• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.56-56
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• 2004

• Magazine of the Korea Concrete Institute
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• v.24 no.2
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• pp.43-47
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• 2012

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.156-156
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.11-15
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• 2017

As the heat dissipation problem is increased in 3D multi flip chip packages, an improvement of thermal conductivity in bonding interfaces is required. In this study, the effect of alumina filler addition was investigated in non-conductive paste(NCP). The fine alumina filler having average particles size of 400 nm for the fine pitch interconnection was used. As the alumina filler content was increased from 0 to 60 wt%, the thermal conductivity of the cured product was increased up to 0.654 W/mK at 60 wt%. It was higher value than 0.501 W/mK which was reported for the same amount of silica. It was also found out that the addition of fine sized alumina filler resulted in the smaller decrease in thermal conductivity than the larger sized particles. The viscosity of NCP with alumina addition was increased sharply at the level of 40 wt%. It was due to the increase of the interaction between the filler particles according to the finer particle size. In order to achieve the appropriate viscosity and excellent thermal conductivity with fine alumina fillers, the highly efficient dispersion process was considered to be important.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.33-37
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• 2019

In this study, the graded thermal properties of composites are obtained by difference in specific gravity of fillers including Cu, h-BN and GO powders in epoxy. Relatively heavy powders such as Cu and h-BN compared to GO mostly at the bottom layer, while light GO powders were dispersed in the top layer in the composites. The thermal conductivity of composites was gradually increased from 0.55 (0.52) W/mK to 2.82 (1.37) W/mK for GO/h-BN (GO/Cu) epoxy composites from surface to bottom. On the contrary, the coefficient of thermal expansion was decreased from 51 ppm/℃ to 23 ppm/℃ and from 57 ppm/℃ to 32 ppm/℃ for GO/Cu and GO/h-BN, respectively. The variation of thermal properties in composites is attributed due to intrinsic material properties of filler including thermal conductivity, morphology and the distribution by the specific weight of fillers. This simple strategy for realizing graded thermal composites by introducing different filler materials would be effective heat transfer at interface of heterostructure with large thermal properties such as inorganic semiconductor/plastic, metal/plastic, and semiconductor/metal.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.04a
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• pp.45-48
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• 2007

Conventional force sensors such as piezoelectric sensor has limitations for measuring micro/nano-scale thrust. In this study we developed nano-scale measurement system using laser displacement sensor and cantilever. And electrospray microthruster was fabricated by using stainless capillary and extraction electrode, to generate nano-scale thrust. The measurement system can measure the around 90 nN thrust from this thruster. In addition, we designed and fabricated electrospray micro thruster based on PMMA(Polymethyl methacrylate), which has a nozzle protruded from the substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.107-107
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• 2009

Micro pillar structure was investigated for the energy havesting applications. The micro pillar structures were investigated to find proper size of pillars. In this experiments, the aspect ratio between the height and diameter were changed to extract maximum peizoelectric coefficient. We proposed the idea and model for the energy harvesting systems based on the micro-pillar structure.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.21-27
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• 2000

To develop the underfill materials which are required for the new process of semi-conductor industry, the properties of epoxy/anhydride/cobalt(II) catalyst system with two types of fused silica(1 $\mu\textrm{m}$, 8 $\mu\textrm{m}$) are studied as a function of filler fraction. According to the curing profile, the optimum catalyst amount was 1.0 wt% for full curing at the conditions of $160^{\circ}C$/l5 min., and we could conclude that the viscosity has superior effect on the real flaw through the relationship between surface tension and viscosity data. The underfills which were filled with 1 $\mu\textrm{m}$ fused silica did not show good flowability, but they should be useful by improving the viscosity for a future process which has small gaps. The underfills which were filled with 8 $\mu\textrm{m}$ fused silica showed good flowability when the filler contents were 55~60 vol%. The model which was referred by Matthew can predict the real flow length only when the underfill has high viscosity and low surface tension.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1599-1600
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• 2011

현재 사용되는 전력기기와 전기에너지로 구동되는 기기등은 환경 조화와 에너지 절약을 목표로 고전압 대용량화, 축소 소형화 및 고효율화가 진행되는 과정에 있다. 이런 기기들은 전위를 유지하기 위해서 전기절연기술이 필수적이다. 특히 전기절연재료의 역할이 중요해서 재료의 특성이 기기전체의 종합성능을 지배하기도 한다. 본 연구에서는 몰드 변압기의 절연수지로 사용되는 에폭시 복합체와 마이크로 $SiO_2$와 Ag 각 시편의 열팽창률과 유전 특성 및 온도에 따른 절연파괴강도를 측정하여 열적 특성 및 전기적 특성을 검토하고 분석한다.

• Korean Chemical Engineering Research
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• v.48 no.4
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• pp.470-474
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• 2010

In this study, we presents a simple microfluidic approach for generating uniform Poly(ethylene glycol)(PEG) microfiber. Elongated flow pattern of monomer induced by sheath flow of immiscible oil as continuous phase is generated in Y-shape junction and in situ polymerization by UV exposure. For uniform microfiber, we investigate the optimized flow condition and draw phase diagram as function of Ca and Qd. At the region for stable elongated flow pattern, the microfiber generated in microfluidic chip is very uniform and highly reproducible. Importantly, the thickness of microfibers can be easily controlled by flow rate of continuous and disperse phase. We also demonstrate the feasibility for biological application as encapsulating FITC-BSA in PEG microfiber.