• Journal of the Korean Electrochemical Society
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• v.11 no.4
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• pp.284-288
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• 2008

Sn-thin film as high capacitive anode for thin film lithium-ion battery was prepared by organic-electrolyte electroplating using Sn(II) acetate. Electrolytic solution including $Li^+$ and $Sn^{2+}$ had 3 reduction peaks at cyclic voltammogram. Current peak at $2.0{\sim}2.5\;V$ region correspond to the electroplating of Sn on Ni substrate. This potential value is lower than 2.91 V vs. $Li^+/Li^{\circ}$, of the standard reduction potential of $Sn^{2+}$ under aqueous media. It is the result of high overpotential caused by high resistive organic electrolytic solution and low $Sn^{2+}$ concentration. Physical and electrochemical properties were evaluated using by XRD, FE-SEM, cyclic voltammogram and galvanostatic charge-discharge test. Crystallinity of electroplated Sn-anode on a Ni substrate could be increased through heat treatment at $150^{\circ}C$ for 2 h. Cyclic voltammogram shows reversible electrochemical reaction of reduction(alloying) and oxidation(de-alloying) at 0.25 V and 0.75 V, respectively. Thickness of Sn-thin film, which was calculated based on electrochemical capacity, was $7.35{\mu}m$. And reversible capacity of this cell was $400{\mu}Ah/cm^2$.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.10
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• pp.629-636
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• 2016

This study presents the development of an acid resistance velocity sensor that is used for measuring velocity inside a copper sulfate plating bath. First, researchers investigated the acid resistance coating to confirm the suitability of the anti-acid sensor in a very corrosive environment. Then, researchers applied signal processing methods to reduce noise and amplify the signal. Next, researchers applied a pressure-resistive sensor with an operation amplifier (Op Amp) and low-pass filter with high impedance to match the output voltage of a commercial flowmeter. Lastly, this study compared three low-pass filters (Bessel, Butterworth and Chebyshev) to select the appropriate signal process circuit. The results show 0.0128, 0.0023, and 5.06％ of the mean square error, respectively. The Butterworth filter yielded more precise results when compared to a commercial flowmeter. The acid resistive sensor is capable of measuring velocities ranging from 2 to 6 m/s with a 2.7％ margin of error.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.25 no.2
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• pp.42-53
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• 2020

In this study, heavy metal in road-deposited sediments (RDS) and marine sediment around Gwangyang Bay area have been investigated to assess the pollution status of metals and to understand the environmental impact of RDS as a potential source of metal pollution. Zn concentration for <63 ㎛ size fraction was the highest (2,982 mg/kg), followed by Cr, Ni, Pb, Cu, As, Cd, and Hg. Metal concentrations in RDS increased with decreasing particle size and relatively higher concentrations were observed around the metal waste and recycling facilities. For particle size in RDS smaller than 125 ㎛, EF values indicated that Zn was very high enrichment and Cr, Cd, Pb were significant enrichment. The concentrations of metals in marine sediments were mostly below the TEL value of sediment quality guidelines of Korea. However, the Zn concentrations has increased by 30~40% compared to 2010 year. The amounts of Zn, Cd and Pb in less than 125 ㎛ fraction where heavy metals can be easily transported by stormwater runoff accounted for 54% of the total RDS. The study area was greatly affected by Zn pollution due to corrosion of Zn plating materials by traffic activity as well as artificial activities related to the container logistics at Gwangyang container terminal. The fine particles of RDS are not only easily resuspended by wind and vehicle movement, but are also transported to the surrounding environments by runoff. Therefore, further research is needed on the adverse effects on the environment and ecosystem.

• Journal of Animal Environmental Science
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• v.14 no.1
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• pp.61-68
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• 2008

The roof structural model of liquid manure storage tank was designed to improve a structural safety and an ability of resistance to corrosion by the bad environmental condition with high humidity and high gas concentration. Due to corrosion of a general steel, the 5 years used materials were reduced to one-third of a new material in the result of a bending strength test. Some structural materials were tested to evaluate a strength and an anti-corrosion, and stainless steel pipe (STS439), steel angle with zinc hot dipping, rectangular steel pipe covered with FRP (Fiberglass Reinforced Plastics) resin were selected finally. A stainless steel is more expansive about $3{\sim}5$ times than general structural steel. But its durability under heavy corrosive environment is expected twice as long as general steel. The roof models were designed as closed cone type for each of the three structural materials. In the result of a FEM (Finite Element Method) structural analysis for the developed models, the safe snow depth was higher 2.3 times than a general roof structure, when elements of equal section modulus were used.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.3
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• pp.42-51
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• 1981

