• Title/Summary/Keyword: 동공영역

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Performance Improvement for Robust Eye Detection Algorithm under Environmental Changes (환경변화에 강인한 눈 검출 알고리즘 성능향상 연구)

  • Ha, Jin-gwan;Moon, Hyeon-joon
    • Journal of Digital Convergence
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    • v.14 no.10
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    • pp.271-276
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    • 2016
  • In this paper, we propose robust face and eye detection algorithm under changing environmental condition such as lighting and pose variations. Generally, the eye detection process is performed followed by face detection and variations in pose and lighting affects the detection performance. Therefore, we have explored face detection based on Modified Census Transform algorithm. The eye has dominant features in face area and is sensitive to lighting condition and eye glasses, etc. To address these issues, we propose a robust eye detection method based on Gabor transformation and Features from Accelerated Segment Test algorithms. Proposed algorithm presents 27.4ms in detection speed with 98.4% correct detection rate, and 36.3ms face detection speed with 96.4% correct detection rate for eye detection performance.

Synthesis of Ti-SBA-15 Doped with Lanthanide Ions and Their Photocatalytic Activity (란탄족 이온이 도핑된 Ti-SBA-15의 합성 및 그들의 광촉매 활성)

  • Hong, Seong-Soo
    • Clean Technology
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    • v.26 no.1
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    • pp.7-12
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    • 2020
  • Ti-SBA-15 catalysts doped with lanthanide ions (Ln/Ti-SBA-15) were successfully synthesized using conventional hydrothermal method. In addition, they were characterized by XRD, FT-IR, DRS, BET, and PL. The activity of these materials on the photocatalytic decomposition of methylene blue under ultraviolet light irradiation was also examined. Ti-SBA-15 catalysts doped with various lanthanide ions maintained their mesoporous structure. The pore size and pore volume of Ln/Ti-SBA-15 materials decreased but their surface area increased upon the doping of lanthanide ion. Ln/Ti-SBA-15 materials exhibited the type IV nitrogen isotherm with desorption hysteresis loop type H2, which was characteristic of mesoporous materials. The size of hysteresis increased in the doping of lanthanide ions on Ti-SBA-15 material. There was no absorption in the visible region (> 400 nm) regardless of the doping of lanthanide ions to TiO2 particles, while the broad bands at 220 nm appeared at the Ln/Ti-SBA-15 samples, indicating the framework incorporation of titanium into SBA-15. 1 mol% Pr/ Ti-SBA-15 catalysts showed the highest photocatalytic activity on the decomposition of methylene blue but the Ti-SBA-15 catalysts doped with Eu, Er, and Nd ions showed lower activity compared to pure Ti-SBA-15 catalyst. The PL peaks appeared at about 410 nm at all catalysts while the excitonic PL signal was proportional to the photocatalytic activity for the decomposition of methylene blue.

Comparison of the Refracting Power and Aberration according to the Measurement Change in Illumination and Area of the Pupils (조도와 동공 영역의 측정 변화에 따른 굴절력과 수차의 비교)

  • Kim, Bong-Hwan;Han, Seon-Hee;Park, Byeong-Gyu;Hwang, Hyeon-Ju;Bae, Ye-Sol;Seo, Jeong-Bin;Yeo, Ye-Eun;Yoon, Min-Jeong;Kim, Hak-Jun
    • Journal of Korean Clinical Health Science
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    • v.4 no.2
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    • pp.550-555
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    • 2016
  • Purpose. We compared with the refracting power and aberration according to the measurement change in illumination and the pupils area by using the auto refraction instruments. Methods. In this study it were examined 64 eyes without eye disease, 21.4 (${\pm}2.54$) age, 32 (male 10, female 22) patients. Experiments in general illumination using the auto refraction instruments (HRK-8000A, Huvitz, Korea) was measured in both eyes 3 times and after scotopic for 30 minutes in a dark room blocked the light was measured in the same way. Aberration were measured coma, spherical aberration, high and low order aberrations in a general illumination (3500 lux) and low illumination (5 lux) of the pupil area 3.96 mm and 5.96 mm. Results. In the general illumination for measuring of the pupil area, the refractive power, coma, spherical aberration and low order aberration was no significant difference. In the low illumination, spherical aberration of the pupil area was $0.005({\pm}0.015){\mu}m$ in a 3.96mm, $0.014({\pm}0.020){\mu}m$ in a 5.96 mm and appeared a significant difference(p = 0.003). In general and low illumination on the results of comparing the measured values of the refractive power and aberration at the pupil area 3.96 mm, high order aberrations was $0.205({\pm}0.145){\mu}m$ in general illumination, $0.132({\pm}0.075){\mu}m$ in low illumination and appeared a significant differences(p = 0.001). High order aberrations at the pupil area 5.96 mm was $0.278({\pm}0.244){\mu}m$ in general illumination, $0.150({\pm}0.092){\mu}m$ in low illumination and appeared a significant differences(p = 0.000). Conclusions. When the eye refractive power measured by the automatic refraction does not depend on the illumination conditions and size of the observation pupil area, it was found that aberrations are affected by the illumination and the observation pupil area. It was found that the eye examination chamber illumination to obtain accurate measurement produces better results to decrease than to increase.

A Study on Wafer-Level 3D Integration Including Wafer Bonding using Low-k Polymeric Adhesive (저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구)

  • Kwon, Yongchai;Seok, Jongwon;Lu, Jian-Qiang;Cale, Timothy;Gutmann, Ronald
    • Korean Chemical Engineering Research
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    • v.45 no.5
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    • pp.466-472
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    • 2007
  • A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.