• 제목/요약/키워드: 다층 세라믹 팩키지

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금속/세라믹 계면 물성 분석 (Metal/ceramic Interface Mechanical Property Analysis)

  • 김송희;강형석
    • 산업기술연구
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    • 제24권A호
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    • pp.9-15
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    • 2004
  • The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

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알루미나/텅스텐 동시소성에 의한 다층 팩키지 제조시 적층조건에 따른 camber의 변화 (Changes of Camber on Lamination Conditions in alumina/Tungsten Cofiring Multilayer Package)

  • 성재석;구기덕;윤종광;이상진;박정현
    • 한국세라믹학회지
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    • 제34권6호
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    • pp.601-610
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    • 1997
  • In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

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