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Microstructures and Hardness of Al-Si Coated 11%Cr Ferritic Stainless Steel, 409L GTA Welds (Al-Si 용융도금된 11%Cr 페라이트 스테인리스강, STS409L GTA 용접부의 미세조직과 경도)

  • Park, Tae-Jun;Kong, Jong-Pan;Na, Hye-Sung;Kang, Chung-Yun;Uhm, Sang-Ho;Kim, Jeong-Kil;Woo, In-Su;Lee, Jong-Sub
    • Journal of Welding and Joining
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    • v.28 no.3
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    • pp.92-98
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    • 2010
  • Ferritic stainless steels, which have relatively small thermal expansion coefficient and excellent corrosion resistance, are increasingly being used in vehicle manufacturing, in order to increase the lifetime of exhaust manifold parts. But, there are limits on use because of the problem related to cosmetic resistance, corrosions of condensation and high temperature salt etc. So, Aluminum-coated stainless steel instead of ferritic stainless steel are utilized in these parts due to the improved properties. In this investigation, Al-8wt% Si alloy coated 409L ferritic stainless steel was used as the base metal during Gas Tungsten Arc(GTA) welding. The effects of coated layer on the microstructure and hardness were investigated. Full penetration was obtained, when the welding current was higher than 90A and the welding speed was lower than 0.52m/min. Grain size was the largest in fusion zone and decreased from near HAZ to base metal. As welding speed increased, grain size of fusion zone decreased, and there was no big change in HAZ. Hardness had a peak value in the fusion zone and decreased from the bond line to the base metal. The highest hardness in the fusion zone resulted from the fine re-precipitation of the coarse TiN and Ti(C, N) existed in the base metal during melting and solidification process and the presence of fine $Al_2O_3$ and $SiO_2$ formed by the migration of the elements, Al and Si, from the melted coating layer into the fusion zone.

Development of a Hydrogen Peroxide Sensor Based on Palladium and Copper Electroplated Laser Induced Graphene Electrode (PdCu를 전기 도금한 레이저 유도 그래핀 전극 기반의 과산화수소 측정 센서 개발)

  • Park, Daehan;Han, Ji-Hoon;Kim, Taeheon;Pak, Jungho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.67 no.12
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    • pp.1626-1632
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    • 2018
  • In this paper, we describe the fabrication and characterization of a hydrogen peroxide ($H_2O_2$) sensor based on palladium and copper (PdCu) electroplated laser induced graphene (LIG) electrodes. $CO_2$ laser was used to form LIG electrodes on a PI film. This fabrication method allows simple control of the LIG electrode size and shape. The PdCu was electrochemically deposited on the LIG electrodes to improve the electrocatalytic reaction with $H_2O_2$. The electrochemical performance of this sensor was evaluated in terms of selectivity, sensitivity, and linearity. The physical characterization of this sensor was conducted using scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS), which confirmed that PdCu was formed on the laser induced graphene electrode. In order to increase the sensor sensitivity, the Pd:Cu ratio of the electroplated PdCu was varied to five different values and the condition of highest amperometric current at an identical of $H_2O_2$ concentration was chosen among them. The resulting amperometric current was highest when the ratio of Pd:Cu was 7:3 and this Pd;Cu ratio was employed in the sensor fabrication. The fabricated PdCu/LIG electrode based $H_2O_2$ sensor exhibited a sensitivity of $139.4{\mu}A/mM{\cdot}cm^2$, a broad linear range between 0 mM and 16 mM of $H_2O_2$ concentrations at applied potential of -0.15 V, and high reproducibility (RSD = 2.6%). The selectivity of the fabricated sensors was also evaluated by applying ascorbic acid, glucose, and lactose separately onto the sensor in order to see if the sensor ourput is affected by one of them and the sensor output was not affected. In conclusion, the proposed PdCu/LIG electrode based $H_2O_2$ sensor seems to be suitable $H_2O_2$ sensor in various applications.

