• Title/Summary/Keyword: 리테이너

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Development of Bonding Dispenser and Press Machine to Regenerate Retainer Ring for Semiconductor CMP Process (반도체 CMP 공정용 리테이너 링 재생을 위한 본딩 디스펜서 및 프레스 머신 개발)

  • Hyoung-Keun Park
    • The Journal of the Korea institute of electronic communication sciences
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    • v.19 no.3
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    • pp.507-514
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    • 2024
  • In the semiconductor manufacturing line, continuous efforts are being made to reduce the cost of products produced, and the demand for this is accelerating in the chemical mechanical polishing(CMP) process, and a representative example of these cost reduction items is the 5-Zone Ring. After about 150 hours of use in the CMP process, the thickness of the ring decreases to less than 1 mm and must be replaced with a new product. Therefore, in this study, bonding dispensers and press machines with a dispensing amount error of 10g±0.8% or less and a pressure uniformity of ±1.8% or less were developed to reduce semiconductor manufacturing costs by repeatedly regenerating worn parts of the retainer ring, and to minimize environmental pollution caused by industrial waste treatment.

Strength Assessment of High-Pressure Ball Valve for Topside Process Unit (해양플랜트 탑사이드용 고압 볼밸브에 대한 구조 안전성 평가)

  • Oh, Jeong-Sik;Kim, Yooil;Jeong, Nakshin;Kim, Sangmyung
    • Journal of Ocean Engineering and Technology
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    • v.30 no.2
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    • pp.100-108
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    • 2016
  • A high-pressure ball valve was developed, and both the structural strength and sealing performance were assessed based on a nonlinear finite element analysis. Different parts were modeled with solid elements and assembled, taking into account both contact and sliding effects. Three different loading scenarios were analyzed, including a high-pressure closure test and fire and shell test conditions. The structural safety of each part was checked under each loading condition, and the sealing performance was also investigated to validate the performance of the valve.

Analysis of Material Removal Rate Profile and Stress Distribution According to Retainer Pressure (CMP에서 리테이너링의 압력에 따른 연마율 프로파일과 응력 분포 해석)

  • Lee, Hyun-Seop;Lee, Sang-Jik;Jeong, Suk-Hoon;An, Joon-Ho;Jeong, Hea-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.482-483
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    • 2009
  • In chemical mechanical planarization (CMP) process, the uniformity of stress acting on wafer surface is a key factor for uniform material removal of thin film especially in the oxide CMP. In this paper, we analyze the stress on the contact region between wafer and pad with finite-element analysis (FEA). The setting pressure acting on wafer back side was $500g/cm^2$ and the retainer pressure was changed from 300 to $700g/cm^2$. The polishing test is also done with the same conditions. The material removal rate profiles well-matched with stress distribution.

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Prediction of Shearing Die Life for Producing a Retainer using FE Analysis (유한요소해석을 이용한 리테이너 전단 금형 수명예측)

  • Lee, I.K.;Lee, S.Y.;Lee, S.K.;Jeong, M.S.;Seo, P.K.;Lee, K.H.;Kim, B.M.
    • Transactions of Materials Processing
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    • v.24 no.4
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    • pp.264-271
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    • 2015
  • In the current study, a method was proposed to quantitatively predict the wear and fatigue life of a shearing die in order to determine an effective replacement period for the die. The shearing die model of a retainer manufacturing process was used for the proposed method of quantitative life prediction. The retainer is produced through shearing steps, such as piercing and notching. The shearing die of the retainer is carefully controlled because the dimensional accuracy of the retainer is critical. The fatigue life for the shearing die was predicted using ANSYS considering S-N curves of STD11 and Gerber’s equation. The wear life for the shearing die was predicted using DEFORM-3D considering the Archard’s wear model. Experimental shearing of the retainer was conducted to verify the effectiveness of the proposed method for predicting die life. The fatigue failure of the shearing die was macroscopically measured. The wear depth was measured using a 3D coordinate measuring machine. The results showed that the wear and fatigue life in the FE analysis agree well with the experimental results.

Design Characteristics for Water Lubricated Ball Bearing Retainer (수윤활 볼베어링의 리테이너 설계 특성)

  • Lee Jae-Seon;Choi Suhn;Kim Ji-Ho;Park Keun-Bae;Zee Sung-Quun
    • Tribology and Lubricants
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    • v.21 no.6
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    • pp.278-282
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    • 2005
  • Deep groove ball bearing is installed in a control element of an integral nuclear reactor, where water is used as coolant and lubricant. This bearing is made of STS440C stainless steel for the raceways and the balls to use in radioactive environment and water. It is known that the retainer design affects ball bearing operability and endurance life, however there is no verified retainer design and material for water lubricated ball bearing. Four kinds of retainers are manufactured for the endurance test of water lubricated deep groove ball bearing. Three of them are commercially developed types and the other is designed for this research. It is verified that ball bearings with steel pressed and general plastic retainer can not survive to required life in the water, however bearings with machined type and cylinder type retainer can survive. This proves that one of the major design parameters for water lubricated ball bearing is retainer type and material. In this paper, experimental research of endurance test for water-lubricated ball bearing are reported.

