• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.4
• /
• pp.1-10
• /
• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion (i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) were healed by the UV laser beam transmitted through the glass substrate. The lather energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, and formed a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.430-433
• /
• 2005

Laser bonding between similar and dissimilar thermoplastics has been investigated by making use of laser transmission weld technique. Spot welding of two layers of plastic materials has been demonstrated by using of a high-quality diode-laser with 808nm wavelength. Weld areas increases according to power density, exposure time. The results of peel out test show that peel strengths increase with the area of molten plastics. Layers, which have the same chemical properties, have good bonding qualities. A bonding method which dye film is coated on the interface is used for laser bonding between plastics with high transmission for laser wavelength. Laser transmission bonding is worthy of attention because it is not in contact, requires a few tooling devices, allows a flexible energy delivery and produces nearly invisible welds

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.113-119
• /
• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.9 s.174
• /
• pp.34-40
• /
• 2005

Laser welding of thermoplastics is a new jointing technique with a host of advantages. It is not only another extremely useful welding method but also a cost-effective alternative to traditional techniques involving screws or adhesives. Transmission laser-welding of thermoplastics such as polycarbonate(PC), polypropylene(PP), polyvinyl chloride(PVC), low density polyethylene(LDPE) and acrylic using a high power diode laser has been studied experimentally. The optical transmission of each plastic has been measured at laser wavelength of 808nm. The weld process has been characterized by the specific energy and weld time required for each plastic. The characteristics of laser welding between same plastics have also been analyzed.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.423-426
• /
• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Proceedings of the KWS Conference
• /
• 2004.05a
• /
• pp.103-105
• /
• 2004

키홀 용접현상에 관한 연구는, 키홀 현상이 용융금속내부에서 아주 빠른 속도로 과도적으로 이루어지기 때문에 그 계측과 해석이 곤란하여 수 많은 가정이나 가설 하에서 용입형상과 키홀의 거동에 관한 해석이 국한된 영역에서 이루어지고 있는 것이 현실이다. (중략)

• Proceedings of the KWS Conference
• /
• 2005.06a
• /
• pp.43-45
• /
• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted to heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated and heat transfer model was applied for obtaining the transient temperature profile. The transmission laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip.

• Journal of Welding and Joining
• /
• v.23 no.5
• /
• pp.55-60
• /
• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted into heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated. At the wavelength of 1100nm $87.5\%$ of incident laser energy was used for bonding process from the calculation. A heat transfer model was applied for obtaining the transient temperature profile. It was found that with the power of 29.5 mW, the interface begins to melt and bond each other in 3 sec and it is in a good agreement with experiment results. The transmission IR laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip applications.

• Journal of Welding and Joining
• /
• v.25 no.2
• /
• pp.43-48
• /
• 2007

Laser Transmission Joining (LTJ) of plastics is a process in which light of suitable wavelength is transmitted through a transparent substrate that is in contact with an absorbing one. In this paper, LTJ is investigated by preliminary experiments from the viewpoint of mechanical engineering. To understand transmitting characteristics of each polymer substrate, transmission rate, reflection rate and absorption coefficient of polymer are measured by using a laser power-meter. Characteristics of joining in the spot welding and seam welding are investigated by measuring the fracture load. Fracture load increases in accordance to the laser power and irradiation time. However, when the laser power is over 60W and irradiation time over 4seconds, fracture load decreases. This phenomenon is probably due to heat-softening of materials. Besides, cavities are generated at a joint by evaporation of water molecules, which can be suppressed by introduction of a gap between two substrates.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.3
• /
• pp.102-110
• /
• 2023

This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.