• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.1
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• pp.61-70
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• 2008

This paper presents the flexible MEMS transmitter based on flexible printed circuit board or FPCB, which can be transformed to arbitrary shape. The FPCB is suitable to fabricate light weight and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface due to its flexible enough to be lolled up like paper. In this paper, the flexible MEMS transmitter integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing(OFDM) communication system is proposed. The active device of the proposed flexible MEMS transmitter is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. Moreover, the passive devices such as the filter and signal lines are integrated and fabricated on the FPCB board. The performance of the fabricated flexible MEMS transmitter is analyzed with EVM characteristics of the output signal.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.8 s.227
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• pp.1065-1074
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• 2004

A robust optimal design considering fabrication influence has been performed for the decoupled vibratory microgyroscope fabricated by the bulk micromachining. For the analysis of the gyroscope, a design tool has been developed, by which user can perform the system level design considering electric signal process and the fabrication influence as well as mechanical characteristics. An initial design of the gyroscope is performed satisfying the performances of scale factor (or sensitivity) and phase delay, which depend on the frequency difference between driving and sensing resonant frequencies. The objective functions are formulated in order to reduce the variances of the frequency difference and the frequency in itself by fabrication error. To certify the results, the standard deviations are calculated through the Monte Caries Simulation (MCS) and compared initial deviation that is measured fabricated gyroscope chip.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.81-82
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• 2005

새로운 고 용량 광 저장 시스템 개발을 위하여 초 미세 개구를 가지는 마이크로 프로브 어레이시스템 완성을 목표로 연구를 진행하였다. 효율적인 초 미세 개구 생성을 위해 기존의 제작된 마이크로 프로브 위에 FIB 공정을 이용하여 40nm 크기를 가지는 어퍼쳐를 만들었다. 나노 어퍼쳐를 가지는 마이크로 프로브 어레이는 곧 마이크로 렌즈와 VCSEL 과 일체화된 광 기록 헤드시스템으로 준비될 예정이다. 멤스 공정을 이용한 이 시스템은 향후 높은 저장 용량과 빠른 전송속도를 달성할 수 있는 차세대 광정보저장기기에 적용 가능한 새로운 광 픽업 시스템을 발전시킬 수 있을 것으로 생각된다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2450-2456
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• 2002

Microlenses and microlens arrays are fabricated using a novel fabrication technology based on the exposure of a resist (usually PMMA) to deep X-rays and subsequent thermal treatment. The fabrication technology is very simple and produces microlenses and microlens arrays with good surface roughness (less than 1 nm). The molecular weight and glass transition temperature of PMMA is reduced when it is irradiated with deep X-rays. The microlenses is produced through the effects of volume change, surface tension, and reflow during thermal treatment of irradiated PMMA. The geometry of the microlens is determined by parameters such as the X-ray dose applied to the PMMA, the diameter of the microlens, along with the heating temperature, heating time, and cooling rate in the thermal treatment. Microlenses are produced with diameters ranging from 30 to 1500 ${\mu}{\textrm}{m}$. The modified LIGA process is used not only to construct hemispherical microlenses but also structures that are rectangular-shaped, star-shaped, etc.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1522-1526
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• 2005

In this study, the fabrication of large area silicon mirror is accomplished by anisotropic etching using MEMS for implementation of integrated optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafer using wet etching. In addition rough surface of the mirror is achieved in case of long etching time. Hence a novel method called magnetorheolocal finishing is introduced to enhancing the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.1
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• pp.1-6
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• 2011

We have developed the process of forming one body S-type cantilever probe in the recessed trench for fine-pitched MEMS probe card. The probe (cantilever beam and pyramid tip) was formed using Deep RIE etching and wet etching. The pyramid tip was formed by the wet etching using KOH and TMAH. The process of forming the curved probe was also developed by the wet etching. Therefore, the fabricated probe is applicable for the probe card for DRAM, Flash memory and RF devices tests and probe tip for IC test socket.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1932-1934
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• 2003

본 논문은 신경전달물질 중 우울증, 신부전증의 지표 물질인 세로토닌의 농도를 극미량의 시료를 사용하여 정량할 수 있는 방법을 개발하기 위해 초소형 효소 고정화 전극을 개발하였다. 전극은 실리콘 웨이퍼 상에 반도체 공정을 이용하여 마이크로 크기의 Pt 박막 전극을 제작하였고, 전기화학적 방법으로 pyrrole 단량체를 Pt 전극 상에 순환전압전류법을 이용하여 산화적으로 전기 중합하였다. 효소의 고정은 일정 전압을 인가한 시간대 전류법으로 고정화하였다. 제작된 전극은 시간대 전류법으로 세로토닌의 농도에 따른 감도를 측정하였다. 세로토닌의 농도 범위 $1.0{\mu}mol/L{\sim}10mmol/L$에서의 감도는 $7.0{\mu}$A/decade를 나타내었으며, 실험결과에 따라 전극의 표면에서 발생하는 전류는 세로토닌의 농도에 비례함을 알 수 있었다. 전극의 표면분석은 Scanning Electron Microscopy(SEM), Energy Dispersive X-ray Spectroscopy(EDX) 그리고 Auger Electron Spectroscopy(AES)를 이용하여 분석하였다.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.1
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• pp.128-133
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• 2013

Si Nanowire (Si-NW) arrays were fabricated by top-down method. A relatively simple method is suggested to fabricate suspended silicon nanowire arrays. This method allows for the production of suspended silicon nanowire arrays using anisotropic wet etching and conventional MEMS method of SOI (Silicon-On-Insulator) wafer. The dimensions of the fabricated nanowire arrays with the proposed method were evaluated and their effects on the Field Effect Transistor (FET) characteristics were discussed. Current-voltage (I-V) characteristics of the device with nanowire arrays were measured using a probe station and a semiconductor analyzer. The electrical properties of the device were characterized through leakage current, dielectric property, and threshold voltage. The results implied that the electrical characteristics of the fabricated device show the potential of being ion-selective field effect transistors (ISFETs) sensors.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1857-1863
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• 2010

We present the fabrication and characterization of transparent carbon nanotube film (CNF) piezoresistors. CNFs were fabricated by vacuum filtration methods with 65?92% transmittance and patterned on Au-deposited silicon wafer by photolithography and dry etching. The patterned CNFs were transferred onto poly-dimethysiloxane (PDMS) using the weak adhesion property between the silicon wafer and the Au layer. The transferred CNFs were confirmed to be piezoresistors using the equation of concentrated-force-derived resistance change. The gauge factor of the CNFs was measured to range from 10 to 20 as the resistance of the CNFs increased with applied pressure. In polymer microelectromechanical systems, CNF piezoresistors are the promising materials because of their high sensitivity and low-temperature process.