• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.77-82
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• 2021

This numerical study focuses on the analysis of fume particle dispersion characteristics over the surface of target workpiece in laser micro-hole machining process. The effects of oblique stagnation flow over fume generating machining point are examined by carrying out a series of three-dimensional random particle simulations along with probabilistic particle generation model and particle drag correlation of low Reynolds number. Present computational model of fume particle dispersion is found to be capable of assessing and quantifying the fume particle contamination in precision hole machining which may influenced by different types of air flow patterns and their flow intensity. The particle size dependence on dispersion distance of fume particles from laser machining point is significant and the effects of increasing flow oblique angle are shown quite differently when slot blowing or slot suction flows are applied in micro-hole machining.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.230-235
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• 2003

In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, stain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu\textrm{m}$, 25 $\mu\textrm{m}$ micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with man holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover, burnish zone, fracture zone and it shows similar fracture behavior in shear band, but？ by high strain rate (10$^2$∼ 10$^3$s$\^$-1/) unlike macro hole fabrication and increment of relative grain size several different results are shown.

• Transactions of Materials Processing
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• v.12 no.4
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• pp.314-319
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• 2003

In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, strain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu$m, 25 $\mu$m micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with those of macro holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover. burnish zone, fracture zone and burr, and it shows similar fracture behavior in shear band. But by high strain rate (10$^2$∼10$^3$s$^{-1}$ ) condition unlike that of macro hole fabrication and by the increment of relative grain size in the direction of the workpiece thickness, fracture zone is not observed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.29-35
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• 2020

Car inspection systems are regularly carried out by the state to ensure the safety and emission status of cars, thereby improving the safety and quality of life by reducing fine dust and greenhouse gases that are the main culprits of vehicle defects and air pollution. These automobile inspections are largely divided into either regular or comprehensive inspections. This study analyzed the smoke measuring probes used in the lug - down 3 mode. In the previously issued paper "Improvement of Soot Probe Efficiency for Automotive Emission Measurement," an improved smoke measurement probe(B) improved on the problems that arise from the current smoke measurement probe (A). In this study, a technique that can improve the probe's inhalation efficiency over the improved (B) probes was applied to probes (C). Probe (C) involves a structure designed close to the center of the circumference of the exhaust pipe, and the suction efficiency was improved by adding a variable center unit.

• Journal of the Korean Solar Energy Society
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• v.31 no.4
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• pp.103-111
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• 2011

Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.36-41
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• 2017

In this paper, $Si_3N_4/hBN$ ceramics with various hexagonal boron nitride (hBN) contents (0, 10, 20, or 30 wt%) were fabricated via spark plasma sintering (SPS) at $1500^{\circ}C$, 50MPa, and 10m holding time. The material properties such as the relative density, hardness, and fracture toughness were systematically evaluated according to the hBN content in the $Si_3N_4/hBN$ ceramics. The results show that relative density, hardness, and fracture toughness continuously decreased as the hBN content increased. In addition, peak-step drilling (with tool diameter $500{\mu}m$) was performed to observe the effects of hBN content in micro-hole shape and cutting force. A machined hole diameter of $510{\mu}m$ (entrance) and stable cutting force were obtained at 30 wt% hBN content. Consequently, $Si_3N_4/30wt%$ hBN ceramic is a feasible material upon which to apply semi-conductor components, and this study is very meaningful for determining correlations between material properties and machining performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.370-370
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• 2008

