• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.279.1-279.1
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• 2016

박막 트랜지스터 (thin film transistor, TFT)는 고밀도, 대면적화로 높은 전자의 이동도가 요구되면서, 비정질 실리콘 (a-Si)에서 다결정 실리콘 (poly-Si) TFT 로 연구되었다. 이에 따라 비정질 실리콘에서 결정질 실리콘으로의 상변화에 대한 결정화 연구가 활발히 진행되었다. 또한, 박막 태양전지 분야에서도 유리기판 위에 비정질 층을 증착한 후에 열처리를 통해 상변화하는 고상 결정화 (solid-phase crystallization, SPC) 기술을 적용하여, CSG (thin-film crystalline silicon on glass) 태양전지를 보고하였다. 이러한 비정질 실리콘 층의 결정화 기술을 결정질 실리콘 태양전지 에미터 형성 공정에 적용하고자 한다. 이 때, 플라즈마화학증착 (Plasma-enhanced chemical vapor deposition, PECVD) 장비로 증착된 비정질 실리콘 층의 열처리를 통한 결정화 정도가 중요한 요소이다. 따라서, 비정질 실리콘 층의 결정화에 영향을 주는 인자에 대해 연구하였다. 비정질 실리콘 증착 조건(H2 가스 비율, 도펀트 유무), 실리콘 기판의 결정방향, 열처리 온도에 따른 결정화 정도를 엘립소미터(elipsometer), 투과전자현미경 (transmission electron microscope, TEM), 적외선 분광기 (Fourier Transform Infrared, FT-IR) 측정을 통하여 비교 하였다. 이를 기반으로 결정화 온도에 따른 비정질 실리콘의 결정화를 위한 활성화 에너지를 계산하였다. 비정질 실리콘 증착 조건 보다 기판의 결정방향이 결정화 정도에 크게 영향을 미치는 것으로 확인하였다.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.599-602
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• 2001

In this study, we fabricated chemically polymerized PPy and PANi films with different selectivity by controlling dedoping time. And the sensing properties and mechanism of VOCs adsorption to conducting polymers were investigated. Thin sensor had higher sensitivity compared to thick one, and dedoped sensor for 1-minute highest sensitivity. Upon gas absorption, polypyrrole exhibited positive sensitivity while polyaniline had negative sensitivity. PPy film show hydrophilic property and PANi film show hydrophobic property. After the gas absorption, the sensitivity increased as a function of polarity of absorbed molecules. These behaviors are due to the polar molecules absorbed with the movable polaron or free carrier, and then it interrupt or generate the movement of polaron and carrier, and then it changes the conductivity of polymer. We found that conducting polymer sensors are very sensitive to the difference in polarity of gas molecules.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.43-47
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• 2003

As and BF$_2$dopants are implanted for the formation of source/drain with dose of 1${\times}$10$^{15}$ ions/$\textrm{cm}^2$∼5${\times}$10$^{15}$ ions/$\textrm{cm}^2$ then formed cobalt disilicide with Co/Ti deposition and doubly rapid thermal annealing. Appropriate ion implantation and cobalt salicide process are employed to meet the sub-0.13 $\mu\textrm{m}$ CMOS devices. We investigated the process results of sheet resistance, dopant redistribution, and surface-interface microstructure with a four-point probe, a secondary ion mass spectroscope(SIMS), a scanning probe microscope (SPM), and a cross sectional transmission electron microscope(TEM), respectively. Sheet resistance increased to 8%∼12% as dose increased in $CoSi_2$$n^{＋}$ and $CoSi_2$$p^{V}$ , while sheet resistance uniformity showed very little variation. SIMS depth profiling revealed that the diffusion of As and B was enhanced as dose increased in $CoSi_2$$n^{＋}$ and $CoSi_2$$p^{＋}$ . The surface roughness of root mean square(RMS) values measured by a SPM decreased as dose increased in $CoSi_2$$n^{＋}$ , while little variation was observed in $CoSi_2$$p^{＋}$ . Cross sectional TEM images showed that the spikes of 30 nm∼50 nm-depth were formed at the interfaces of $CoSi_2$$n^{＋}$ / and $CoSi_2$/$p^{＋}$, which indicate the possible leakage current source. Our result implied that Co/Ti cobalt salicide was compatible with high dose sub-0.13$\mu\textrm{m}$ process.