Formation of Ni / Cu Electrode for Crystalline Si Solar Cell Using Light Induced Electrode Plating (광유도 전해 도금법을 이용한 결정질 실리콘 태양전지용 Ni/Cu 전극 형성)

  • Hong, Hyekwon;Park, Jeongeun;Cho, Youngho;Kim, Dongsik;Lim, Donggun;Song, Woochang
    • Journal of Institute of Convergence Technology
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    • v.8 no.1
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    • pp.33-39
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    • 2018
  • The screen printing method for forming the electrode by applying the existing pressure is difficult to apply to thin wafers, and since expensive Ag paste is used, it is difficult to solve the problem of cost reduction. This can solve both of the problems by forming the front electrode using a plating method applicable to a thin wafer. In this paper, the process conditions of electrode formation are optimized by using LIEP (Light-Induced Electrode Plating). Experiments were conducted by varying the Ni plating bath temperature $40{\sim}70^{\circ}C$, the applied current 5 ~ 15 mA, and the plating process time 5 ~ 20 min. As a result of the experiment, it was confirmed that the optimal condition of the structural characteristics was obtained at the plating bath temperature of $60^{\circ}C$, 15 mA, and the process time of 20 min. The Cu LIEP process conditions, experiments were conducted with Cu plating bath temperature $40{\sim}70^{\circ}C$, applied voltage 5 ~ 15 V, plating process time 2 ~ 15 min. As a result of the experiment, it was confirmed that the optimum conditions were obtained as a result of electrical and structural characteristics at the plating bath temperature of $60^{\circ}C$ and applied current of 15 V and process time of 15 min. In order to form Ni silicide, the firing process time was fixed to 2 min and the temperature was changed to $310^{\circ}C$, $330^{\circ}C$, $350^{\circ}C$, and post contact annealing was performed. As a result, the lowest contact resistance value of $2.76{\Omega}$ was obtained at the firing temperature of $310^{\circ}C$. The contact resistivity of $1.07m{\Omega}cm^2$ can be calculated from the conditionally optimized sample. With the plating method using Ni / Cu, the efficiency of the solar cell can be expected to increase due to the increase of the electric conductivity and the decrease of the resistance component in the production of the solar cell, and the application to the thin wafer can be expected.

Conservation of Chungmugong's Artifacts (보물 제326호 이충무공유물의 과학적 보존)

  • Kwon, Hyuk Nam;Seo, Jung Eun;Ha, Eun Ha;Lee, Han Hyoung;Lee, Eun Woo
    • Korean Journal of Heritage: History & Science
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    • v.44 no.3
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    • pp.62-77
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    • 2011
  • Yi Sunsin's artifacts had been exhibited at Hyeonchungsa in Asan-si, Chungchungnam-do. These artifacts include Janggeom(Long swords), Okno(Jade ornament of Korea traditional hat), Yodae(Waist belt) and Dobae(Peach shaped wine cups) Gudae(Yodae's saucers). These were covered with dust and corroded due to long term display. Condition of these artifacts was examined for a re-opening of Yi Chungmugong Memorial Pavilion on 28 March 2011. Before conservation treatment of the artifacts, scientific analysis was conducted to identify the material of the artifacts. The result showed that the red paint on the hilt of the sword is composed of two layers. Pigments of two layers were found to be hematite and cinnabar mixed with red lead respectively. Mixed layer was assumed to have been applied recently. Also it was found that the blade of the sword was repainted using chrome yellow($PbCrO_4$). Considering the time limit, conservation treatment focused on stabilization of damaged area and prevention of futher risk during display.

