• Journal of the Korean Magnetics Society
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• v.2 no.3
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• pp.277-281
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• 1992

We have designed, fabricated and tested an integrated planar DC SQUID which incorporates input coil and mofulation coil in thin film structure. The SQUID uses Nb /Al-oxide /Nb Josephson junctions and Pd shunt resistors, and the SQUID loop incorporates two rings connected in series forming figure '8' structure and has the advantage of a negligibly small circulating current for the spatially homogeneous noise fields. The devices were fabricated using photolithographic technique, RF magnetron sputtering, anodic oxidation for insulation and lift-off process. The preliminary test of the fabricated SQUID at 4.2 K showed that the flux-voltage characteristics were smooth enough to adopt standard readout system, and the voltage noise was too small to be measured by direct method and so the white noise was thought to be less than $10^{-4}\;{\phi}_o/\;\sqrt{H_z}$.

• Current Photovoltaic Research
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• v.8 no.3
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• pp.102-106
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• 2020

In this paper, the effect of MoSe₂ on the contact resistance (R_C) of the transparent conducting oxide (TCO) and Mo junction in the scribed P2 region of the Cu(In,Ga)Se₂ (CIGS) solar module was analyzed. The CIGS/Mo junction becomes ohmic-contact by MoSe₂, so the formation of the MoSe₂ layer is essential. However, the CIGS solar module has a TCO/MoSe₂/Mo junction in the P2 region due to structural differences from the cell. The contact resistance (R_C) of the P2 region was calculated using the transmission line method, and MoSe₂ was confirmed to increase R_C of the TCO/Mo junction. B doped ZnO (BZO) was used as TCO, and when BZO/MoSe₂ junction was formed, conduction band offset (CBO) of 0.6 eV was generated due to the difference in their electron affinities. It is expected that this CBO acts as a carrier transport barrier that disturbs the flow of current, resulting in increased R_C. In order to reduce the R_C caused by CBO, MoSe₂ must be made thin in a CIGS solar module.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.31-34
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• 2018

In this study, the feasibility of ZnO/Al/ZnO flexible transparent electrodes for future flexible optoelectronic devices was investigated. All depositions were performed on PET substrates. The thicknesses of the top and bottom ZnO layers were 5-70 nm and 2.5-20 nm, respectively. The highest visible light transmittance was recorded when the thicknesses of the top and bottom ZnO layers 30 nm and 2.5 nm, respectively. 62% optical transmittance (at the wavelength of 400 nm) and sheet resistance of $19{\Omega}/{\Box}$ were measured. After repetitive bending test at a curvature radius of 5 mm, the transmittance and sheet resistance did not change.

• Journal of the Korean Electrochemical Society
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• v.3 no.2
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• pp.121-126
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• 2000

The effect of electroless Ni and Cu plating on $LaNi_5$, $AB_5$ type hydrogen storage alloy was investigated by the various electrochemical techniques such as constant current charge-discharge test, cyclic voltammeoy, and a.c. impedance spectroscopy. Scanning electron microscopy and X-ray diffraction test were conducted for phenomenological logical analyses. Cyclic Voltammetry results show that activation characteristics, cycle life and reaction ,rate were improved through electroless Ni and Cu plating. Compared with bare $LaNi_5$ the charge transfer resistance of electrode was greatly reduced as charge-discharge cycle increases. Therefore, electroless Ni and Cu plating on $LaNi_5$ alloy tends to accelerate the early activation, increasing the cyclic lift of electrode.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.5
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• pp.241-246
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• 2003

The transparent conducting thin film of ATO (antimony-doped tin oxide) was successfully fabricated on$SiO_2$/glass substrate by a sol-gel dip coating method. The crystalline phase of the ATO thin film was identified as SnO$_2$ major phase and the film thickness was about 100 nm/layer at the withdrawal speed of 50 mm/minute. Optical transmittance and electrical resistivity of the 400 nm-thick ATO thin film which was annealed under nitrogen atmosphere were 84% and $5.0\times 10^{-3}\Omega \textrm{cm}$, respectively. It was found that the $SiO_2$ layer inhibited Na ion diffusion and the formation of impurities like $Na_2SnO_3$ or SnO while increasing Sb ion concentration and higher ratio of $Sb^{5+}/Sb^{3+}$in the film. Annealing at nitrogen atmosphere leads to the reduction of $Sn^{4+}$ as well as $Sb^{5+}$ resulting in decrease of the electrical resistivity of the film.

