• Title/Summary/Keyword: 레이저 라우팅

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Proposal of Optical CDMA Routing Scheme for Radio Access Network (무선 액세스 네트워크를 위한 광 CDMA 라우팅 방식의 제안)

  • Park, Sang-Jo;Kang, Koo-Hong;Han, Kil-Sung
    • The KIPS Transactions:PartC
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    • v.9C no.4
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    • pp.581-588
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    • 2002
  • In this paper, we newly propose the optical CDMA routing scheme for the radio access network. At the radio base station (RBS), the received radio signals are multiplied by the PN codes and converted to the CDMA radio signals. In the next optical CDMAS are performed and multiplxed by using the PN codes which are the addresses of the routing mobile switching center (MSC). At the MSC, the CDMA radio signals are routined to another MSC by the CDM receiver at the routing node. In the case MSC is equal to the desired MSC, the radio signal is correlated by the two-layerd spectrum despreading at a time. Finally we theoretically analyze the signal-to-interference and noise power ratio of regenerated signal and the routing error probability and show the availability of proposed scheme.

Study on High Speed Laser Cutting of Rigid Flexible Printed Circuit Board by using UV Laser with Nano-second Pulse Width (자외선 나노초 펄스 레이저를 이용한 경연성(Rigid Flexible) 인쇄전자회로기판(Printed Circuit Board) 고속 절단에 관한 연구)

  • Bae, Han-Sung;Park, Hee-Chun;Ryu, Kwang-Hyun;Nam, Gi-Jung
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.2
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    • pp.20-24
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    • 2010
  • High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.