• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.27-36
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• 1998

통신시스템의 고발열 전자부품 냉각을 위해 3종류의 써모싸이폰을 각각의 용도에 따라 개 발하였으며 그 각각의 설계변수에 대한 냉각특성을 실험적으로 구하였다. TS-I에서는 증발부 내부 에 금속스크린 메쉬형심지를 삽입함으로써 시간에 따른 온도 변화를 작게 하여 냉각성능 안정성을 확보하였고, TS-II에서는 9W/cm2의 높은 냉각성능을 가진 루프형 써모사이폰을 개발하였으며 TS-III에서는 작동유체의 종류, 파이프개수 와이어 삽입여부등 써모사이폰의 주요 설계변수에 따 른 냉각특성을 구하였다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.6
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• pp.462-473
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• 2001

Due to the coupling between momentum and energy transport theoretical analysis of the loop performance is very complicate, therefore it is necessary that these problems be solved by experimental investigation before applying th loop thermosyphon to heat exchanger design. The evaporator and condenser of the loop thermosyphon were made of carbon-steel, and distilled water was used as working fluid in the experiments. From the experimental data correlations of heat transfer coefficient for evaporator and condenser sections were obtained. For heat fluxes in th range of 13~78kW/$m^2$, the correlation equations of heat transfer coefficients in evaporator and condenser predict the experimental behavior to within $\p$\pm$5% and\;\pm20$% respectively.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.12
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• pp.1475-1483
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• 2004

Loop thermosyphon(LTS) has many good characteristics such as low thermal resistance, no power consumption, noiseless operation and small size. To investigate the overall performance of LTS, we have performed various experiments varying three parameters: input power of the heater, working fluid(water, ethanol, FC3283) and filling ratio of the working fluid. At a combination of these parameters, temperature measurements are made at many locations of the LTS. The temperature difference between the evaporator and the condenser is used to obtain the thermal resistance. In addition, flow visualization using a high speed camera is carried out. The thermal resistance is not constant. It is lower at higher input power, which is one of the distinct merits of LTS. Flow instabilities are frequently observed when changing the working fluid, the input power and the filling ratio. The results show that the LTS can be readily put into practical use. Future practical application in electronic cooling is recommended.

• Journal of ILASS-Korea
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• v.7 no.2
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• pp.31-36
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• 2002

According to the improvement of PC performance, it is expected that calorific value, which causes PC to malfunction, is increased. Therefore, the development of new cooling system is recently required. As the method to solve this problem, we applied loop heat pipe to PC cooling system. The advantage of the loop heat pipe is that it has a small size, light weight, simple shape, long life and it has a good performance on heat transfer, no-noise, wide range of applicable temperature and no supply of power from the outside. It is confirmed that loop heat pipe reduces thermal resistance and has a good performance on PC cooling.