• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2012.05a
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• pp.259-261
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• 2012

The effect of high-temperature on the flexural modulus of epoxy resin were evaluated using universal testing machine with 3-point bending and dynamic mechanical analyzer. Temperatures of $30^{\circ}C$, $100^{\circ}C$, and $140^{\circ}C$ were considered for flexural test. The specimens having aspect ratio of 16, 32, and 40 were used. The results of storage modulus from DMA were similar to those from flexural test along with given temperatures. It is found that the flexural modulus increased with increasing aspect ratio and the specimen having aspect ratio of above 32 would be suitable for the evaluation of composite material properties under high temperature condition.