• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.12
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• pp.1415-1420
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• 2014

3D printer is based on an additive manufacturing technology, which helps in creating the three-dimensional object using a 3D drawing. It is used in various fields, because it prints out a variety of three-dimensional products in a short period of time. In this paper, we consider a technique using the FDM(Fused Deposition Modeling) method by dissolving the ABS(Acrylonitrile Butadiene Styrene) resin among a diversity of printing technique and materials. This kind of the 3D printer prints out a product in high temperature and cools down it. In this process, a flection phenomenon is occurred according to the size of the printing product and the surrounding environment. Conventional methods for mitigating this phenomenon maintain the temperature at the optimum level, but they require using additional devices. In order to minimize the flection phenomenon in 3D printing products without additional devices, in this paper, we propose a noble technique, which creates holes on suitable positions when they are designed by 3D drawing tools. Also, we suggest mathematical model for the proposed method, and measure and analyse a printing output using a proposed technique.

• Progress in Superconductivity and Cryogenics
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• v.14 no.3
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• pp.1-4
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• 2012

Effects of artificial holes on the cooling efficiency of single grain YBCO bulk superconductors were studied. Single grain YBCO bulk superconductors without artificial holes, with six 2.4 mm holes and six holes filled with Bi-Pb-Cd-Sn metal solder were fabricated by a top-seeded melt growth process for powder compacts with/without holes. Simulation for the cooling rate to a liquid nitrogen temperature (77 K) of YBCO samples was carried out using a finite element method (FEM) and the results are compared with the actual cooling rates of samples in liquid nitrogen. The simulated cooling times for the YBCO sample without holes, with six holes and with six holes filled with the metal solder were 80, 47 and 75 sec. respectively, which are similar to the actual cooling times of 84, 52 and 78 sec. estimated for the same samples cooled in liquid nitrogen. The shorter cooling time of the sample with artificial holes are attributed to the increased surface areas associated with the presence of artificial holes. The metal filling into the holes did not give any remarkable effect on the cooling efficiency.