Manufacturing technology and restoration of gilt-bronze shoes from the ancient tombs in Jeongchon Village, Bogam-ri in Naju (나주 복암리 정촌고분 출토 금동신발의 제작기술과 복원)

  • Lee, Hyun-sang;Lee, Hye-Youn;Oh, Dong-sun;Kang, Min-jeong
    • Korean Journal of Heritage: History & Science
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    • v.51 no.2
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    • pp.92-107
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    • 2018
  • In 2013~2016, gilt-bronze shoes were excavated from the ancient tombs in Jeongchon Village located at Bogam-ri, Dasi-myeon in Naju. They are estimated to have been made in the late 5th or early 6th centuries. The gilt-bronze shoes are significant in that they serve to explicate the relationship between the center of Baekje and the local forces in the Yeongsan River Basin. This study's specific focus was the gilt-bronze shoes from the ancient tombs in Jeongchon Village. Based on the findings, a restoration drawing was designed and restored products were manufactured by considering metalwork techniques used to manufacture the original ones. At first, manufacturing techniques were tested by using a scientific analysis and visual observation. The manufacturing method, structures, and patterns of the gilt-bronze shoes were closely examined. Then, a design drawing of gilt-bronze shoes was created through field measurement and they were recreated on the basis of the analysis. The original form of the restored products were manufactured through cutting out the outward form, bore carving, engraving, molding, plating, and an assembly process. In the restoration process, this study examined the formal characteristics of gilt-bronze shoes, manufacturing techniques, and archetypes during Baekje's late Hanseong era. Products restored from this study are expected to be used as achievements for more easily understanding the culture of Baekje.

Comparison of Thermal Energy Harvesting Characteristics of Thermoelectric Thin-Film Modules with Different Thin-Film Leg Diameters (박막레그 직경에 따른 열전박막모듈의 열에너지 하비스팅 특성 비교)

  • Kim, Woo-Jun;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.67-74
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    • 2018
  • Thermoelectric thin film modules were fabricated by electroplating p-type $Sb_2Te_3$and n-type $Bi_2Te_3$ thin film legs with the same thickness of $20{\mu}m$ and different diameters of $100{\mu}m$, $300{\mu}m$, and $500{\mu}m$, respectively. The output voltage and output power of thin film modules were measured and compared as a function of the leg diameter. The modules processed with thin film legs of $100{\mu}m$, $300{\mu}m$, and $500{\mu}m$-diameter exhibited open circuit voltages of 365 mV at ${\Delta}T=36.7K$, 142 mV at ${\Delta}T=37.5K$, and 53 mV at ${\Delta}T=36.1K$, respectively. Maximum output powers of $845{\mu}W$ at ${\Delta}T=36.7K$, $631{\mu}W$ at ${\Delta}T=37.5K$, and $276{\mu}W$ at ${\Delta}T=36.1K$ were obtained for the modules fabricated with the thin film legs of $100{\mu}m$, $300{\mu}m$, and $500{\mu}m$-diameter, respectively.

Conservation Treatment and Production Method on the gilt-bronze-and-silver shoes excavated from the Tomb of King Muryeong (무령왕릉 출토 금동은제식리 보존처리 및 제작기법)

  • Jang, Subi;Choi, Deoksoon;Kim, Seonggon;Gwak, Hongin
    • Conservation Science in Museum
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    • v.26
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    • pp.119-142
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    • 2021
  • The gilt-bronze-and-silver shoes, excavated from the Tomb of King Muryeong, revealed many defective parts, which constantly raised in-depth re-investigation and reporting. In that point, scientific treatment and analysis were conducted to investigate the manufacturing techniques applied. The conservation treatment was carried out with an emphasis on the restoration of the original form and joining parts. As a result, the upper part of the right shoe and some part of the back heel were joined, confirming the joining method and the number of rivet used for instep bonding. From the component analysis, it is presumed that the outer plate was gilded with mercury amalgam on pure copper, and pure silver was used for the inner plate. The main pattern of the gilt-bronze-and-silver shoes includes designs of phoenix, lotus, and six-petal flower, while the lotus pattern is high in terms of ratio. Thus, youngnaksa(twisted gilt-bronze thread), geumdongsa(gilt-bronze thread), wondujeong (rivet), and samyeonjeong(quadrangular cleats) were used for bonding each plate. Twisted gilt-bronze thread was used to join the inner and outer plates, while the center and rear of the inner plate were combined with only gilt-bronze threads. From the fact, it is presumed that the joining method was different whether the function was decoration or just bonding. Regarding the manufacturing process, traces of burnishing were confirmed on the outer surface of the gilt-bronze and silver shoes, but no burnishing traces were identified on the inner surface of the silver plate, which is likely to prove more importance put on the finishing of the outer plates rather than that of the inner.

