• Electrical & Electronic Materials
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• v.9 no.7
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• pp.702-707
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• 1996

In this paper, in order to improve the withstand voltage properties of epoxy resin, IPN(interpenetrating polymer network) method was introduced and the influence was investigated. The single network structure specimen(E series), simultaneous interpenetrating polymer network specimen(EM series) and pseudo interpenetrating polymer network(EMP series) specimen were manufactured. In order to understand the internal structure properties, scanning electron microscopy method was utilized, and glass transition temperature was measured. Also, AC voltage dielectric breakdown strength, tensile strength and impact strength were measured to investigate the influence upon electrical and mechanical properties. As a result, it was confirmed that simultaneous interpenetrating polymer network specimen was the most execellent.

• Electrical & Electronic Materials
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• v.7 no.6
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• pp.527-533
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• 1994

In this study, it was studied on dielectric breakdown strength and thennostability properties due to the structure variation of matrix resin and treatment of coupling agent of epoxy insulating materials. The interpenetrating network structure was formed by simultaneous heating curing the epoxy resin with single network structure and the methacrylic acid resin. Also inner structure was observed and the glass transition temperature was measured on these three type specimens. Dielectric breakdown properties were investigated by applying DC, AC and impulse voltage. As a result, the glass transition temperature and the dielectric breakdown strength of specimen with interpenetrating network structure was more higher than another two type specimens.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.572-574
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• 1993

In order to obtain superior breakdown properties of Epoxy/$SiO_2$ composite materials at room and high temperature, the simultaneous interpenetrating polymer networks(SIN) is introduced into the Epoxy resin. As a result, it is observed that dielectric breakdown strength tends to increase according to the following order ; Epoxy/$SiO_2$ specimens, specimens treated with coupling agent and SIN introduced specimens which have stable temperature characteristics at room and high temperature. For introducing SIN Epoxy/$SiO_2$ composite material, rise of glass transition temperature and suppression of defects in its internal structure is achieved. This in turn improves the dielectric breakdown strength and the heat proof property of Epoxy/$SiO_2$ composite materials.