• 한국광학회:학술대회논문집
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• 한국광학회 2000년도 하계학술발표회
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• pp.48-49
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• 2000

최근 몇 년 동안 레이저는 품질과 신뢰성의 계속적인 향상으로 인하여 여러 산업 응용분야에서 폭넓게 사용되어 지고 있다. 재료가공에 있어서 레이저의 적용분야는 금속의 절단, 용접 및 드릴링, 세라믹의 스크라이빙, 플라스틱과 복합재료의 절단 및 여러 가지 재료의 마킹, 등을 포함한다. 이러한 가공 메카니즘은 레이저의 조사에 의하여 재료를 용융, 증발시키는 열적 메카니즘이다. 특히 요즘에는 자외선 영역의 조사와 높은 빔의 세기에 의해 다른 종류의 에너지 전달 메카니즘이 가능한 UV 영역의 엑사이머 레이저의 사용이 증가하고 있다.$^{(1)}$ 이러한 엑사이머 레이저가 기존의 다른 레이저에 비해서 갖는 이점은 다음과 같다. 첫째, 모든 금속이 엑사이머 레이저에 대해서는 높은 흡수율을 가지므로 레이저 에너지가 가공 에너지로 효율적으로 변환되기 때문에 얇은 표면층에서 완전히 흡수하게 된다. (중략)

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.161-166
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• 2003

The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\phi50\mu m$ micro-drill which is coated with diamond is used for drilling of super micro-hole sizes. For the machining of taper parts of entrance and exit, drill having $\phi50\mu\textrm{mm}$ inclination angle $20^{\circ}$and angle $30^{\circ}$ is used. This is useful for anti tool-breakage and excessive too-wear in drilling process. After micro-drilling, the polishing process by diamond abrasive and polishing wood s carried out for increasing surface roughness.

• 한국기계가공학회지
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• 제9권5호
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• pp.1-6
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• 2010

The wavelet transform is a popular tool for studying intermittent and localized phenomena in signals. In this study the wavelet transform of cutting force signals was conducted for the detection of a tool failure in turning process. We used the Daubechies wavelet analyzing function to detect a sudden change in cutting signal level. A preliminary stepped workpiece which had intentionally a hard condition was cut by the inserted cermet tool and a tool dynamometer obtained cutting force signals. From the results of the wavelet transform, the obtained signals were divided into approximation terms and detailed terms. At tool failure, the approximation signals were suddenly increased and the detailed signals were extremely oscillated just before tool failure.

• 한국레이저가공학회지
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• 제18권2호
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• pp.11-13
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• 2015

Pressure-drop in a micro-channel is critical when a hole diameter is less then 100um with the high aspect ratio, more than 40. To minimize these pressure loss for micro-channel applications is important and there would be the best hole diameter, taper angle, and their combinations. In this work, the parametric study for laser drilling of anodized material is conducted to obtain the micro-channel hole with high aspect ratio.

• 한국정밀공학회지
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• 제13권12호
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• pp.46-53
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• 1996

Micro drilling is one of the most important machining types and its necessity becomes more and more increasing in the whole field of industry. Micro drilling, however, has few the case of practical application, because it requests high techniques : manufacturing micro drill, treating chip, producting precise hole shape and progressing machining effeciency. Micro drilling has a technical problem: drill breakage from the lack of drill rigdity and the interuption of chip. It is, therefore, essential to select the proper cutting conditions and the step fed for the method solving the lack of rigidity and the interruption of chip. Especially, step feed is very efficient to avoid the breakage of drill, but bring about reducing of cutting efficiency. The study on step feed must be requested more than the present in the near future. The purpose of this paper is to investigate experimentally about cutting conditions which affect on tools and round errors and to estimate about the effect of step feed as well as optimal step feed size to solve the breakage of drill.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1064-1067
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• 2001

Micro drilling is used in the production of fuel injection nozzle, watch, camera, air bearing and pinted circuit boards(PCB) are demanded for high precision. Recently industries of precision production require more small hole, high aspect ratio and high speed working for micro deep hole drilling. But the undesirable characteristics of micro drilling is the small signal to noise ratios, wandering motion of drill, high aspect ratio and the increase of cutting force as cutting depth increase. So in this paper to obtain the optimization of cutting condition a study on the characteristics of micro deep hole drilling used Tool dynamometer is proposed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.976-979
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• 2002

This research presents the new method to fabricate small features through applying chemical mechanical micro machining(C3M) for Al5052 and single crystal silicon. To improve machinability of ductile and brittle material, reacted layer was formed on the surface before micro-drilling process by chemical reaction with $HNO_3$(10wt%) and KOH(10wt%). And then workpieces were machined to compare conventional micro-drilling process with newly suggested one. To evaluate whether or not the machinability was improved by the effect of chemical condition, surface defects such as burr, chipping and crack generation were measured. Finally, it is confirmed that C3M is one of the feasible tools for micro machining with the aid of effect of the chemical reaction.

• 한국기계가공학회지
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• 제11권5호
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• pp.142-147
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• 2012

Machining tool conditions directly affect to quality of product and productivity of manufacturing. Many researches performed for tool condition monitoring in machining process to improve quality and productivity. Conventional methods use characteristics of signal for cutting force, motor current consumption, vibration of machine tools and machining sound. Recently, diameter of machining tool is become smaller for minimizing of mechanical parts. Tool condition monitoring using conventional methods are relatively difficult because micro machining using small diameter tool has low machining load and high cutting speed. These days, the direct monitoring for tool conditions using vision system is performed actively. But, vision system is affected by external conditions such as back ground of image and illumination. In this study, minimizing technology of external conditions using distribution analysis of image data are developed in micro machining using small diameter drill and tap. The image data is gathered from vision system. Several sets of experiment results are performed to verify the characteristics of the proposed machining technology.

• 한국정밀공학회지
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• 제27권10호
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• 한국기계가공학회지
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• 제16권1호
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• pp.36-41
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• 2017

In this paper, $Si_3N_4/hBN$ ceramics with various hexagonal boron nitride (hBN) contents (0, 10, 20, or 30 wt%) were fabricated via spark plasma sintering (SPS) at $1500^{\circ}C$, 50MPa, and 10m holding time. The material properties such as the relative density, hardness, and fracture toughness were systematically evaluated according to the hBN content in the $Si_3N_4/hBN$ ceramics. The results show that relative density, hardness, and fracture toughness continuously decreased as the hBN content increased. In addition, peak-step drilling (with tool diameter $500{\mu}m$) was performed to observe the effects of hBN content in micro-hole shape and cutting force. A machined hole diameter of $510{\mu}m$ (entrance) and stable cutting force were obtained at 30 wt% hBN content. Consequently, $Si_3N_4/30wt%$ hBN ceramic is a feasible material upon which to apply semi-conductor components, and this study is very meaningful for determining correlations between material properties and machining performance.