Study on the Production Methods and Conservation Treatment of the Gold Earrings Excavated from the Ancient Tombs in Seokchon-dong in Seoul (석촌동 고분군 출토 금제이식의 제작기법 연구 및 보존처리)

  • Kim, Yeseung;Jeong, Seri;Lee, Dahye;Jang, Minkyeong;Kim, Naeun;Yang, Seokjin
    • Conservation Science in Museum
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    • v.26
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    • pp.143-160
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    • 2021
  • The Seoul Baekje Museum has been conducting excavations at the Ancient Tomb Complex in Seokchon-dong, Seoul (Historic Site No. 243), known to be tombs of the royal family and the ruling class during the Hanseong period of the Baekje Kingdom. In this study, gold earrings that were revealed during the excavation underwent scientific analysis and conservation treatment. Stereo microscopy, SEM, X-ray imaging, CT, and XRF were applied in the analysis, and the characteristics, internal structure, and composition of the earrings as well as their production method were investigated. The results confirmed that the main hoops of the gilt-bronze earrings were made of copper cores gilt using mercury amalgamation. The findings also revealed that the hexahedron in the middle pendant was made by connecting small rings using molten gold powder, and the pendant sphere at the end was formed by soldering two hemispheres. As for the two thin-hoop earrings, they showed similar surface compositions but were made using different methods, with one made from a copper core wrapped with a gold plate and the other made by bending a gold rod. The gold content varied depending on the item and the place of measurement, but overall the earrings showed a relatively high gold content of approximately 19 to 21K. The purity of the golden earrings and the sophisticated manufacturing techniques applied indicate the high status of the buried person and of the tomb complex in Seokchong-dong.

A study on the shape and decorative techniques of earpick during the Goryeo-Joseon Period (고려~조선시대 귀이개 형태와 장식기법)

  • KIM, Jihyeon
    • Korean Journal of Heritage: History & Science
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    • v.55 no.2
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    • pp.6-21
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    • 2022
  • This paper examines the material culture of the Goryeo-Joseon Period through changes in the design and crafting of the earpick. In Chapter 2, terminology regarding earpicks is presented, and the culture of using earpicks is examined through fragmentary literature of the late Joseon Dynasty. Earpicks were first a personal hygiene tool, and, secondly, they played a symbolic role as a style accessory used by men, analogous to the fan carried by women of the time. In Chapter 3, earpick form are classified by period, and characteristic decorative techniques for each form are examined. During the Goryeo Dynasty, earpicks were sanitary tools, and, according to their form, they were classified into single and complex types. From Unified Silla to Goryeo, there is an angled type of connecting rod, and in the Goryeo period, there appeared earpicks with colorful decorations on the handle, completely forged earpicks with a thin and long shape, and earpicks which were part of multitools. Common decorative techniques include line expression, gold plating, cheophomun on the background, and inlay. Earpicks of the Joseon Dynasty are classified into sanitary tools or ornaments, according to their purpose of use. Sanitary tools are divided into single type and complex type, and earpicks used as ornaments include headdress, norigae, and sunchu. For earpick accessories, headdresses and norigae were used for women, and sunchu was used for men. The decorative techniques of earpicks during the Joseon Dynasty were mainly seen in the headdress earpicks. They were decorated with various colors in the Cloisonné method or bejeweled. Research on everyday tools among crafts is lacking; greater attempts to read the flow of time and approaches to material culture through everyday tools should be made.

Fabrication of Porous Cu Layers on Cu Pillars through Formation of Brass Layers and Selective Zn Etching, and Cu-to-Cu Flip-chip Bonding (황동층의 형성과 선택적 아연 에칭을 통한 구리 필라 상 다공성 구리층의 제조와 구리-구리 플립칩 접합)

  • Wan-Geun Lee;Kwang-Seong Choi;Yong-Sung Eom;Jong-Hyun Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.4
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    • pp.98-104
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    • 2023
  • The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.