• Title/Summary/Keyword: 레이저 이송속도 조절

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Analysis of Moving Heat Source for Laser Assisted Machining of Plate by Feed Rate Control (이송속도 조절에 의한 평판 레이저 보조가공의 이동 열원해석)

  • Kim, Kwang-Sun;Lee, Choon-Man
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.12
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    • pp.1341-1346
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    • 2011
  • Currently, many researches are carried out for laser assisted machining, which is one of the important fields in materials difficult to process. However, a prediction of heat source is difficult because of moving heat source. In this paper, a thermal analysis of laser assisted machining of plate by change of heat source size is performed, and preheating temperature by adjusting the feed rate is controlled. It was recognized that the maximum preheating temperature increases according to the decrease in heat source size, and feed rate need to adjust as high speed. The results of this analysis can be used as a reference for preheating temperature prediction in laser assisted milling.

Laser micromachining of high-aspect-ratio metallic channels for the application to microthermal devices (마이크로 열소자 제작을 위한 고세장비 금속채널의 레이저 가공)

  • Oh, Kwang-Hwan;Lee, Min-Kyu;Jeong, Sung-Ho
    • Korean Journal of Optics and Photonics
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    • v.17 no.5
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    • pp.437-446
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    • 2006
  • A fabrication method fur high-aspect-ratio microchannels in stainless steel using laser-assisted thermochemical wet etching is reported in this paper. The fabrication of deep microchannels with an aspect ratio over ten is realized by applying a multiple etching process with an optimization of process conditions. The cross-sectional profile of the microchannels can be adjusted between rectangular and triangular shapes by properly controlling laser power and etchant concentration. Excellent dimensional uniformity is achieved among the channels with little heat-affected area. Microchannels with a width ranging from 15 to $50{\mu}m$ can be fabricated with an aspect ratio of ten and a pitch of 150 m or smaller. The effects of process variables such as laser power, scan speed, and etchant concentration on the fabrication results, including etch width, depth, and cross-sectional profile are closely examined.