High-accuracy and High-speed Groove Die Set (고정도.고속 Groove Die Set)

  • Kim, Gun-Hoi
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.1
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    • pp.7-15
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    • 2008
  • Currently existing high-accuracy and high-speed die sets used in reciprocal press create scratches at the surface of guide posts, steel balls, and bushes due to vertical movement of balls with point-contacts between inner surface of bushes and guide posts. Consequently, accuracy of the die set and the life span of the metal mold are reduced. However, those scratches could reduce the pre-load of the steel ball. This research designed and developed a groove-type die set which improves life span of the die set by eliminating point-contacts of steel balls with guide posts. The guide post consisted of a steel-ball retainer, a steel-ball retainer stopper, a guide bush, a guide pin, a snap ring, and a spring. The steel-ball retainer has 72 holes with 8 columns of 9 holes in each column. The inner surface of the guide bush was grinded(surface roughness: $Ra\;\\;0.2{\mu}m$, accuracy: $0\;{\sim}\;-0.002mm$) after NC turning and heat treatment. Also, a line of small intermediate pocket was processed inside of the guide bush for lubrication and elimination of foreign materials. Guide grooves of steel balls were processed using a wire EDM(Electrical Discharge Machining) after heat treatment. With such a design of the guide post stated above, loads against steel balls could be dispersed greatly by the line contacts through the guide groove between the guide post and the guide bush, and the life span of the guide post could be expanded semi-permanently.

Thermo-Elastic Analysis, 3-Dimensional Stress Analysis and Design of Carbon/Carbon Brake Disk (탄소/탄소 브레이크 디스크의 열탄성 해석과 3차원 응력해석 및 설계)

  • 오세희;유재석;김천곤;홍창선;김광수
    • Composites Research
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    • v.15 no.1
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    • pp.41-52
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    • 2002
  • This paper presents the thermo-elastic analysis for searching the behavior of carbon/carbon brake system during the braking period and the 3-D stress analysis to find the shape of the brake disk which is safe to the failure. The mechanical properties of the carbon/carbon brake disk were measured for both in-plane and out of plane directions. The mechanical properties were used as the input of the thermo-elastic analysis and 3-dimensional stress analysis for the brake disk. The gap between rotor clip and clip retainer is an important parameter in the loading transfer mechanism of the rotor disk. The change of gap was considered both the mechanical deformation and thermal deformation. Because the rotor clip and clip retainers were not contacted, they were excluded from the analysis model. Rotor disk was modeled by using the cyclic symmetry condition. The contact problems between rotor clip and key drum as well as between rotor disk and rotor were considered. From the results of the 3-D stress analysis, the stress concentration at the key hole of the brake disk was confirmed. The stress distributions were studied thor the variation of the rotation angle of the contact surface and the radius of curvature at the key hole part.

Development of a Measuring Device for Coefficient of Friction between Connection Parts in Vehicle Head Lamps (자동차 헤드램프내 체결부품사이의 마찰계수 실험장치 개발)

  • Baek, Hong;Moon, Ji-Seung;Park, Sang-Shin;Park, Jong-Myeong
    • Tribology and Lubricants
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    • v.35 no.1
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    • pp.59-64
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    • 2019
  • When slipping occurs between two materials, the coefficients of friction must be considered because these values determine the overall efficiency of the machine or slip characteristics. Therefore, it is important to find the coefficient of friction between two materials. This paper focuses on obtaining the coefficient of friction between an aiming bolt and a retainer located in the headlamps of a vehicle. This bolt supports the headlamp, and if the bolt is loosened by external vibration, the angle of the light will change and block the vision of pedestrians or other drivers. In order to study these situations, the coefficient of friction between aiming bolts and retainers needs to be measured. In addition, the coefficient of friction of materials used in the headlamp should be obtained. To determine these two factors, a new device is designed for two cases: surface-surface contact and surface-line contact. To increase reliability of the results, the device is designed using an air-bearing stage which uses compressed air as lubricant to eliminate the friction of the stage itself. Experiments were carried out by applying various vertical forces, and the results show that the coefficient of friction can be measured consistently. The procedure for designing the device and the results are discussed.