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40 W급 고출력 MMIC 개발과 고출력 증폭기 모듈 결합을 통한 Ku 밴드 반도체형 송신기(SSPA) 개발에 관한 연구 (Study on the Ku band Solid-State Power Amplifier(SSPA) through the 40 W-grade High Power MMIC Development and the Combination of High Power Modules)

  • 나경일;박재웅;이영완;김혁;강현철;김소수
    • 한국군사과학기술학회지
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    • 제26권3호
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    • pp.227-233
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    • 2023
  • In this paper, to substitute the existing TWTA(Travailing Wave Tube Amplifier) component in small radar system, we developed the Ku band SSPA(Solid-State Power Amplifier) based on the fabrication of power MMIC (Monolithic Microwave Integrated Circuit) chips. For the development of the 500 W SSPA, the 40 W-grade power MMIC was designed by ADS(Advanced Design System) at Keysight company with UMS GH015 library, and was processed by UMS foundry service. And 70 W main power modules were achieved the 2-way T-junction combiner method by using the 40 W-grade power MMICs. Finally, the 500 W SSPA was fabricated by the wave guide type power divider between the drive power amplifier and power modules, and power combiner with same type between power modules and output port. The electrical properties of this SSPA had 504 W output power, -58.11 dBc spurious, 1.74 °/us phase variation, and -143 dBm/Hz noise level.