ITO 박막은 현재 차세대 디스플레이인 LCD, PDP, ELD 등의 평판 디스플레이의 화소전극 및 공통전극으로 가장 많이 적용되고 있는 소재이며, 최근에는 태양전지의 투명전극으로 그 용도가 더욱 증가되고 있다. 이러한 소자들의 투명 전도막으로 사용되기 위해서는 가시광선 영역에서 80% 이상의 높은 투과도와 낮은 면 저항을 가져야 한다. 광 투과도와 면 저항은 ITO 박막의 증착조건에 따라 변하게 되는데 본 연구에서는 DC 마그네트론 스퍼터링법을 이용하여 Indium-Tin Oxide (ITO) 박막을 제작하고, 제작된 ITO 박막의 전기적 특성과 광학적 특성을 측정하여 공정조건에 따른 박막의 특성 변화를 평가하였다. 증착 조건은 주로 기판 온도와 증착 시간을 변화시켰다. 본 실험에서는 $In_2O_3$ : $SnO_2$의 조성비가 9:1 비율의 순도 99.99% ITO 타겟을 사용하였으며, coming 1737 glass를 30$\times$30 mm 크기로 가공하여 기판온도와 증착시간을 변화시키면서 ITO 박막을 제조하였다. 예비실험을 통해 인가전력 50W, 초기 진공 $2\times10^{-6}$ Torr, 작업 진공 $3.5\times10^{-2}$ Torr, 기판과 타겟 사이의 거리를 10 cm로 고정하였다. 기판 온도는 히터를 가열하지 않은 상온 ($25^{\circ}C$)에서 $400^{\circ}C$까지의 범위에서 변화시켰고, 증착시간은 5분에서 30분까지의 범위에서 변화시켰다. 증착된 박막의 면 저항 촉정을 위해 4 point probe를 사용하였고, 홀 (hall) 계수 측정기 (HMS-300)를 이용하여 홀 계수를 측정하였으며, 또한 박막의 두께는 $\alpha$-step을 사용하여 측정하였다. ITO 박막의 상분석을 위해 XRD를 사용 하였고, SEM을 이용하여 미세구조를 관찰하였다. 실험 결과로는 기판온도 $400^{\circ}C$, 증착시간 15분 이상에서는 면 저항이 모두 $8\Omega$/$\Box$이하로 낮게 나왔으며, 투과율 또한 모두 80% 이상의 높은 투과도를 보였다. 또한 ITO박막의 전기 전도도는 캐리어 농도와 이동도의 측정을 통해 두 가지 인자들에 의해 비례되는 것을 확인하였다.

• Journal of the Institute of Convergence Signal Processing
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• v.16 no.3
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• pp.90-95
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• 2015

This study presents a method to test quite small-sized and light-weighted micro-drill bits which are used to make holes in printed circuit boards(PCB). After getting images of micro-drill bits through the high resolution microscope, we developed image processing algorithms to detect fiducial points, and then measured diverse factors of the drill-bit based on these points. We also developed the window-based inspection system to automatically discriminate normal and abnormal status. For the relative comparison of its performance, the system was compared with an existing inspection system using test images. Experimental results showed that the proposed system slightly improved performance, and also classified correctly some misjudged errors which were occurred in the existing system.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Journal of Adhesion and Interface
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• v.13 no.2
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• pp.58-63
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• 2012

CFRP chip is the byproduct from carbon fiber reinforced plastic (CFRP) processing. CFRP chip is not simply a waste mainly composed of fine carbon fiber and epoxy resin. CFRP chip keeps matrix to maximize their reinforcing effect. To obtain a uniform length of carbon fiber in CFRP chip, chip was chopped ina mortar. CFRP chip should be purified to get better interface adhesion. Epoxy resin on the carbon fiber was removed by $H_2O_2$ surface etching treatment. Optimal dispersion and fabrication conditions of CFRP chip embedded in phenolic resin were determined by thermal stability for fire retardant applications. CFRP chip-phenolic composite exhibits better mechanical and thermal properties than neat phenolic resin. Surface condition of CFRP chip-phenolic composite was evaluated by static contact angle measurement. Contact angle of CFRP chip-phenolic composite was greater than neat phenolic due to heterogeneous condition of fine carbon fibers. From the evaluation for fire retardant (ASTM D635-06) test, thermal stability of CFRP chip-phenolic composite was found to be improved with higher concentration of CFRP chip.