• Journal of the Korean Ceramic Society
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• v.35 no.4
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• pp.364-370
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• 1998

Boron-phoshor-silicate glass was fabricated on Si substrates by FHD(Flame Hydrolysis Deposition) The microstructrue of silica soot deposited at various conditon such as composition and substrate temperature was analysed by SEM. After consolidation the refractive index and composition of the silica layer were in-vestigated. For refractive index control B, P and Ge were used as additive elements while B and Ge oxides are easily mixed into $SiO_2$, P oxide($B_2O_3$) doping is difficult because of the volatile property due to low melt-ing point. Boron-phosphorous-silicate glass (BPSG) layer were fabricated using bertical torch and optimized flame temperature substrate temperature and distance of torch and substrate. P concentration of BPSG lay-er measured 3.3 Wt% and the consolidation temperature was lower than $1180^{\circ}C$. The measured refractive index of BPSG silica layer in $1.55\;\mu\textrm{m}$ wavelength was $1.4480{\pm}1{\times}10^{-1}$ and the thickness was $22{\pm}1\;\mu\textrm{m}$.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.41-44
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• 2014

In this paper, we will investigate the activation energies of Nb for $TiO_2$ using Hall effect measurement and photoluminescence (PL) system. Nb-doped $TiO_2$ thin film was grown on $SrTiO_3$ substrate by pulsed laser deposition (PLD) technique. After measurements, activation energies of niobium donor were 14.52 meV in Hall effect measurement, and 6.72 meV in PL measurement, respectively. These results showed different tendencies which are measured from the samples with acceptor materials. Therefore, it is thought that more research on activation energies for dopants of shallow donor level is expected.

• Journal of the Korean Ceramic Society
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• v.40 no.6
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• pp.589-593
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• 2003

Silica based Planar Lightwave Circuits (PLC) have been applied to various kinds of wave-guided optical passive devices. SiO$_2$ (buffer) and GeO$_2$-SiO$_2$ (core) thick films have been deposited by Flame Hydrolysis Deposition (FHD). The SiO$_2$ films were produced by the flame hydrolysis reaction of halide materials such as SiCl$_4$, POCl$_3$ and BCl$_3$ into an oxy-hydrogen torch. The P concentration increased from 2.0 to 2.8 at％ on increasing the POCl$_3$/BCl$_3$ flow ratio. The refractive index increased from 1.4584 to 1.4605 on increasing the POC1$_3$/BC1$_3$ flow ratio from 0.6 to 2.6. The refractive index of GeO$_2$-SiO$_2$ films was controlled by the GeCl$_4$ flow rate. The refractive index increased from 1.4615 to 1.4809 on increasing the GeCl$_4$ flow rate from 30 to 120 sccm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.4
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• pp.25-30
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• 2000

Ion mass doping method has been implemented for the fabrication of large area electronic devices such as TFT-LCD. In this work, the effect of ion mass doping on the velocity and the behavior of MILC was investigated. When amorphous silicon was either doped or bombarded by accelerated ions, MILC velocity was reduced by over 50% and the front edge of MILC became coarse. In order to analyze the dependence of silicon film's properties on ion mass doping, ultraviolet reflectance and sulfate roughness were investigated. Both the velocity and the behavior of MILC were found to be related with the increase of surface roughness by ion bombardment.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.265-265
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• 2014

