• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.19-22
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• 2005

As the optical communication industry is developed, the demand of optical communication part is increasing. $ZrO_2$ ceramic ferrule is very important part which can determines the transmission efficiency and information quality to connect the optical fibers. In general $ZrO_2$ ceramic ferrule is manufactured by grinding process because the demands precision is very high. And the co-axle grinding process of $ZrO_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. When co-axle grinding of ferrule supported by two pin, pin chucking alignment accuracy is very important. This paper deals with the analysis of the chucking alignment experiment with parallel error on the micro feeding equipment. Thus, if possible be finding highly good the chucking alignment of two pin.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.161-166
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• 2010

Elastomeric seals are widely used in dynamic seal applications, and it is well known that the sealing surfaces can be gradually worn out. Abrasive wear is known to be the most dominant factor; however, little research has been carried out on this problem until now. In this study, a new contact problem related to elastomeric seals-a small spherical particle and steel surface-was modeled and analyzed using MARC. Variations of von-Mises and residual stress distributions as well as deformed seal and steel surface shapes with seal materials and interferences are presented. The stress distribution and surface deformation are highly affected by the elastic properties of seal. For PTFE, the maximum von-Mises stress exceeds the yield strength, and plastic deformation occurs on the steel surface. Therefore, the sealing surface can also be worn down by sub-surface fatigue due to intervening hard particles in the sealing surfaces together with the well-known abrasion.

• Korean Journal of Materials Research
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• v.21 no.6
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• pp.334-340
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• 2011

Saw wires have been widely used in industries to slice silicon (Si) ingots into thin wafers for semiconductor fabrication. This study investigated the microstructural and mechanical properties, such as abrasive wear and tensile properties, of a saw wire sample of 0.84 wt.% carbon steel with a 120 ${\mu}M$ diameter. The samples were subjected to heat treatment at different linear velocities of the wire during the patenting process and two different wear tests were performed, 2-body abrasive wear (grinding) and 3-body abrasive wear (rolling wear) tests. With an increasing linear velocity of the wire, the tensile strength and microhardness of the samples increased, whereas the interlamellar spacing in a pearlite structure decreased. The wear properties from the grinding and rolling wear tests exhibited an opposite tendency. The weight loss resulting from grinding was mainly affected by the tensile strength and microhardness, while the diameter loss obtained from rolling wear was affected by elongation or ductility of the samples. This result demonstrates that the wear mechanism in the 3-body wear test is much different from that for the 2-body abrasive wear test. The ultra-high tensile strength of the saw wire produced by the drawing process was attributed to the pearlite microstructure with very small interlamellar spacing as well as the high density of dislocation.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.