• Title/Summary/Keyword: 뜯김 억제

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A Study on the Effect of Electrolytic In-process Dressing in Slot Grinding (미세홈 가공시 전해 인프로세스 드레싱의 영향에 관한 연구)

  • Yu, Jeong-Bong;Lee, Seok-U;Jeong, Hae-Do;Choe, Heon-Jong
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.1 s.94
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    • pp.18-25
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    • 1999
  • Chipping is an unavoidable phenomenon in the slot grinding process of hard and brittle materials. However, it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished chipping-free grooves and obtained the clear ground surfaces on glass and WC.

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Effect of Electrolytic In-process Dressing in Slot Grinding (Slot Grinding시 전해 인프로세스 드레싱의 영향에 관한 연구)

  • 유정봉;정해도;최헌종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.48-52
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    • 1995
  • Chipping is an unavidable phenomean in the slot grinding process of hard and brittle materials. However,it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished shipping-free grooves and obtained the clear ground sufaces on glass and tungsten carbide.

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