일반적으로 태양전지 및 반도체 공정에서 불순물 주입 과정인 도핑(Doping)공정은 크게 몇 가지 방법으로 구분해 볼 수 있다. 소성로(Furnace)를 이용하여 열을 통해 불순물을 웨이퍼 내부로 확산시키는 열확산 방법과 진공 챔버 내부에서 전자기장을 걸어 이온을 극도로 가속시켜 진행하는 이온 주입(Ion implantation)이나 이온 샤워(Ion shower)를 이용한 도핑 방법이 있다. 또한 최근 자외영역 파장의 레이저광을 조사하여 광화학 반응에 의해 도펀트 물질를 분해하는 동시에 조사 부분을 용해하여 불순물을 도포하는 기법인 레이져 도핑(Laser doping) 방법이 개발중이다. 그러나 레이져나 이온 도핑 공정기술은 고가의 복잡한 장비가 필요하여 매출 수익성 및 대량생산에 비효율적이며 이온 주입에 의한 박막의 손상을 치료하기 위한 후속 어닐링(Post-annealing) 과정이 요구되는 단점을 가지고 있고 열확산 도핑 방법은 정량적인 불순물 주입 제어가 어렵고 시간 대비 생산량의 한계가 있다. 반면 대기압 플라즈마로 도핑을 할 경우 기존에 진공개념을 벗어나 공정상에서 보다 저가의 생산을 가능케 할 뿐아니라 멀티 플라즈마 소스 개발로 이어진다면 시간적인 측면에서도 단연 단축시킬 수가 있어 보다 대량 생산 공정에 효과적이다. 따라서 본 연구에서는 새로운 도핑 방법인 대기압 플라즈마를 이용한 도핑 공정기술의 가능성을 제안하고자 도핑 공정 시 웨이퍼 내 전류 패스(Current path)에 대한 메카니즘을 연구하였다. 대기압 플라즈마 방전 시 전류가 웨이퍼 내부에 흐를 때 발생되는 열을 이용하여 도핑이 되는 형식이란 점을 가정하고 이 점에 대한 원리를 증명하고자 실험을 진행하였다. 실험 방식은 그라운드(Ground) 내 웨이퍼의 위치와 웨이퍼 내 방전 위치에 따라 적외선 화상(IR image: Infrared image) 화상을 서로 비교하였다. 적외선 화상은 실험 조건에 따라 화상 내 고온의 표식이 상이하게 변하는 경향성을 나타내었다. 이 고온의 표식이 전류 패스라는 점을 증명하고자 시뮬레이션을 통해 자기장의 전산모사를 한 결과 전류 패스의 수직 방향으로 자기장이 형성이 됨을 확인하였으며 이는 즉 웨이퍼 내부 전류 패스에 따라 도핑이 된다는 사실을 명백히 말해주는 것이며 전류 패스 제어의 가능성과 이에 따라 SE(Selective Emitter) 공정 분야 응용 가능성을 보여준다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.10
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• pp.4590-4599
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• 2011

The Color shift phenomenon is becoming a major degradation factor of the emitting color purity in the organic emitting diodes which is generating a plurality of colors. In this study, the basic structure of organic light emitting diode device is comprised of ITO/${\alpha}$-NPD/$Alq_3$:DCJTB[wt%]/$Alq_3$/Mg:Ag, we have carry out numerical simulation of the electric-optical characteristics in organic light emitting diode device to estimate the mechanism of color shift phenomenon. We have investigated the causes of the color shift through the change of DCJTB doping concentration ratio. As the result, we have confirmed that the changes of the recombination rate which generated by trapped electrons and holes is one of the major factors for the color shift phenomenon.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.309-310
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• 2005

In the fabrication of high performance red organic light emitting diode, 2-TNA TA [4,4',4" -tris (2-naphthylphenyl- phenylamino)-triphenylamine] as hole injection material and N PH [N,N'-bis (1-naphthyl) -N,N' -diphenyl-1, 1'-biphenyl-4,4'- diamine] as hole transport material were deposited on the ITO (indium tin oxide)/glass substrate by vacuum evaporation, And then, red color emission layer was deposited using Alq3 as a host material and Rubrene (5,6,11,12- tetraphenylnaphthacene) and GDI 4234 as dopants. Finally, small molecular weight OLED with the structure of ITO/2-TNATA/ NPB/Alq3+Rubrene+GDI4234/Alq3/LiF/Al was obtained by in-situ deposition of Alq3, LiF and Al as electron transport material, electron injection material and cathode. respectively. Green OLED fabricated in our experiments showed the color coordinate of CIE(0.65,0.35) and the maximum luminescence efficiency of 2.1 lm/W at 7 V with the peak emission wavelength of 632 nm.