• Journal of Welding and Joining
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• 제15권6호
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• pp.105-115
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• 1997

A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1063-1068
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• 2004

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.