• Progress in Superconductivity and Cryogenics
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• v.6 no.3
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• pp.50-55
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• 2004

We fabricated and tested a resistive type superconducting fault current limiter (SFCL) of three-phase 6.6 $kV_{rms}/200 A_{rms}$ rating based on YBCO thin films grown on sapphire substrates with a diameter of 4 inches, Short circuit tests were carried out at a accredited test facility for single line-to- ground faults, phase-to-phase faults and three-phase faults, Each phase of the SFCL was composed of 8${\times}$6 elements connected in series and parallel respectively. Each element was designed to have the rated voltage of 600 $V_{rms}$. A NiCr shunt resistor of 23 Ω was connected to each element for simultaneous quenches. Firstly, single phase-to-ground fault tests were carried out. The SFCL successfully developed the impedance in the circuit within 0.12 msec after fault and controlled the fault current of 10 $kA_{rms} below 816 A_{peak}$ at the first half cycle. In addition, in case of phase-to-phase fault and three- phase fault test. simultaneous quenches among the SFCLs of the phases successfully accomplished. In conclusion. the SFCL showed excellent performance of current limitation upon fault and stable operation regardless of the amplitude of fault currents.

• Journal of Sensor Science and Technology
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• v.3 no.1
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• pp.5-11
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• 1994

This paper describes the characteristics of a piezoresistive pressure sensor fabricated on a SOI (Si-on-insulator) structure, in which the SOI structures of Si/$SiO_{2}$/Si and Si/$Al_{2}O_{3}$/Si were formed by SDB (Si-wafer direct bonding) technology and hetero-epitaxial growth, respectively. The SOI pressure sensors using the insulator of a SOI structure as the dielectrical isolation layer of piezoresistors, were operated at higher temperatures up to $300^{\circ}C$. In the case of pressure sensors using the insulator of a SOI structure as an etch-stop layer during the formation of thin Si diaphragms, the pressure sensitivity variation of the SOI pressure sensors was controlled to within a standard deviation of ${\pm}2.3%$ over 200 devices. Moreover, the pressure sensors fabricated on the double SOI ($Si/Al_{2}O_{3}/Si/SiO_{2}/Si$) structures formed by combining SDB technology with epitaxial growth also showed very excellent characteristics with high-temperature operation and high-resolution.

• Korean Journal of Materials Research
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• v.21 no.3
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• pp.174-179
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• 2011

Ultra-thin aluminum (Al) and tin (Sn) films were grown by dc magnetron sputtering on a glass substrate. The electrical resistance R of films was measured in-situ method during the film growth. Also transmission electron microscopy (TEM) study was carried out to observe the microstructure of the films. In the ultra-thin film study, an exact determination of a coalescence thickness and a continuous film thickness is very important. Therefore, we tried to measure the minimum thickness for continuous film (dmin) by means of a graphical method using a number of different y-values as a function of film thickness. The raw date obtained in this study provides a graph of in-situ resistance of metal film as a function of film thickness. For the Al film, there occurs a maximum value in a graph of in-situ electrical resistance versus film thickness. Using the results in this study, we could define clearly the minimum thickness for continuous film where the position of minimum values in the graph when we put the value of Rd3 to y-axis and the film thickness to x-axis. The measured values for the minimum thickness for continuous film are 21 nm and 16 nm for sputtered Al and Sn films, respectively. The new method for defining the minimum thickness for continuous film in this study can be utilized in a basic data when we design an ultra-thin film for the metallization application in nano-scale devices.

• Progress in Superconductivity
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• v.4 no.2
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• pp.137-143
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• 2003

In measuring the microwave surface resistance of high-Tc superconductor (HTS) films using the dielectric-loaded cavity resonator method, one of the most important factors that limit the measurement sensitivity is the measurement error in the loss tangent ($tan\delta$) of the dielectric rod placed inside the cavity. We have measured the effective surface resistance ( $R_{S}$ $^{eff}$) of$ YBa_2$$_Cu3$$_{7-{\delta}}$ (YBCO) films and the $tan\delta$ of rutile ($TiO_2$) using the 'two-tone'method suggested by Kobayashi et at. [IEEE, MTT-S Digest, 495, (2001)], which enables simultaneous measurements of both the $R_{S}$ $^{eff}$ fof HTS films and the $tan\delta$ of the rutile with high sensitivity. A rutile-loaded cavity resonator with the $TE_{012}$ and $TE_{021}$ resonant frequencies at 13.67 - 14.01 GHz is used for this purpose. At temperatures where the two modes do not couple with other modes, the $R_{S}$ $^{eff}$ of YBCO films and $tan\delta$ of rutile measured by the two-tone method appear to match well with the corresponding values measured using the reported $tan\delta$ values of sapphire within 10 %. Usefulness of the 'two-tone' method for microwave characterization of HTS films and dielectrics is discussed.d.ielectrics is discussed.ussed.

• The Korean Journal of Applied Statistics
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• v.27 no.4
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• pp.543-552
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• 2014

High bandwidth RF such as Bluetooth, GPRS, EDGE, 3GSM, HSDPA is papular in the mobile phone market. A non-conducting metal coating process requires an e-beam deposition of metal, two steps of UV hard coating primer and top coating; however, it is inefficient. We navigate to the electron beam irradiation conditions(resin surface treatment conditions) in the PC/ABS resin injection process. By analyzing the experimental results, we find the optimum development conditions for the electro deposition pre-treatment process and mass production lines using the plasma generated electron beam source.