Boron was predeposited into p (100) Si wafer at 94$0^{\circ}C$ for 60minutes to make the back surface field. High tempreature diffusion process at 1145$^{\circ}C$ for 3 hours was immediately followed without removing boron glass to obtain high surface concentration Back boron was annealed at 110$0^{\circ}C$ for 40minutes after boron glass was removed. N+ layer was formed by predepositing with POCI3 source at 90$0^{\circ}C$ for 7~15 minutes and annealed at 80$0^{\circ}C$ for 60min1es under dry Of ambient. The triple metal layers were made by evaporating Ti, Pd, Ag in that order onto front and back of diffused wafer to form the front grid and back electrode respectively. Silver was electroplated on front and back to increase the metal thickness form 1~2$\mu$m to 3~4$\mu$m and the metal electrodes are alloyed in N2 /H2 ambient at 55$0^{\circ}C$ and followed by silicon nitride antireflection film deposition process. Under artificial illumination of 100mW/$\textrm{cm}^2$ fabricated N+PP+ cells showed typically the open circuit voltage of 0.59V and short circuit current of 103 mA with fill factor of 0.80 from the whole cell area of 3.36$\textrm{cm}^2$. These numbers can be used to get the actual total area(active area) conversion efficiency of 14.4%(16.2%) which has been improved from the provious N+P cell with 11% total area efficiency by adding P+ back.

• Clean Technology
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• v.10 no.4
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• pp.221-228
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• 2004

Ethoxylated Nonyl Phenol Series (NP-series), nonionic surfactants, were applied for forming microemulsions in supercritical $CO_2$. Measurement results of the solubility in supercritical $CO_2$ are in the following; NP-series were high soluble in carbon dioxide in spite of the fact that those were not $CO_2$-philic surfactants traditionally well known. Water in $CO_2$ microemulsions were also formed stably. A complexation of hydrophilic lengths for $CO_2$-philic parts of NP-Series surfactants was optimized by NP-4 surfactant(N=4) for forming the microemulsions through the experiments. Formation of microemulsions was confirmed by measuring the UV-Visible spectrum through a spectroscopic method and existence of water in the microemulsions was confirmed as well. In order to apply it for a metal surface treatment or electroplating, an experiment for forming acid(organic, inorganic) solution in $CO_2$ microemulsions was carried out. Ionic surfactant in the reaction to an acid solution became unstable to form microemulsions, however, nonionic surfactant was formed stably in the reaction. Results of the study will be utilized for expanding the application scope of supercritical $CO_2$ which is an environmental-friendly solvent.

• Journal of Environmental Impact Assessment
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• v.24 no.6
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• pp.549-560
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• 2015

The priorities of siting restriction was derived from quantification of environmental hazard according to industrial classification based on 'Chemical Ranking and Scoring System(CRS)' which is handling the discharge characteristics of 31 industrial classifications regulated from locating at 'Industrial Complex in Rural Area(ICRA)'. CRS that is utilizing the data of 'Pollutant Release and Transfer Registers(PRTR)' is applied to determine human health risk and ecological risk which are calculated by discharged amount and materials $LC_{50}$ according to water, soil and air media based on industrial classification. From this process, exposure assessment and toxicity assessment for integrating the adverse environmental impact and the mitigation effect of environmental risk according to the development of environmental technologies into establishing the rational landuse management method for the 31 industrial classifications regulated from locating at ICRA was analyzed. From the assessment result of the siting restriction removal at ICRA for 31 industrial classifications, based on 2012 year reference 6 industries that includes Manufacture of Guilt Coloration Surface Processing Steel Materials, Manufacture of Biological Product, Manufacture of Smelting Refining and Alloys of Copper, Dyeing and Finishing of Fibers and Yarns, Manufacture of Other Basic Iron and Steel n.e.c., Rolling Drawing and Extruding of Non-ferrous Metals n.e.c. are calculated as having relatively lower environmental hazards, thus it is judged that the siting restriction mitigation at ICRA is possible for the 6 industrial classifications that are not discharging the specific hazardous water contaminants during manufacturing process.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.80-80
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• 2010

전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.5
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• pp.481-489
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• 2010

Experiments on laminar mixed convection in a vertical pipe were performed for the Re range 1,000-3,000, the $Gr_H$ range $10^5-10^8$, the Pr range 2,000-7,000, and aspect ratio range 1-7. Using the analogy concept, heat transfer systems were simulated by mass transfer systems. A cupric acid.copper sulfate electroplating system was adopted as the mass transfer system, and the mass transfer rates were measured. The measured Nu values were far greater than those previously reported because of the large value of pr in this experiment. As the aspect ratio in this study was not sufficiently large for the flow to be fully developed, the test results were similar to those for mixed convection on a vertical plate rather than that inside a long vertical pipe. It was concluded that the behavior of laminar mixed convection of a developing flow in a vertical pipe at a low aspect ratio and low $Gr_H$ is similar to that of laminar mixed convection in the vertical plate. As the aspect ratio and $Gr_H$ increase, the laminar mixed convection phenomena becomes similar to that observed in a fully developed flow in the vertical pipe.