• Title/Summary/Keyword: 마더보드

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A quantitative test method for assessing solder joint reliability of FCBGA packages (FCBGA의 솔더조인트 신뢰성 보증을 위한 정량적인 시험법)

  • Go, Byeong-Gak;Park, Bu-Hui;Kim, Gang-Dong;Jang, Jung-Sun
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 2005.05a
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    • pp.933-937
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    • 2005
  • FCBGA가 마더보드에 실장된 후 솔더 조인트에 균열이 생기면 단선이 발생한다. 솔더 조인트의 신뢰성을 평가하기 위한 방법 중 전단강도시험(shear test)은 약한 솔더 조인트를 판별하기 어려워 양품 로트와 불량 로트를 구별할 수 없으며, 인장강도시험(pull test)은 솔더 볼의 위치별 산포가 크고, peel test는 품질을 정량적으로 나타낼 수 없는 등의 문제가 있다. 새로운 시험 방법은 Area Pull Test(이하 APT)라 명명했으며 peel test와 pull test를 합한 개념으로서, 시험 샘플을 만드는 과정은 peel test와 동일하다. 솔더 조인트의 인장강도 측정은 지그를 만들어서 FCBGA 전체를 당겨서 측정하였다. 샘플은 Ni도금 두께를 3, 5, 8 ${\mu}m$로 제작하여 불량(3${\mu}m$), 양품으로 구분하였고, 양품 또한 품질 수준을 두가지(5,8${\mu}m$)로 나누었다. 그 결과 peel test 기준에 의거한 불량, 양품을 정량적인 수치(인장강도)로 판별할 수 있었으며, 솔더 조인트의 파괴모드별 인장강도를 구분 할 수 있었다.

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Cleanliness Test by Spray-Type Cleaning Agent for Electronic and Semiconductor Equipment (전자·반도체용 스프레이 분사형 세정제에 대한 청정도 평가)

  • Heo, Hyo Jung;Row, Kyung Ho
    • Korean Chemical Engineering Research
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    • v.47 no.6
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    • pp.688-694
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    • 2009
  • A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study the cleanliness test and efficiency. In order to choose alternative environmental-friendly cleaning agents, it is important that the systematic selection procedures should be introduced and applied through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. A novel cleaning evaluation method with scanning electron microscopy/energy-dispersive X-ray analysis of surface observation evaluation method and an infra-red thermography camera(THERMOVISION A20 model) was studied in this work. The sound card(CT-2770 model) cut by $2{\times}2cm$ size was used as a part, and before and after the spray cleaning, the cleanliness was observed by the image analyzer of SEM and further the removal efficiency of dust was quantitatively evaluated by the component analysis of EDX. For the parts of P4TE model motherboard and IPC-A-36 PCB plate, before and after the spray cleaning, temperature differences were measured and compared at room temperature and 50 oven temperature by an infra-red thermography camera in the contaminants of dust and iron powder.