팅하였으며, 봉지재의 종류에 따른 코팅된 형광체의 신뢰성 변화를 조사하였다. 졸-겔 코팅 후 형광체 표면을 관찰한 결과 졸-겔 코팅이 잘 이루어 졌음을 알 수 있었으며, 4회 코팅 후 박막의 두께는 약 150nm였다. 코팅하지 않은 형광체의 경우 봉지재에 따른 차이는 있었지만 500시간 경과 후 효율 감소율은 30% 이상이었으며 코팅 한 형광체의 경우는 에폭시, JCR6175가 10${\sim}$25%, EG6301은 10% 이내의 효율 감소율을 보였다. 한편 색좌표 경우 에폭시 봉지재가 약 0.02의 변화를 EG6301 봉지재의 경우 0.01 이내의 변화를 보였다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.10
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• pp.1049-1054
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• 2012

Continued advancements in organic materials have led to the development of organic devices that are thin, flexible, and lightweight and that can potentially be used as low-cost energy-conversion devices. While these devices have many advantages, the environmentally induced degradation of the active materials and the low-work-function electrodes remain a valid concern. Hence, many vacuum deposition processes have been applied to develop low-permeation barrier coatings. In this work, we present the results pertaining to the developed thin-film encapsulation. Multilayer encapsulation involves the use of $SiO_x$ or $SiN_x$ with parylene. The effective water vapor transmission rates were investigated using a Ca-corrosion test. The integration of the developed barrier layers was demonstrated by encapsulating pentacene/$C_{60}$ solar cells, and the results are presented.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.100.1-100.1
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• 2012

태양전지 모듈의 25년 이상 장기간 정상 발전을 위해 태양전지 모듈을 구성하는 부품 소재의 장기 열화메커니즘 연구가 중요시되고 있다. 결정질 및 박막 태양전지 모듈 내 셀을 보호하기 위한 봉지재(Encapsulation)로 다양한 폴리머 재료가 적용되고 있다. 봉지재 부품으로 적용되고 있는 에틸렌 비닐 아세테이트(Ethylene Vinyl Acetate, EVA)는 장기 열화특성 및 내구성 개선 연구가 중요하다. 따라서 EVA를 가속열화하여 열화메커니즘 분석과 25년 보증 내구성을 보유하고 있는지 연구가 필요하다. 본 연구에서는 EVA의 Ultraviolet(UV), 온도 복합 환경스트레스 조건을 적용한 가속시험을 수행하고 장기 열화메커니즘을 분석하였다. 수명 및 손상모델을 이용하여 실환경에서 변화하는 UV와 온도를 일정한 값으로 나타낼 수 있는 UV/온도 가속조건을 설계하였다. 이를 통해 UV/온도 가속조건을 설정하였고 1년 및 25년 동안 EVA에 인가되는 stress와 유사한 양을 인가할 수 있는 시험시간을 결정하였다. 시험 후 전자현미경, AFM, FT-IR, TGA, DSC 등의 분석을 통해 열화메커니즘을 도출하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.5
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• pp.523-528
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• 2012

A bendable electronic module is developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In the module, a thin silicon chip is embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. A set of tests are conducted for the purpose of qualification: thermal shock, high temperature storage, and autoclave tests. During the autoclave test, delamination occurs at many places within the module layers. To investigate the failure mechanism, moisture diffusion analysis is conducted for the interior of the module under the autoclave test condition. For the analysis, the hygroscopic characteristics of the encapsulating materials are experimentally determined. Analysis results indicate the moisture saturation process in the interior of the module under the autoclave test condition.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.5
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• pp.619-624
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• 2013

A bendable electronic module is developed. In this module, thin silicon electronic chips are embedded in a polymer-based encapsulating adhesive between flexible copper-clad polyimide layers. During the qualification test of a harshly thermal-hygroscopic complex loading condition, delaminations occur inside the module layers. A finite element model is developed for the module. To investigate the effect of hygroscopic stress on delamination, the results of the thermal and thermal-hygroscopic loads are compared. The analysis results reveal that the hygroscopic effect more strongly affects delamination than does the thermal effect. The potential failure mechanisms of the module are investigated based on the stress analysis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.2
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• pp.165-171
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• 2022

The SiO₂/TiO₂ multilayer thin films used for narrow band pass filter were fabricated using E-beam evaporation method. The narrow band pass filter was used to enhance the resolution of spectroscopy and sensor applications with near infrared (NIR) light source. The narrow band pass filter with multilayer thin films were designed with Essential Macleod program. The multilayers of SiO₂/TiO₂ with 32 layers were deposited on the silicon encapsulation of IR with peak wavelength (λ_p) of 660 nm and NIR LEDs with λ_p of 830 nm, 880 nm, and 955 nm. After NIR light passed through the narrow band pass filter, the full width of half maximum of 33.4~48.6 nm became narrow to 20~24 nm owing to the absorption of photons with short or long wavelength of designed band of 20 nm. The SiO₂/TiO₂ band pass filter fabricated in this study can be used for sensor, optoelectronics, and NIR spectroscopy applications.